30V/8A RDS(ON)=15m(typ.) VGS=10V RDS(ON)=23m(typ.) VGS=4.5V Super High
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APM9410
30V/8A RDS(ON)=15m(typ.) VGS=10V RDS(ON)=23m(typ.) VGS=4.5V Super High Dense Cell Design Extremely RDS(ON) Reliable Rugged SO-8 Package
Description
SO-8
View
Applications
Power Management Notebook Computer Portable Equipment Battery Powered Systems.
Ordering Marking Information
9410
ange ackage
N-Channel MOSFET
ackage Tube Tape Reel
9410
9410 XXXXX
Absolute Maximum Ratings
Symbol VDSS VGSS Drain-Source Voltage Gate-Source Voltage Parameter
25°C unless otherwise noted)
Rating Unit
Maximum Drain Current Continuous Maximum Drain Current Pulsed
ANPEC reserves right make changes improve reliability manufacturability without notice, advise customers obtain latest version relevant information verify before placing orders. Copyright ANPEC Electronics Corp. Rev. Feb., 2003 www.anpec.com.tw
Surface Mounted Board, sec.
APM9410
Absolute Maximum Ratings (Cont.)
Symbol Parameter Maximum Power Dissipation TA=25°C TA=100°C TSTG Maximum Junction Temperature Storage Temperature Range Thermal Resistance Junction Ambient
25°C unless otherwise noted)
Rating Unit °C/W
Electrical Characteristics
Symbol Static BVDSS IDSS VGS(th) IGSS RDS(ON)a VSDa
25°C unless otherwise noted)
APM9410 Min. Typ. Max.
Parameter
Test Condition
Unit
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate Threshold Voltage Gate Leakage Current Drain-Source On-state Resistance Diode Forward Voltage
VGS=0V IDS=250µA VDS=24V VGS=0V VDS=24V, VGS=0V, 55°C VDS=VGS IDS=250µA VGS=±20V VDS=0V VGS=10V IDS=4A VGS=4.5V IDS=2A ISD=2A VGS=0V VDS=15V IDS= VGS=5V
±100
Dynamic Total Gate Charge td(ON) td(OFF) Ciss Coss Crss Gate-Source Charge Gate-Drain Charge Turn-on Delay Time Turn-on Rise Time Turn-off Delay Time Turn-off Fall Time Input Capacitance Output Capacitance
VDD=15V IDS=2A VGEN=10V RG=6 VGS=0V VDS=15V
1200
Reverse Transfer Capacitance Frequency=1.0MHz
Notes
Pulse test pulse width 300µs, duty cycle Guaranteed design, subject production testing
Copyright ANPEC Electronics Corp. Rev. Feb., 2003
www.anpec.com.tw
APM9410
Typical Characteristics
Output Characteristics
Transfer Characteristics
VG=4,4.5,6,8,10V
IDS-Drain Current
IDS-Drain Current
GS=3.5V
TJ=25°C
GS=3V
TJ=125°C
TJ=-55°C
VGS=2.5V
VDS-Drain-to-Source Voltage
VGS-Gate-to-Source Voltage
Threshold Voltage Junction Temperature
On-Resistance Drain Current
0.040
VGS(th)-Threshold Voltage (Normalized)
IDS=250µA
RDS(on)-On-Resistance
0.035 0.030 0.025 0.020
VGS=4.5V
VGS=10V
0.015 0.010 0.005 0.000
Tj-Junction Temperature (°C)
IDS-Drain Current
Copyright ANPEC Electronics Corp. Rev. Feb., 2003
www.anpec.com.tw
APM9410
Typical Characteristics (Cont.)
On-Resistance Gate-to-Source Voltage
0.045
On-Resistaence Junction Temperature
RDS(on)-On-Resistance
0.040 0.035 0.030 0.025 0.020 0.015 0.010 0.005 0.000
IDS=4A
RDS(on)-On-Resistance (Normalized)
GS=10V IDS=4A
Gate Voltage
Tj-Junction Temperature (°C)
Gate Charge
2000
Capacitance Characteristics
VGS-Gate-to-Source Voltage
VDS=15V IDS=10A
1000
Ciss
C-Capacitance (pF)
Coss
Crss Frequency=1MHz
QG-Total Gate Charge (nC)
VDS-Drain-to-Source Voltage
Copyright ANPEC Electronics Corp. Rev. Feb., 2003
www.anpec.com.tw
APM9410
Typical Characteristics (Cont.)
Source-Drain Diode Forward Voltage
Single Pulse Power
Rthjc °C/W
ISD-Source Current
Power
TJ=125°C
TJ=-55°C
TJ=25°C
VSD-Source Drain Voltage
Time (sec)
Normalized Transient Thermal Transient Impedence, Junction Ambient
Normalized Effective Transient Thermal Impedance
Duty Cycle=0.5
D=0.2 D=0.1
D=0.05 D=0.02 SINGLE PULSE
0.01
Duty Cycle D=t1/t2 Unit Base=RthJA=50°C/W TJM-TA=PDMZthJA Surface Mounted
Square Wave Pulse Duration (sec)
Copyright ANPEC Electronics Corp. Rev. Feb., 2003
www.anpec.com.tw
APM9410
Packaging Information
SOP-8 Reference JEDEC Registration MS-012)
Inche
0.004max.
Min.
0.015X45
Copyright ANPEC Electronics Corp. Rev. Feb., 2003
www.anpec.com.tw
APM9410
Physical Specifications
Terminal Material Lead Solderability Solder-Plated Copper (Solder Material 90/10 63/37 SnPb) Meets Specification RSI86-91, ANSI/J-STD-002 Category
Reflow Condition
(IR/Convection Reflow)
Reference JEDEC Standard J-STD-020A APRIL 1999
temperature
Peak temperature
183°C Pre-heat temperature
Time
Classification Reflow Profiles
Convection Convection Average ramp-up rate(183°C Peak) 3°C/second max. seconds Preheat temperature 25°C) seconds Temperature maintained above 183°C Time within actual peak temperature seconds Peak temperature range +5/-0°C +5/-0°C Ramp-down rate /second max. minutes max. Time 25°C peak temperature /second max.
seconds 215-219°C +5/-0°C /second max.
Package Reflow Conditions
pkg. thickness 2.5mm bgas Convection +5/-0 215-219 IR/Convection +5/-0 pkg. thickness 2.5mm pkg. volume pkg. thickness 2.5mm pkg. volume Convection +5/-0 +5/-0 IR/Convection +5/-0
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Copyright ANPEC Electronics Corp. Rev. Feb., 2003
APM9410
Reliability test program
Test item SOLDERABILITY HOLT Method MIL-STD-883D-2003 MIL-STD 883D-1005.7 JESD-22-B, A102 MIL-STD 883D-1011.9 Description 245°C,5 1000 Bias 125°C Hrs, 100% 121°C -65°C 150°C, Cycles
Carrier Tape Reel Dimensions
Application
+1.5
12.75+ 0.15
12.4
5.2±
1.75±0.1
SOP-
5.5±
1.55 +0.1 1.55+ 0.25
2.1± 0.3±0.013
Copyright ANPEC Electronics Corp. Rev. Feb., 2003
www.anpec.com.tw
APM9410
Cover Tape Dimensions
Application SOP- Carrier Width Cover Tape Width Devices Reel 2500
Customer Service
Anpec Electronics Corp. Head Office Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. 886-3-5642000 886-3-5642050 Taipei Branch 137, Lane 235, Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, 886-2-89191368 886-2-89191369
Copyright ANPEC Electronics Corp. Rev. Feb., 2003
www.anpec.com.tw
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