4M-BIT [512K 8/256K CMOS EPROM 256K organization(MX27C4096, JEDEC

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4M-BIT [512K 8/256K CMOS EPROM 256K organization(MX27C4096, JEDEC

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MX27C4100/27C4096
4M-BIT [512K 8/256K CMOS EPROM
256K organization(MX27C4096, JEDEC out) 512K 256K organization(MX27C4100,
compatible) +12.5V programming voltage Fast access time: 100/120/150 Totally static operation Completely compatible
Operating current: 60mA Standby current: 100uA Package type:
ceramic plastic PLCC
GENERAL DESCRIPTION
MX27C4100/4096 only, 4M-bit, ultraviolet Erasable Programmable Read Only Memory. organized 256K words bits word(MX27C4096), 512K 256K 16(MX27C4100), operates from single volt supply, static standby mode, features fast single address location programming. programming signals levels, requiring single pulse. programming outside from system, existing EPROM programmers used. MX27C4100/ 4096 supports intelligent fast programming algorithm which result programming time less than minutes. This EPROM packaged industry standard dual-in-line packages, lead SOP, lead PLCC packages.
CONFIGURATIONS
SOP/CDIP/PDIP(MX27C4100)
BYTE/VPP Q15/A-1
BLOCK DIAGRAM (MX27C4100)
BYTE/VPP
CONTROL LOGIC
OUTPUT BUFFERS
Q0~Q14 Q15/A-1
A0~A17 ADDRESS INPUTS
MX27C4100
Y-DECODER
X-DECODER
Y-SELECT
CELL MAXTRIX
P/N: PM0197
REV. 3.1, 1997
MX27C4100/27C4096
CONFIGURATIONS
PLCC(MX27C4096)
CONFIGURATIONS
CDIP/PDIP(MX27C4096)
MX27C4096
BLOCK DIAGRAM (MX27C4096)
CONTROL LOGIC OUTPUT BUFFERS
Q0~Q15
A0~A17 ADDRESS INPUTS
Y-DECODER
Y-SELECT
X-DECODER
CELL MAXTRIX
P/N: PM0197
MX27C4096
REV. 3.1, 1997
MX27C4100/27C4096
DESCRIPTION(MX27C4100)
SYMBOL A0~A17 Q0~Q14 BYTE/VPP Q15/A-1 NAME Address Input Data Input/Output Chip Enable Input Output Enable Input Word/Byte Selection/Program Supply Voltage Q15(Word mode)/LSB addr. (Byte mode) Power Supply (+5V) Ground
DESCRIPTION(MX27C4096)
SYMBOL A0~A17 Q0~Q15 NAME Address Input Data Input/Output Chip Enable Input Output Enable Input Program Supply Voltage Power Supply (+5V) Ground
TRUTH TABLE BYTE FUNCTION(MX27C4100)
BYTE MODE(BYTE GND)
Q15/A-1 input MODE selected selected Selected Q0-Q7 High High DOUT SUPPLY CURRENT Standby(ICC2) Operating(ICC1) Operating(ICC1)
WORD MODE(BYTE VCC)
NOTE Q15/A-1 High High DOUT MODE selected selected Selected Q0-Q14 High High DOUT SUPPLY CURRENT Standby(ICC2) Operating(ICC1) Operating(ICC1)
P/N: PM0197
REV. 3.1, 1997
MX27C4100/27C4096
FUNCTIONAL DESCRIPTION
ERASURE MX27C4100/4096 MX27C4100/4096 erased exposing chip ultraviolet light source. dosage seconds/cm2 required completely erase MX27C4100/4096. This dosage obtained exposure ultraviolet lamp wavelength 2537 Angstroms with intensity 12,000 uW/cm2 minutes. MX27C4100/ 4096 should directly under about inch from source filters should removed from light source prior erasure. important note that MX27C4100/4096, similar devices, will cleared bits their programmed states with light sources having wavelengths shorter than 4000 Although erasure times will much longer than that with sources 2537 nevertheless exposure fluorescent light sunlight will eventually erase MX27C4100/4096 exposure them should prevented realize maximum system reliability. used such environment, package window should covered opaque label substance. additional pulse applied maximum pulses. This process repeated while sequencing through each address device. When programming mode completed, data address verified 10%.
