Darlington Chip CP147 Central Semiconductor Corp.
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Power Transistor
Darlington Chip
CP147
Central
Semiconductor Corp.
PROCESS DETAILS Process Size Thickness Base Bonding Area Emitter Bonding Area Side Metalization Back Side Metalization GEOMETRY GROSS INCH WAFER PRINCIPAL DEVICE TYPES MJ11012 2N6282 MJ11014 2N6283 MJ11016 2N6284 EPITAXIAL BASE MILS MILS MILS MILS Ti/Ni/Au
BACKSIDE COLLECTOR
Adams Avenue Hauppauge, 11788 Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
-August 2002)
Central
CP147
Semiconductor Corp.
Typical Electrical Characteristics
Adams Avenue Hauppauge, 11788 Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
-August 2002)
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