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M3D379 M3D461 BLF0810-90; BLF0810S-90 Base station LDMOS tra
Top Searches for this datasheetM3D379 M3D461 BLF0810-90; BLF0810S-90 Base station LDMOS transistors Preliminary specification 2002 Philips Semiconductors Preliminary specification Base station LDMOS transistors FEATURES High power gain Easy power control Excellent ruggedness Source underside eliminates isolators, reducing common mode inductance Designed broadband operation (750 GHz). APPLICATIONS Common source class-AB operation CDMA applications frequency range. BLF0810-90; BLF0810S-90 DESCRIPTION Silicon N-channel enhancement mode lateral D-MOS transistors encapsulated 2-lead flange package (BLF0810-90) with ceramic 2-lead earless package (BLF0810S-90). common source connected flange. Typical CDMA IS95 performance standard settings supply voltage ACPR <-45 ACPR <-63 1.98 PINNING SOT502B PINNING SOT502A drain gate source; connected flange DESCRIPTION drain DESCRIPTION source; connected flang handbook, halfpag view MBK394 view MBL105 Fig.1 Simplified outline SOT502A (BLF0810-90) Fig.2 Simplified outline SOT502B (BLF0810S-90) QUICK REFERENCE DATA 2-tone performance common source test circuit. MODE OPERATION Class-AB MODE OPERATION CDMA(1) Note IS95 CDMA (pilot, Paging, Sync, Trafic Codes trough ACPR ACPR 1.98 kHz. 2002 (MHz) 881.4 881.6 (MHz) 881.5 (dB) typ. 16.5 (dB) typ. typ. typ. (dBc) typ. ACPR (dB) typ. typ. Philips Semiconductors Preliminary specification Base station LDMOS transistors LIMITING VALUES accordance with Absolute Maximum Rating System (IEC 60134). SYMBOL Tstg PARAMETER drain-source voltage gate-source voltage storage temperature junction temperatur BLF0810-90; BLF0810S-90 CONDITIONS MIN. MAX. UNIT THERMAL CHARACTERISTICS SYMBOL Note Thermal resistance determined under operating conditions. CHARACTERISTICS unless otherwise specified. SYMBOL V(BR)DSS VGSth IDSS IDSX IGSS RDSon PARAMETER drain-source breakdown voltage gate-source threshold voltage drain-source leakage current on-state drain current gate leakage current forward transconductance drain-source on-state resistance CONDITIONS VGS(th) MIN. TYP. MAX. UNIT PARAMETER CONDITIONS VALUE <0.75 UNIT thermal resistance from junction case avg, note 2002 Philips Semiconductors Preliminary specification Base station LDMOS transistors APPLICATION INFORMATION performance common source-AB circuit; MODE OPERATION Class-AB MODE OPERATION CDMA(1) Note IS95 CDMA (pilot, Paging, Sync, Trafic Codes trough ACPR ACPR 1.98 kHz. Ruggedness class-AB operation (MHz) 881.4 881.6 (MHz) 881.5 (mA) (mA) BLF0810-90; BLF0810S-90 (dB) (dB) (dBc) <-30 ACPR (dB) <-46 <-63 BLF0810-90 BLF0810S-90 capable withstanding load mismatch corresponding VSWR through phases (PEP). (dB) (dBc) IDQ=400mA 450mA 500mA 600mA (PEP) (PEP) 881.4 MHz; 881.6 MHz. 881.4 MHz; 881.6 MHz. Fig.3 Power gain efficiency functions peak envelope load power, typical values. Fig.4 Intermodulation distortion function peak envelope load power, typical values. 2002 Philips Semiconductors Preliminary specification Base station LDMOS transistors BLF0810-90; BLF0810S-90 (dBc) (dBc) IDQ=600mA 400mA 450mA 500mA IDQ=600mA 500mA 450mA 400mA (PEP) (PEP) 881.4 MHz; 881.6 MHz. 881.4 MHz; 881.6 MHz. Fig.5 Intermodulation distortion function peak envelope load power, typical values. Fig.6 Intermodulation distortion function peak envelope load power, typical values. (dB) ACPR (dB) 1.98 (dBm) (dBm) 881.5 MHz; measured under CDMA conditions; test signal Standard IS-95 881.5 MHz; measured under CDMA conditions; test signal Standard IS-95 Fig.7 Power gain efficiency functions average load power, typical values. Fig.8 Intermodulation distortion function average load power, typical values. 2002 Philips Semiconductors Preliminary specification Base station LDMOS transistors BLF0810-90; BLF0810S-90 0.85 0.95 (GHz) Class-AB operation; 0.85 0.95 (GHz) Class-AB operation; Fig.9 Input impedance function frequency (series components); typical values. Fig.10 Load impedance function frequency (series components); typical values. DRAIN BLF0810-90 GATE Fig.11 Definition transistor impedance. 2002 2002 Philips Semiconductors Base station LDMOS transistors BLF0810-90; BLF0810S-90 Preliminary specification Fig.12 Circuit test circuit. 2002 Philips Semiconductors Base station LDMOS transistors Dimensions components situated side copper-clad Rogers 6006 printed-circuit board 6.15); thickness mils. other side unetched serves ground plane. BLF0810-90; BLF0810S-90 Preliminary specification Fig.13 Circuit test circuit. Philips Semiconductors Preliminary specification Base station LDMOS transistors List components COMPONENT C13, C14, C15, C16, C10, C11, L12, L15, Notes American Technical Ceramics type 100A capacitor same quality. DESCRIPTION multilayer ceramic chip capacitor; note multilayer ceramic chip capacitor; note multilayer ceramic chip capacitor; note tantalum capacitor trimmer capacitor multilayer ceramic chip capacitor potentiometer 7808 voltage regulator BLF0910-140 LDMOS transistor stripline; note stripline; note stripline; note stripline; note Ferroxcube stripline; note stripline; note stripline; note stripline; note stripline; note stripline; note stripline; note stripline; note stripline; note BLF0810-90; BLF0810S-90 VALUE DIMENSIONS mils mils mils mils mils mils mils 1724 mils 1106 mils mils 1470 mils mils mils striplines double copper-clad Rogers 6006 printed-circuit board 6.15); thickness mils. 2002 