PROGRAM INHIBIT MODE Programming multiple MX27C4100/4096's parallel with different data also easily accomplished using Program Inhibit Mode. Except like inputs parallel MX27C4100/4096 common. low-level program pulse applied MX27C4100/4096 input with 12.5 will program MX27C4100/4096. high-level input inhibits other MX27C4100/4096s from being programmed.
PROGRAM VERIFY MODE Verification should performed programmed bits determine that they were correctly programmed. verification should performed with VIL(for MX27C4096), VIH(for MX27C4100) programming voltage.
PROGRAMMING MX27C4100/4096 When MX27C4100/4096 delivered, erased, chip bits "ONE" HIGH state. "ZEROs" loaded into MX27C4100/4096 through procedure programming. programming, data programmed applied with bits parallel data pins. must applied simultaneously before VPP, removed simultaneously after VPP. When programming MXIC EPROM, 0.1uF capacitor required across ground suppress spurious voltage transients which damage device. AUTO IDENTIFY MODE auto identify mode allows reading binary code from EPROM that will identify manufacturer device type. This mode intended programming equipment purpose automatically matching device programmed with corresponding programming algorithm. This mode functional ambient temperature range that required when programming MX27C4100/ 4096. activate this mode, programming equipment must force 12.0 address line device. identifier bytes then sequenced from device outputs toggling address line from VIH. other address lines must held during auto identify mode. Byte VIL) represents manufacturer code, byte VIH), device identifier code. MX27C4100/4096, these identifier bytes given Mode Select Table. identifiers manufacturer
FAST PROGRAMMING device fast programming mode when programming voltage 12.75V applied, with 6.25 (Algorithm shown Figure programming achieved applying single level 100us pulse input after addresses data line stable. data verified,
P/N: PM0197
REV. 3.1, 1997
MX27C4100/27C4096
device codes will possess parity, with (Q15) defined parity bit. memory power dissipation, Assurance that output contention will occur. recommended that decoded used primary device-selecting function, while made common connection devices array connected READ line from system control bus. This assures that deselected memory devices their low-power standby mode that output pins only active when data desired from particular memory device.
READ MODE MX27C4100/4096 control functions, both which must logically satisfied order obtain data outputs. Chip Enable (CE) power control should used device selection. Output Enable (OE) output control should used gate data output pins, independent device selection. Assuming that addresses stable, address access time (tACC) equal delay from output (tCE). Data available outputs after falling edge OE's, assuming that been addresses have been stable least tACC
SYSTEM CONSIDERATIONS During switch between active standby conditions, transient current peaks produced rising falling edges Chip Enable. magnitude these transient current peaks dependent output capacitance loading device. minimum, ceramic capacitor (high frequency, inherent inductance) should used each device between minimize transient effects. addition, overcome voltage drop caused inductive effects printed circuit board traces EPROM arrays, bulk electrolytic capacitor should used between each eight devices. location capacitor should close where power supply connected array.
WORD-WIDE MODE With BYTE/VPP 0.2V outputs Q0-7 present data Q0-7 outputs Q8-15 present data Q8-15, after appropriately enabled.
BYTE-WIDE MODE With BYTE/VPP 0.2V, outputs Q8-15 tristated. Q15/A-1 VIH, outputs Q0-7 present data bits Q8-15. Q15/A-1 VIL, outputs Q0-7 present data bits Q0-7.
STANDBY MODE MX27C4100/4096 CMOS standby mode which reduces maximum current placed CMOS standby when MX27C4100/4096 also TTL-standby mode which reduces maximum current placed TTL-standby when VIH. When standby mode, outputs high-impedance state, independent input.
TWO-LINE OUTPUT CONTROL FUNCTION accommodate multiple memory connections, twoline control function provided allow for:
P/N: PM0197
REV. 3.1, 1997
MX27C4100/27C4096
MODE SELECT TABLE (MX27C4096)
PINS MODE Read Output Disable Standby (TTL) Standby (CMOS) Program Program Verify Program Inhibit Manufacturer Code(3) Device Code(3) NOTES: 12.0 Either VCC±0.3V OUTPUTS DOUT High High High DOUT High 00C2H 0151H
VIL(For auto select) Programming Characteristics voltage during programming.
