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Data Sheet SWITCHMODEPower
Designer's
Rectifier
MBRB2515L
Motorola Preferred Device
OR'ing Function Diode
D2PAK Surface Mount Power Package
D2PAK Power Rectifier employs Schottky Barrier principle large metal-to-silicon power diode. State-of-the-art geometry features epitaxial construction with oxide passivation metal overlay contact. Ideally suited voltage, high frequency switching power supplies, free wheeling diodes, polarity protection diodes. These state-of-the-art devices have following features: Guardring Stress Protection Forward Voltage 100°C Operating Junction Temperature Epoxy Meets UL94, Guaranteed Reverse Avalanche Short Heat Sink Manufactured Sheared! Similar Size Industry Standard TO-220 Package Mechanical Characteristics Case: Epoxy, Molded Weight: grams (approximately) Finish: External Surfaces Corrosion Resistant Terminal Leads Readily Solderable Lead Mounting Surface Temperature Soldering Purposes: 260°C Max. Seconds Shipped units plastic tube Available Tape Reel, units reel adding "T4" suffix part number Marking: B2515L MAXIMUM RATINGS
Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage Blocking Voltage Average Rectified Forward Current (Rated 90°C Peak Repetitive Forward Current (Rated Square Wave, kHz) 100°C Nonrepetitive Peak Surge Current (Surge applied rated load conditions halfwave, single phase, Storage Temperature Operating Junction Temperature Voltage Rate Change (Rated Symbol VRRM VRWM IF(AV) IFRM IFSM Tstg dv/dt
SCHOTTKY BARRIER RECTIFIER AMPERES VOLTS
CASE 418B-02 D2PAK
Value
Unit Volts
+150 10000
Amps Amps Amps V/µs
THERMAL CHARACTERISTICS
Thermal Resistance Junction Case Junction Ambient When mounted using minimum recommended size FR-4 board.
Designer's Data "Worst Case" Conditions Designer's Data Sheet permits design most circuits entirely from information presented. Limit curves representing boundaries device characteristics given facilitate "worst case" design.
°C/W
Designer's SWITCHMODE trademarks Motorola, Inc. Thermal Clad trademark Bergquist Company
Preferred devices Motorola recommended choices future best overall value.
©RectifierInc. 1996 Data Motorola, Device
MBRB2515L
ELECTRICAL CHARACTERISTICS
Rating Maximum Instantaneous Forward Voltage Amps, 70°C) Amps, 70°C) Amps, 25°C) Maximum Instantaneous Reverse Current (Rated Voltage, 70°C) (Rated Voltage, 25°C) Pulse Test: Pulse Width Duty Cycle 2.0% Symbol 0.28 0.42 0.45 Value Unit Volts
INSTANTANEOUS FORWARD CURRENT (AMPS)
INSTANTANEOUS VOLTAGE (VOLTS) REVERSE LEAKAGE CURRENT (mA) 70°C 25°C
1000 0.04 0.02 0.01 REVERSE VOLTAGE (VOLTS) 100°C 70°C
25°C
Figure Typical Forward Voltage
PF(AV) AVERAGE FORWARD POWER DISSIPATION (WATTS)
Figure Typical Reverse Leakage Current
70°C
SQUARE WAVE
F(AV) AVERAGE FORWARD CURRENT (AMPS)
CASE TEMPERATURE (°C) SQUARE WAVE RATED VOLTAGE APPLIED RqJC 1°C/W
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
Figure Typical Forward Power Dissipation
Figure Current Derating, Case
Rectifier Device Data
MBRB2515L
INFORMATION USING D2PAK SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINTS SURFACE MOUNTED APPLICATIONS
Surface mount board layout critical portion total design. footprint semiconductor packages must correct size insure proper solder connection interface
0.70 17.78
between board package. With correct geometry, packages will self align when subjected solder reflow process.
0.0625 1.587 0.450 11.43 0.08 2.032 0.15 3.81
inches
0.350 8.89
D2PAK POWER DISSIPATION
power dissipation D2PAK function drain size. This vary from minimum size soldering size given maximum power dissipation. Power dissipation surface mount device determined TJ(max), maximum rated junction temperature die, RJA, thermal resistance from device junction ambient; operating temperature, Using values provided data sheet D2PAK package, calculated follows: TJ(max) equation ambient temperature 25°C, calculate power dissipation device which this case watts. 150°C 25°C watts 50°C/W
values equation found maximum ratings table data sheet. Substituting these values into
50°C/W D2PAK package assumes recommended drain area 158K mil2 FR-4 glass epoxy printed circuit board achieve power dissipation watts using footprint shown. Another alternative ceramic substrate aluminum core board such Thermal CladTM. using aluminum core board material such Thermal Clad, power dissipation doubled using same footprint.