Philips Semiconductors Preliminary specification Base station LDMOS transistors PACKAGE OUTLINE BLF0810-90; BLF0810S-90 Flanged LDMOST ceramic package; mounting holes; leads SOT502A scal DIMENSIONS (millimetre dimensions derived from original inch dimensions) UNIT inches 4.72 3.99 0.186 0.157 12.83 12.57 0.15 0.08 9.50 9.30 9.53 9.25 1.14 0.89 19.94 18.92 5.33 4.32 3.38 3.12 1.70 1.45 27.94 34.16 33.91 1.345 1.335 9.91 9.65 0.390 0.380 0.25 0.01 0.51 0.02 20.02 19.96 19.61 19.66 0.788 0.786 0.772 0.774 0.505 0.006 0.495 0.003 0.374 0.375 0.366 0.364 0.045 0.785 0.035 0.745 0.210 0.133 0.170 0.123 0.067 1.100 0.057 OUTLINE VERSION SOT502A REFERENCES JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 99-10-13 99-12-28 2002 Philips Semiconductors Preliminary specification Base station LDMOS transistors PACKAGE OUTLINE BLF0810-90; BLF0810S-90 Earless flanged LDMOST ceramic package; leads SOT502B Package under development Philips Semiconductors reserves right make changes without notice. scal DIMENSIONS (millimetre dimensions derived from original inch dimensions) UNIT inches 4.72 3.99 0.186 0.157 12.83 12.57 0.15 0.08 9.50 9.30 9.53 9.25 1.14 0.89 19.94 18.92 5.33 4.32 0.210 0.170 1.70 1.45 20.70 20.45 9.91 9.65 0.25 20.02 19.96 19.61 19.66 0.788 0.786 0.772 0.774 0.505 0.006 0.495 0.003 0.374 0.375 0.366 0.364 0.045 0.785 0.035 0.745 0.067 0.815 0.057 0.805 0.390 0.010 0.380 OUTLINE VERSION SOT502B REFERENCES JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 99-12-16 99-12-28 2002 Philips Semiconductors Preliminary specification Base station LDMOS transistors DATA SHEET STATUS DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2) Development BLF0810-90; BLF0810S-90 DEFINITIONS This data sheet contains data from objective specification product development. Philips Semiconductors reserves right change specification manner without notice. This data sheet contains data from preliminary specification. Supplementary data will published later date. Philips Semiconductors reserves right change specification without notice, order improve design supply best possible product. This data sheet contains data from product specification. Philips Semiconductors reserves right make changes time order improve design, manufacturing supply. Changes will communicated according Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. Preliminary data Qualification Product data Production Notes Please consult most recently issued data sheet before initiating completing design. product status device(s) described this data sheet have changed since this data sheet published. latest information available Internet DEFINITIONS Short-form specification data short-form specification extracted from full data sheet with same type number title. detailed information relevant data sheet data handbook. Limiting values definition Limiting values given accordance with Absolute Maximum Rating System (IEC 60134). Stress above more limiting values cause permanent damage device. These stress ratings only operation device these other conditions above those given Characteristics sections specification implied. Exposure limiting values extended periods affect device reliability. Application information Applications that described herein these products illustrative purposes only. Philips Semiconductors make representation warranty that such applications will suitable specified without further testing modification. DISCLAIMERS Life support applications These products designed life support appliances, devices, systems where malfunction these products reasonably expected result personal injury. Philips Semiconductors customers using selling these products such applications their risk agree fully indemnify Philips Semiconductors damages resulting from such application. Right make changes Philips Semiconductors reserves right make changes, without notice, products, including circuits, standard cells, and/or software, described contained herein order improve design and/or performance. Philips Semiconductors assumes responsibility liability these products, conveys licence title under patent, copyright, mask work right these products, makes representations warranties that these products free from patent, copyright, mask work right infringement, unless otherwise specified. CAUTION This product supplied anti-static packing prevent damage caused electrostatic discharge during transport handling. further information, refer Philips specs.: SNW-EQ-608, SNW-FQ-302A SNW-FQ-302B. 2002 Philips Semiconductors worldwide company Contact information additional information please visit Fax: 24825 sales offices addresses send e-mail Koninklijke Philips Electronics N.V. 2001 rights reserved. Reproduction whole part prohibited without prior written consent copyright owner. SCA73 information presented this document does form part quotation contract, believed accurate reliable changed without notice. liability will accepted publisher consequence use. Publication thereof does convey imply license under patent- other industrial intellectual property rights. Printed Netherlands budgetnum/printrun/ed/pp13 Date release: 2002 Document order number: 9397 09548 Other recent searchesSN74F161A - SN74F161A SN74F161A Datasheet SG187 - SG187 SG187 Datasheet OVLJGGD8 - OVLJGGD8 OVLJGGD8 Datasheet MNLM117-E - MNLM117-E MNLM117-E Datasheet EMK105B7104MV - EMK105B7104MV EMK105B7104MV Datasheet CXD3000R - CXD3000R CXD3000R Datasheet
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