MODE SELECT TABLE (MX27C4100)
BYTE/ MODE Read (Word) Read (Upper Byte) Read (Lower Byte) Output Disable Standby Program Program Verify Program Inhibit Manufacturer Code(3) Device Code(3) Q15/A-1 High High High VPP(5) Q8-14 Q8-14 High High High High Q8-14 Q8-14 High Q0-7 Q0-7 Q8-15 Q0-7 High High Q0-7 Q0-7 High
NOTES: 12.0V 0.5V Either VIL(for auto select)
Programming Characteristics voltages. BYTE/VPP intended operation under Voltage conditions only. Manufacture code 00C2H Device code B800H
P/N: PM0197
REV. 3.1, 1997
MX27C4100/27C4096
FIGURE FAST PROGRAMMING FLOW CHART
START
ADDRESS FIRST LOCATION
6.25V 12.75V
PROGRAM 100us PULSE
INTERACTIVE SECTION
INCREMENT
FAIL
VERIFY BYTE
PASS INCREMENT ADDRESS LAST ADDRESS FAIL
5.25V
VERIFY SECTION
VERIFY BYTES
FAIL
DEVICE FAILED
PASS DEVICE PASSED
P/N: PM0197
REV. 3.1, 1997
MX27C4100/27C4096
SWITCHING TEST CIRCUITS
DEVICE UNDER TEST
1.8K
6.2K
DIODES IN3064 EQUIVALENT
including capacitance(30pF parts)
SWITCHING TEST WAVEFORMS
2.0V
driving levels
2.0V TEST POINTS 0.8V OUTPUT
0.8V INPUT
TESTING: driving levels 2.4V/0.4V commercial grade 3.0V/0V industrial grade. Input pulse rise fall times <10ns.
driving levels
1.5V
TEST POINTS OUTPUT
1.5V
INPUT
TESTING: (1)AC driving levels 3.0V/0V both commercial grade industrial grade. Input pulse rise fall times 10ns. (2)For MX27C4100/4096-10
P/N: PM0197
REV. 3.1, 1997
MX27C4100/27C4096
ABSOLUTE MAXIMUM RATINGS
RATING Ambient Operating Temperature Storage Temperature Applied Input Voltage Applied Output Voltage Ground Potential VALUE -40oC 85oC -65oC 125oC -0.5V 7.0V -0.5V 0.5V -0.5V 7.0V -0.5V 13.5V NOTICE: Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS cause permanent damage device. This stress rating only functional operation device these other conditions above those indicated operational sections this specification implied. Exposure absolute maximum rating conditions extended period affect reliability. NOTICE: Specifications contained within following tables subject change.
DC/AC Operating Conditions Read Operation
MX27C4100/4096 Operating Temperature Commercial Industrial Power Supply -40°C 85°C 70°C -40°C 70°C -40° 85°C
CHARACTERISTICS
SYMBOL ICC3 ICC2 ICC1 PARAMETER Output High Voltage Output Voltage Input High Voltage Input Voltage Input Leakage Current Output Leakage Current Power-Down Current Standby Current Active Current Supply Current Read -0.3 MIN. MAX. UNIT 5.5V VOUT 5.5V 0.3V VIL, f=5MHz, Iout VIL, 5.5V CONDITIONS -0.4mA 2.1mA
CAPACITANCE 25oC, (Sampled only)
SYMBOL COUT CVPP PARAMETER Input Capacitance Output Capacitance Capacitance TYP. MAX. UNIT CONDITIONS VOUT
P/N: PM0197
REV. 3.1, 1997
MX27C4100/27C4096
CHARACTERISTICS
27C4100/4096-10 SYMBOL tACC PARAMETER Address Output Delay Chip Enable Output Delay Output Enable Output Delay High Output Float, High Output Float Output Hold from Address, which ever occurred first MIN. MAX. 27C4100/4096-12 MIN. MAX. 27C4100/4096-15 MIN. MAX. UNIT CONDITIONS
CHARACTERISTICS(Continued)
27C4100-10 SYMBOL tBHA tOHB tBHZ tBLZ PARAMETER BYTE Access Time BYTE Output Hold Time BYTE Output Delay Time BYTE Output Time MIN. MAX. 27C4100-12 MIN. MAX. 27C4100-15 MIN. MAX. UNIT CONDITIONS
PROGRAMMING CHARACTERISTICS 25oC