GENERAL SOLDERING PRECAUTIONS
melting temperature solder higher than rated temperature device. When entire device heated high temperature, failure complete soldering within short time could result device failure. Therefore, following items should always observed order minimize thermal stress which devices subjected. Always preheat device. delta temperature between preheat soldering should 100°C less.* When preheating soldering, temperature leads case must exceed maximum temperature ratings shown data sheet. When using infrared heating with reflow soldering method, difference shall maximum 10°C. soldering temperature time shall exceed 260°C more than seconds.
When shifting from preheating soldering, maximum After soldering been completed, device should
allowed cool naturally least three minutes. Gradual cooling should used forced cooling will increase temperature gradient result latent failure mechanical stress. Mechanical stress shock should applied during cooling Soldering device without preheating cause excessive thermal shock stress which result damage device. shadowing inability wave height incorporate other surface mount components, D2PAK recommended wave soldering. temperature gradient shall less.
Rectifier Device Data
MBRB2515L
RECOMMENDED PROFILE REFLOW SOLDERING
given circuit board, there will group control settings that will give desired heat pattern. operator must temperatures several heating zones, figure belt speed. Taken together, these control settings make heating "profile" that particular circuit board. machines controlled computer, computer remembers these profiles from operating session next. Figure shows typical heating profile when soldering D2PAK printed circuit board. This profile will vary among soldering systems good starting point. Factors that affect profile include type soldering system use, density types components board, type solder used, type board substrate material being used. This profile shows temperature versus time. line graph shows actual temperature that might experienced surface test board near central solder joint. profiles based high density density board. Vitronics SMD310 convection/infrared reflow soldering system used generate this profile. type solder used 62/36/2 Lead Silver with melting point between -189°C. When this type furnace used solder reflow work, circuit boards solder joints tend heat first. components board then heated conduction. circuit board, because large surface area, absorbs thermal energy more efficiently, then distributes this energy components. Because this effect, main body component degrees cooler than adjacent solder joints.
STEP PREHEAT ZONE "RAMP"
STEP STEP VENT HEATING "SOAK" ZONES "RAMP"
STEP HEATING ZONES "SOAK"
STEP HEATING ZONES "SPIKE"
STEP VENT
STEP COOLING
200°C DESIRED CURVE HIGH MASS ASSEMBLIES 150°C 150°C 160°C
170°C
205° 219°C PEAK SOLDER JOINT
100°C 100°C
140°C
SOLDER LIQUID SECONDS (DEPENDING MASS ASSEMBLY)
DESIRED CURVE MASS ASSEMBLIES 50°C
TIME MINUTES TOTAL)
TMAX
Figure Typical Solder Heating Profile D2PAK
Rectifier Device Data
MBRB2515L
PACKAGE DIMENSIONS
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. INCHES 0.340 0.380 0.380 0.405 0.160 0.190 0.020 0.035 0.045 0.055 0.100 0.080 0.110 0.018 0.025 0.090 0.110 0.575 0.625 0.045 0.055 MILLIMETERS 8.64 9.65 9.65 10.29 4.06 4.83 0.51 0.89 1.14 1.40 2.54 2.03 2.79 0.46 0.64 2.29 2.79 14.60 15.88 1.14 1.40
SEATING PLANE
0.13 (0.005)
CASE 418B-02 ISSUE
STYLE
ANODE CATHODE ANODE CATHODE
Rectifier Device Data
MBRB2515L
Motorola reserves right make changes without further notice products herein. Motorola makes warranty, representation guarantee regarding suitability products particular purpose, does Motorola assume liability arising application product circuit, specifically disclaims liability, including without limitation consequential incidental damages. "Typical" parameters which provided Motorola data sheets and/or specifications vary different applications actual performance vary over time. operating parameters, including "Typicals" must validated each customer application customer's technical experts. Motorola does convey license under patent rights rights others. Motorola products designed, intended, authorized components systems intended surgical implant into body, other applications intended support sustain life, other application which failure Motorola product could create situation where personal injury death occur. Should Buyer purchase Motorola products such unintended unauthorized application, Buyer shall indemnify hold Motorola officers, employees, subsidiaries, affiliates, distributors harmless against claims, costs, damages, expenses, reasonable attorney fees arising directly indirectly, claim personal injury death associated with such unintended unauthorized use, even such claim alleges that Motorola negligent regarding design manufacture part. Motorola registered trademarks Motorola, Inc. Motorola, Inc. Equal Opportunity/Affirmative Action Employer. Mfax trademark Motorola, Inc. reach EUROPE Locations Listed: Motorola Literature Distribution; P.O. 5405, Denver, Colorado 80217. 303-675-2140 1-800-441-2447 JAPAN: Nippon Motorola Ltd.: SPD, Strategic Planning Office, 4-32-1, Nishi-Gotanda, Shinagawa-ku, Tokyo 141, Japan. 81-3-5487-8488
MfaxTM: RMFAX0@email.sps.mot.com TOUCHTONE 602-244-6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Ping Industrial Park, Canada ONLY 1-800-774-1848 Ting Road, N.T., Hong Kong. 852-26629298 INTERNET: http://motorola.com/sps
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Rectifier Device Data MBRB2515L/D

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