| The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers. |
CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER WITH FANOUT BUFFER F
Top Searches for this datasheetICS84324 CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER WITH FANOUT BUFFER FEATURES differential 3.3V LVPECL outputs Crystal oscillator interface Output frequency range: 53.125MHz 125MHz Crystal input frequency: 25MHz 25.5MHz phase jitter 106.25MHz, using 25.5MHz crystal (637KHz 10Mhz): 2.69ps Phase noise: Offset Noise Power 100Hz dBc/Hz 1KHz -115 dBc/Hz 10KHz -125 dBc/Hz 100KHz -127 dBc/Hz 3.3V supply voltage 70°C ambient operating temperature Industrial termperature information available upon request GENERAL DESCRIPTION ICS84324 Crystal-to-3.3V LVPECL Frequency Synthesizer with Fanout Buffer memHiPerClockSber HiPerClockSfamily High Performance Clock Solutions from ICS. Output frequency programmed using frequency select pins. phase noise characteristics ICS84324 make ideal clock source Fibre Channel Gigabit Ethernet applications. FUNCTION TABLE Inputs F_SEL1 F_SEL0 25.5MHz 25.5MHz 25MHz 25MHz XTAL Output Frequency F_OUT 53.125MHz 106.25MHz 62.5MHz 125MHz BLOCK DIAGRAM ASSIGNMENT VCCO F_SEL0 F_SEL1 XTAL1 XTAL2 VCCA PLL_SEL VCCO XTAL1 XTAL2 Output Divider Q0:Q5 nQ0:nQ5 Feedback Divider ICS84324 24-Lead, 300-MIL SOIC 7.5mm 15.33mm 2.3mm body package Package View F_SEL1 PLL_SEL F_SEL0 Preliminary Information presented herein represents product prototyping pre-production. noted characteristics based initial product characterization. Integrated Circuit Systems, Incorporated (ICS) reserves right change circuitry specifications without notice. 84324EM REV. SEPTEMBER 2003 ICS84324 CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER WITH FANOUT BUFFER Type Output Output Output Output Output Output Power Power Description Differential output pair. LVPECL interface levels. Differential output pair. LVPECL interface levels. Differential output pair. LVPECL interface levels. Differential output pair. LVPECL interface levels. Differential output pair. LVPECL interface levels. Differential output pair. LVPECL interface levels. Output supply pins. Core supply pin. Negative supply pins. Input Power Input Input Input Input Pullup Selects between ystal inputs input dividers. When HIGH, selects PLL. When LOW, selects XTAL1, XTAL2. LVCMOS LVTTL interface levels. Analog supply pin. ystal oscillator interface. XTAL1 input. XTAL2 output. Active High Master Reset. When logic HIGH, internal dividers reset causing true outputs inver outputs Pulldown high. When logic LOW, internal dividers outputs enabled. LVCMOS LVTTL interface levels. Pulldown Feedback frequency select pin. LVCMOS LVTTL interface levels. Pullup Output frequency select pin. LVCMOS LVTTL interface levels. TABLE DESCRIPTIONS Number Name VCCO PLL_SEL VCCA XTAL2, XTAL1 F_SEL1 F_SEL0 NOTE: Pullup Pulldown refer internal input resistors. Table Characteristics, typical values. TABLE CHARACTERISTICS Symbol RPULLUP RPULLDOWN Parameter Input Capacitance Input Pullup Resistor Input Pulldown Resistor Test Conditions Minimum Typical Maximum Units 84324EM REV. SEPTEMBER 2003 ICS84324 CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER WITH FANOUT BUFFER 4.6V -0.5V 0.5V 50mA 100mA 50°C/W lfpm) -65°C 150°C NOTE: Stresses beyond those listed under Absolute Maximum Ratings cause permanent damage device. These ratings stress specifications only. Functional operation product these conditions conditions beyond those listed Characteristics Characteristics implied. Exposure absolute maximum rating conditions extended periods affect product reliability. ABSOLUTE MAXIMUM RATINGS Supply Voltage, Inputs, Outputs, Continuous Current Surge Current Package Thermal Impedance, Storage Temperature, TSTG TABLE POWER SUPPLY CHARACTERISTICS, VCCA VCCO 3.3V±5%, 70°C Symbol VCCA ICCA Parameter Core Supply Voltage Analog Supply Voltage Power Supply Current Analog Supply Current Test