SYMBOL ICC3 IPP2 VCC1 VPP1 PARAMETER Output High Voltage Output Voltage Input High Voltage Input Voltage Input Leakage Current Auto Select Voltage Supply Current (Program Verify) Supply Current(Program) Fast Programming Supply Voltage Fast Programming Voltage 6.00 12.5 -0.3 11.5 MIN. 12.5 6.50 13.0 MAX. UNIT VIL, 5.5V CONDITIONS -0.40mA 2.1mA
PROGRAMMING CHARACTERISTICS 25oC
SYMBOL tOES tDFP tVPS tVCS PARAMETER Address Setup Time Setup Time Data Setup Time Address Hold Time Data Hold Time Output Enable Output Float Delay Setup Time Program Pulse Width Setup Time Data valid from MIN. MAX. UNIT CONDITIONS
P/N: PM0197
REV. 3.1, 1997
MX27C4100/27C4096
WEFORMS(MX27C4096)
READ CYCLE(WORD MODE)
ADDRESS INPUTS
tACC
DATA ADDRESS
DATA
VALID DATA
FAST PROGRAMMING ALGORITHM WAVEFORMS
PROGRAM
PROGRAM VERIFY
Addresses
Hi-z DATA STABLE DATA VALID
DATA
VPP1
tDFP
tVPS VCC1
tVCS
tOES
P/N: PM0197
REV. 3.1, 1997
MX27C4100/27C4096
WAVEFORMS(MX27C4100)
READ CYCLE (BYTE MODE)
HIGH-Z HIGH-Z
tACC
BYTE/VPP
Q0-Q7
VALID DATA
tBHA tOHB
VALID DATA
Q15-Q8
tBHZ tBLZ
VALID DATA
FAST PROGRAMMING ALGORITHM WAVEFORMS
PROGRAM
VERIFY
Addresses
VALID ADDRESS
DATA
VPP1
DATA
DATA VALID
tDFP
BYTE/VPP
tVPS VCC1
tVCS
tOES
P/N: PM0197
REV. 3.1, 1997
MX27C4100/27C4096
ORDERING INFORMATION
CERAMIC PACKAGE
PART ACCESS TIME (ns) MX27C4100DC-10 MX27C4100DC-12 MX27C4100DC-15 MX27C4096DC-10 MX27C4096DC-12 MX27C4096DC-15 MX27C4100DI-10 MX27C4100DI-12 MX27C4100DI-15 MX27C4096DI-10 MX27C4096DI-12 MX27C4096DI-15 OPERATING STANDBY OPERATING PACKAGE CURRENT MAX.(mA) CURRENT MAX.(uA) TEMPERATURE 70°C 70°C 70°C 70°C 70°C 70°C -40°C 85°C -40°C 85°C -40°C 85°C -40°C 85°C -40°C 85°C -40°C 85°C DIP(ROM out) DIP(ROM out) DIP(ROM out) DIP(JEDEC out) DIP(JEDEC out) DIP(JEDEC out) DIP(ROM out) DIP(ROM out) DIP(ROM out) DIP(JEDEC out) DIP(JEDEC out) DIP(JEDEC out)
PLASTIC PACKAGE
PART ACCESS TIME OPERATING (ns) MX27C4100PC-10 MX27C4100PC-12 MX27C4100PC-15 MX27C4100MC-10 MX27C4100MC-12 MX27C4100MC-15 MX27C4096PC-10 MX27C4096PC-12 MX27C4096PC-15 MX27C4096QC-10 MX27C4096QC-12 MX27C4096QC-15 MX27C4100PI-10 MX27C4100PI-12 MX27C4100PI-15 MX27C4100MI-10 MX27C4100MI-12 MX27C4100MI-15 MX27C4096PI-10 MX27C4096PI-12 MX27C4096PI-15 MX27C4096QI-10 MX27C4096QI-12 MX27C4096QI-15 STANDBY OPERATING PACKAGE TEMPERATURE CURRENT MAX.(mA) CURRENT MAX.(uA) 70°C 70°C 70°C 70°C 70°C 70°C 70°C 70°C 70°C 70°C 70°C 70°C -40°C 85°C -40°C 85°C -40°C 85°C -40°C 85°C -40°C 85°C -40°C 85°C -40° 85°C -40°C 85°C -40°C 85°C -40°C 85°C -40°C 85°C -40°C 85°C
DIP(ROM out) DIP(ROM out) DIP(ROM out) SOP(ROM out) SOP(ROM out) SOP(ROM out) DIP(JEDEC out) DIP(JEDEC out) DIP(JEDEC out) PLCC PLCC PLCC DIP(ROM out) DIP(ROM out) DIP(ROM out) SOP(ROM out) SOP(ROM out) SOP(ROM out) DIP(JEDEC out) DIP(JEDEC out) DIP(JEDEC out) PLCC PLCC PLCC
P/N: PM0197
REV. 3.1, 1997
MX27C4100/27C4096
PACKAGE INFORMATION
40-PIN CERDIP(MSI) WITH WINDOW(600 mil)
ITEM
NOTE:
MILLIMETERS 53.34 max. 1.85 2.54 [TP] .46± 48.22 1.40± 3.43 ±.38 .94± 5.00 15.494 .127
INCHES 2.100 max. .073± .012 .100 [TP] .018 .002 1.900 .055 .005 .135 .015 .037 .016 .197 .610±.005
14.6558 .0254 .577± .001 0~15° 10.668 8.128 .010 .005 0~15° .320
Each lead centerline located within mm[.01 inch] true position [TP] maximum material condition.