Conditions Minimum 3.135 3.135 Typical Maximum 3.465 3.465 Units TABLE LVCMOS LVTTL CHARACTERISTICS, VCCA VCCO 3.3V±5%, 70°C Symbol Parameter Input High Voltage Input Voltage Input High Current Input Current PLL_SEL, F_SEL0, F_SEL1 PLL_SEL, F_SEL0, F_SEL1 F_SEL1 PLL_SEL, F_SEL0 F_SEL1 PLL_SEL, F_SEL0 Test Conditions Minimum -0.3 3.465V 3.465V 3.465V, 3.465V, -150 Typical Maximum Units TABLE LVPECL CHARACTERISTICS, VCCA VCCO 3.3V±5%, 70°C Symbol VSWING Parameter Output High Voltage; NOTE Output Voltage; NOTE Peak-to-Peak Output Voltage Swing Test Conditions Minimum VCCO VCCO Typical Maximum VCCO VCCO Units NOTE Outputs terminated with VCCO 84324EM REV. SEPTEMBER 2003 ICS84324 CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER WITH FANOUT BUFFER Test Conditions Minimum Typical Maximum 25.5 Units TABLE CRYSTAL CHARACTERISTICS Parameter Mode Oscillation Frequency Equivalent Series Resistance (ESR) Shunt Capacitance Fundamental TABLE CHARACTERISTICS, VCCA VCCO 3.3V±5%, 70°C Symbol Parameter FOUT Output Frequency Output Skew; NOTE Output Rise Time Output Fall Time Output Duty Cycle Output Pulse Width tPERIOD/2 tPERIOD/2 Test Conditions Minimum 53.125 Typical Maximum Units tsk(o) Lock Time tLOCK Parameter Measurement Information section. NOTE Defined skew between outputs same supply voltage with equal load conditions. Measured VCCO/2. NOTE This parameter defined accordance with JEDEC Standard 84324EM REV. SEPTEMBER 2003 ICS84324 CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER WITH FANOUT BUFFER TYPICAL PHASE NOISE 106.25MHZ USING 25.5MHZ QUARTZ CRYSTAL Mode Jitter Source Process Result 10.000 40.000M 106.250M Start Freq. Stop Freq. Freq. carrier Noise only sec. Execute Plot Integral 2.69p -100 -110 -120 -130 -140 -150 -160 -170 -180 100k 100M 637KHz 10MHz, 2.69ps 84324EM REV. SEPTEMBER 2003 ICS84324 CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER WITH FANOUT BUFFER PARAMETER MEASUREMENT INFORMATION VCC, VCCA SCOPE LVPECL tsk(o) -1.3V 0.165 3.3V OUTPUT LOAD TEST CIRCUIT OUTPUT SKEW nQ0:nQ5 Q0:Q5 Pulse Width PERIOD Clock Outputs PERIOD OUTPUT DUTY CYCLE/PULSE WIDTH/PERIOD OUTPUT RISE/FALL TIME 84324EM REV. SEPTEMBER 2003 ICS84324 CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER WITH FANOUT BUFFER APPLICATION INFORMATION POWER SUPPLY FILTERING TECHNIQUES high speed analog circuitry, power supply pins vulnerable random noise. ICS84324 provides separate power supplies isolate high switching noise from outputs internal PLL. VCC, VCCA VCCO should individually connected power supply plane through vias, bypass capacitors should used each pin. achieve optimum jitter performance, power supply isolation required. Figure illustrates resistor along with 10µF .01µF bypass capacitor should connected each VCCA pin. 3.3V .01µF .01µF FIGURE POWER SUPPLY FILTERING TERMINATION LVPECL OUTPUTS clock layout topology shown below typical termination LVPECL outputs. different layouts mentioned recommended only guidelines. FOUT nFOUT impedance follower outputs that generate ECL/LVPECL compatible outputs. Therefore, terminating resistors current path ground) current sources must used functionality. These outputs designed drive transmission lines. Matched impedance techniques should used maximize operating frequency minimize signal distortion. Figures show different layouts which recommended only guidelines. Other suitable clock layouts exist would recommended that board designers simulate guarantee compatibility across printed circuit clock component process variations. 