40-PIN PLASTIC DIP(600 mil)
ITEM
NOTE:
MILLIMETERS 52.54 max. 2.03 [REF] 2.54 [TP] [Typ.] 48.22 1.52 [Typ.] 3.30 [REF] 3.94 5.33 max. 15.22 13.97 ±.25 [Typ.]
INCHES 2.070 max. .080 [REF] .100 [TP] .018 [Typ.] 1.900 .060 [Typ.] .130 .010 .020 [REF] .155 .010 .210 max. .600 .010 .550 .010 .010 [Typ.]
Each lead centerline located within mm[.01 inch] true position [TP] maximum material condition.
P/N: PM0197
REV. 3.1, 1997
MX27C4100/27C4096
PACKAGE INFORMATION
44-PIN PLASTIC LEADED CHIP CARRIER(PLCC)
ITEM
MILLIMETERS 17.53 16.59 ±.12 16.59 ±.12 17.53 ±.12 1.95 4.70 max. 2.55 ±.25 min. 1.27 [Typ.] 15.50 ±.51 [Typ.]
INCHES .690 .005 .653 .005 .653 .005 .690 .005 .077 .185 .100 .010 .020 min. .050 [Typ.] .028 .004 .018 .004 .610 ±.020 .025 .010 [Typ.]
40-PIN PLASTIC SOP(450 mil)
ITEM
NOTE:
MILLIMETERS 26.06 ±.13 1.00 [REF] 1.27 [TP] [Typ.] .102 min. max. 2.695 14.125 11.303 .203[Typ.] .785 ±.21
INCHES 1.026 ±.005 .038 [REF] .050 [TP] .016 [Typ.] .004 min. .118 max. .106 .005 .556 .010 .445 .005 .008 [Typ.] .031 ±.008
Each lead centerline located within mm[.01 inch] true position [TP] maximum material condition.
P/N: PM0197
REV. 3.1, 1997
MX27C4100/27C4096
Revision History
Revision Description Eliminate Interactive Programming Mode 40-CDIP package quartz lens, change square shape. IPP1 100uA 10uA Date 6/13/1997 7/17/1997
P/N: PM0197
REV. 3.1, 1997
MX27C4100/27C4096
MACRONIX INTERNATIONAL CO., LTD.
HEADQUARTERS:
TEL:+886-3-578-8888 FAX:+886-3-578-8887
EUROPE OFFICE:
TEL:+32-2-456-8020 FAX:+32-2-456-8021
JAPAN OFFICE:
TEL:+81-44-246-9100 FAX:+81-44-246-9105
SINGAPORE OFFICE:
TEL:+65-747-2309 FAX:+65-748-4090
TAIPEI OFFICE:
TEL:+886-3-509-3300 FAX:+886-3-509-2200
MACRONIX AMERICA, INC.
TEL:+1-408-453-8088 FAX:+1-408-453-8488
CHICAGO OFFICE:
TEL:+1-847-963-1900 FAX:+1-847-963-1909
http //www.macronix.com
MACRONIX INTERNATIONAL CO., LTD. reserves rignt change product specifications without notice.

4M-BIT [512K 8/256K CMOS EPROM 256K organization(MX27C4096, JEDEC

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