3.3V FOUT FOUT (VOH FIGURE LVPECL OUTPUT TERMINATION FIGURE LVPECL OUTPUT TERMINATION 84324EM REV. SEPTEMBER 2003 ICS84324 CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER WITH FANOUT BUFFER suitable most applications. Additional accuracy achieved adding small capacitors shown Figure CRYSTAL INPUT INTERFACE crystal characterized either series parallel mode operation. ICS84324 built-in crystal oscillator circuit. This interface accept either series parallel crystal without additional components generate frequencies with accuracy 18pF 25MHz 22pF XTAL2 XTAL1 ICS84324 Figure CRYSTAL INPUt INTERFACE SCHEMATIC EXAMPLE Figure shows schematic example using ICS84324. this example, input 25MHz parallel resonant crystal with load capacitor CL=18pF. frequency fine tuning capacitors 22pF 18pF respectively. This example also shows logic control input handling. configuration F_SEL[1:0]=11 therefore output frequency 125MHz. recommended have decouple capacitor power pin. Each decoupling capacitor should located close possible power pin. pass filter clean analog supply should also located close VCCA possible. VCCA 0.1u 25MHz,18pF F_SEL1 F_SEL0 VCCO PLL_SEL VCCA XTAL2 XTAL1 F_SEL1 F_SEL0 VCCO ICS84324 F_SEL1 F_SEL0 VCC=3.3V (U1,13) (U1,16) 0.1u (U1,24) 0.1u e.g. F_SEL[1:0]=11 0.1u Spare, Installed FIGURE ICS84324 SCHEMATIC EXAMPLE 84324EM REV. SEPTEMBER 2003 following component footprints used this layout example: resistors capacitors size 0603. ICS84324 CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER WITH FANOUT BUFFER differential output traces should have same length. Avoid sharp angles clock trace. Sharp angle turns cause characteristic impedance change transmission lines. Keep clock traces same layer. Whenever possible, avoid placing vias clock traces. Placement vias traces affect trace characteristic impedance hence degrade signal integrity. prevent cross talk, avoid routing other signal traces parallel with clock traces. running parallel traces unavoidable, allow separation least three trace widths between differential clock trace other signal trace. Make sure other signal traces routed between clock trace pair. matching termination resistors should located close receiver input pins possible. POWER GROUNDING Place decoupling capacitors C15, close possible power pins. space allows, placement decoupling capacitor component side preferred. This reduce unwanted inductance between decoupling capacitor power caused via. Maximize power ground sizes number vias capacitors. This reduce inductance between power ground planes component power ground pins. filter consisting C11, should placed close VCCA possible. CLOCK TRACES TERMINATION Poor signal integrity degrade system performance cause system failure. synchronous high-speed digital systems, clock signal less tolerant poor signal integrity than other signals. ringing rising falling edge excessive ring back cause system failure. shape trace trace delay might restricted available space board component location. While routing traces, clock signal traces should routed first should locked prior routing other signal traces. CRYSTAL crystal should located close possible pins (XTAL1) 19(XTAL2). trace length between should kept minimum avoid unwanted parasitic inductance capacitance. Other signal traces should routed near crystal traces. Signals VCCA ICS84324 Pin1 Traces FIGURE BOARD LAYOUT ICS84324 84324EM REV. SEPTEMBER 2003 ICS84324 CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER WITH FANOUT BUFFER POWER CONSIDERATIONS This section provides information power dissipation junction temperature ICS84324. Equations example calculations also provided. Power Dissipation. total power dissipation ICS84324 core power plus power dissipated load(s). following power dissipation 3.3V 3.465V, which gives worst case results. NOTE: Please refer Section details calculating power dissipated load. Power (core)MAX VCC_MAX IEE_MAX 3.465V 135mA 468mW Power (outputs)MAX 30.2mW/Loaded Output pair outputs loaded, total power 30.2mW 181mW Total Power_MAX (3.465V, with outputs switching) 468mW 181mW 649mW Junction Temperature. Junction temperature, temperature junction bond wire bond directly affects reliability device. maximum recommended junction temperature HiPerClockSdevices 125°C. equation follows: Pd_total Junction Temperature Junction-to-Ambient Thermal Resistance Pd_total Total Device Power Dissipation (example calculation section above) Ambient Temperature order calculate junction temperature, appropriate junction-to-ambient thermal resistance must used. Assuming moderate flow linear feet minute multi-layer board, appropriate value 43°C/W Table below. Therefore, ambient temperature 70°C with outputs switching 70°C 0.649W 43°C/W 98°C. This well below limit 125°C. This calculation only example. will obviously vary depending number loaded outputs, supply voltage, flow, type board (single layer multi-layer). TABLE THERMAL RESISTANCE 24-PIN SOIC, FORCED CONVECTION Velocity (Linear Feet Minute) Multi-Layer PCB, JEDEC Standard Test Boards 50°C/W 43°C/W 38°C/W NOTE: Most modern designs multi-layered boards. data second pertains most designs. 84324EM REV. SEPTEMBER 2003 Calculations Equations. purpose this section derive power dissipated into load. LVPECL output driver circuit termination shown Figure ICS84324 CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER WITH FANOUT BUFFER VCCO VOUT VCCO FIGURE LVPECL DRIVER CIRCUIT TERMINATION calculate worst case power dissipation into load, following equations which assume load, termination voltage logic high, VOUT CCO_MAX OH_MAX CCO_MAX 1.0V OH_MAX 1.0V 1.7V logic low, VOUT CCO_MAX OL_MAX CCO_MAX OL_MAX 1.7V Pd_H power dissipation when output drives high. Pd_L power dissipation when output drives low. Pd_H 2V))/R OH_MAX CCO_MAX CCO_MAX OH_MAX [(2V CCO_MAX OH_MAX ))/R CCO_MAX OH_MAX [(2V 1V)/50) 20.0mW Pd_L OL_MAX CCO_MAX 2V))/R CCO_MAX OL_MAX [(2V CCO_MAX OL_MAX ))/R CCO_MAX OL_MAX [(2V 1.7V)/50) 1.7V 10.2mW Total Power Dissipation output pair Pd_H Pd_L 30.2mW 84324EM REV. SEPTEMBER 2003 ICS84324 CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER WITH FANOUT BUFFER RELIABILITY INFORMATION TABLE JAVS. FLOW TABLE LEAD SOIC Velocity (Linear Feet Minute) Multi-Layer PCB, JEDEC Standard Test Boards 50°C/W 43°C/W 38°C/W NOTE: Most modern designs multi-layered boards. data second pertains most designs. TRANSISTOR COUNT transistor count ICS84324 3500 84324EM REV. SEPTEMBER 2003 ICS84324 CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER WITH FANOUT BUFFER LEAD SOIC PACKAGE OUTLINE SUFFIX TABLE PACKAGE DIMENSIONS SYMBOL 10.00 0.25 0.40 -0.10 2.05 0.33 0.18 15.20 7.40 1.27 BASIC 10.65 0.75 1.27 Millimeters Minimum 2.65 -2.55 0.51 0.32 15.85 7.60 Maximum Reference Document: JEDEC Publication MS-013, MO-119 84324EM REV. SEPTEMBER 2003 ICS84324 CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER WITH FANOUT BUFFER Marking ICS84324EM ICS84324EM Package Lead SOIC Lead SOIC Tape Reel Count tube 1000 Temperature 70°C 70°C TABLE ORDERING INFORMATION Part/Order Number ICS84324EM ICS84324EMT While information presented herein been checked both accuracy reliability, Integrated Circuit Systems, Incorporated (ICS) assumes responsibility either infringement patents other rights third parties, which would result from use. other circuits, patents, licenses implied. This product intended normal commercial applications. other applications such those requiring extended temperature range, high reliability, other extraordinary environmental requirements recommended without additional processing ICS. reserves right change circuitry specifications without notice. does authorize warrant product life support devices critical medical instruments. 84324EM REV. SEPTEMBER 2003 Other recent searchesTNY253 - TNY253 TNY253 Datasheet SIGC11T60NC - SIGC11T60NC SIGC11T60NC Datasheet SC-78 - SC-78 SC-78 Datasheet SC-75 - SC-75 SC-75 Datasheet SC-76 - SC-76 SC-76 Datasheet SC-70 - SC-70 SC-70 Datasheet SC-88 - SC-88 SC-88 Datasheet SC-88A - SC-88A SC-88A Datasheet SC-59 - SC-59 SC-59 Datasheet SC-74 - SC-74 SC-74 Datasheet SC-74A - SC-74A SC-74A Datasheet SC-95 - SC-95 SC-95 Datasheet SC-96 - SC-96 SC-96 Datasheet CSTCE10M0G55-R0 - CSTCE10M0G55-R0 CSTCE10M0G55-R0 Datasheet A67C - A67C A67C Datasheet
Privacy Policy | Disclaimer |