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Mounting Instructions Power Modules Pierre-Laurent Doumergue Engi
Top Searches for this datasheetApplication note APT0601 April 2006 Mounting Instructions Power Modules Pierre-Laurent Doumergue Engineer Advanced Power Technology Europe Chemin Magret 33700 France Introduction: This application note gives main recommendations appropriately connect power module onto heat sink, (Printed Circuit Board), bars wires power module. very important follow mounting instructions limit both thermal mechanical stresses. Power module mounting onto heat sink. Proper mounting module base plate onto heat sink essential guarantee good heat transfer. heat sink power module contact surface must flat (recommended flatness <50µm 100mm continuous, recommended roughness clean dirt, corrosion, damage) order avoid mechanical stress when power module mounted, avoid increase thermal resistance. Thermal grease application achieve lowest case heat sink thermal resistance, thin layer thermal grease must applied between power module heat sink. grease applied onto module base plate, minimum thickness 100µm (3.9 mils) grease should applied with roller spatula. grease applied onto heat sink, recommended screen printing technique ensure uniform deposition minimum thickness 100µm (3.9 mils). case, module bottom surface must completely with thermal grease. wetted Mounting power module onto heat sink. Place power module above heat sink holes, apply small pressure Insert screw with lock flat washers each mounting hole screw used instead M6). screw length must least (0.6"). First lightly tighten four mounting screws. Tighten alternatively screws until their final torque value reached (between N.m, 2.21 3.69 recommended screwdriver with controlled torque this operation. possible, screws tightened again after three hours. quantity thermal grease correct when small amount grease appears around power module once bolted down onto heat sink with appropriate mounting torque (see figure screws tightened with mounting torque N.m, 2.95 Figure shows thermal grease module base plate when removed from heat sink. Screws tightened with mounting torque N.m. website http://www.advancedpower.com Application note APT0601 April 2006 washers screws washers screws Heat sink Thermal grease flows when screws tightened Proper application thermal grease power module. base plate with properly applied thermal grease after removal from heat sink. website http://www.advancedpower.com Application note APT0601 April 2006 Electrical connections. Assembly with power signal connections. First, must mounted onto power module screwed onto power terminals. screw with flat washer each power terminals. screw length depends thickness washers. careful, maximum length into power terminal 7.8mm (0.307") figure mounting torque must between (1.47 2.58 second step consists soldering signal terminals power module PCB. Manual soldering process recommended solder signal terminals PCB. No-clean solder flux required attach onto module since aqueous module cleaning allowed. reverse these steps, because signal terminals soldered first PCB, screwing onto power terminals will create deformation PCB, leading some mechanical stress that damage tracks break components PCB. large used, additional spacers between heat sink necessary. recommended keep distance least between connection power module spacers (see spacers must have same height power connectors (17±0.5 mm). Note: reduce switching over voltages, decoupling capacitors must placed close possible power terminals VBUS 0/VBUS. (See figure Spacer 17±0.5 POWER MODULE Spacer Heat sink power signal terminals with spacers large PCB. website http://www.advancedpower.com Application note APT0601 April 2006 Assembly with bars power connections signal connections. bars must mounted onto power module screwed onto power terminals. screw with flat washer each power terminals. screw length depends thickness washers. careful, maximum length into power terminal 7.8mm (0.307") figure mounting torque must between (1.47 2.58 must soldered signal terminals power module. Manual soldering process recommended solder signal terminals PCB. No-clean solder flux required attach onto module since aqueous module cleaning allowed. recommended spacers avoid deformation avoid some mechanical stress components, tracks signal terminals. spacers must have same height power connectors (17±0.5mm). long bars used, additional spacers between bars heat sink necessary. recommended keep distance least between connection power module spacers (see Note: reduce switching over voltages, decoupling capacitors must placed close possible power terminals VBUS 0/VBUS. (See figure bars Spacer 17±0.5 POWER MODULE Spacer Heat sink signal terminals bars power terminals with spacers. website http://www.advancedpower.com Application note APT0601 April 2006 Assembly with bars power connections wires signal connections. bars must mounted onto power module screwed onto power terminals. screw with flat washer each power terminals. screw length depends thickness washers. careful, maximum length into power terminal 7.8mm (0.307") figure mounting torque must between (1.47 2.58 long bars used, additional spacers between bars heat sink necessary. recommended keep distance least between connection power module spacers (see Wires should plugged onto signal terminals soldered wires directly soldered, manual soldering process recommended solder signal terminals PCB. No-clean solder flux required attach onto module since aqueous module cleaning allowed. Note: reduce switching over voltages, decoupling capacitors must placed close possible power terminals VBUS 0/VBUS. (See figure bars POWER MODULE 17±0.5mm Spacer Heat sink Wires signal terminals bars power terminals with spacers. website http://www.advancedpower.com Application note APT0601 April 2006 Holes diameters power terminal view. VBUS 0/VBUS Heat sink window 3.5±0.1*1±0.1 (4x) window 5±0.1*2.5±0.1 (4x) Hole 13±0.1 (4x) Decoupling capacitors Hole 6±0.1 (3x) 12±0.1 (3x) Bottom 15±0.1*13±0.1 (3x) hole diameters millimeters). Example specification: Material Epoxy Type double side Metallized holes Plating: tinning gold Conductor layers thickness accordance with current capability. pinout change according configuration (full bridge, asymmetrical bridge.). Each module datasheet specific hole location information. Note: Holes necessary insert tighten mounting screws that attach power module heat sink. website http://www.advancedpower.com Application note APT0601 April 2006 These access holes must large enough screw head washer pass through freely, allowing normal tolerance hole location. Connection pull forces. Power modules must mounted such that resulting pull forces limited 200N (44.96lbf) power terminals limited (11.24lbf) signals terminals. This acceptable maximum value pull force vary depending mounting operating conditions. 200N 200N 200N Conclusion: This application note gives main recommendations regarding mounting modules. Applying these instructions will help decreasing mechanical stress both PCB, bars wires power module therefore will ensure long term operation system. Mounting instructions heat sink must also followed achieve lowest thermal resistance from power chips down cooler. these operations essential guarantee best system reliability achieve highest possible MTBF (Mean Time Between Failure). POWER MODULE pull force Connection push forces. Power modules must mounted such that resulting push forces limited 150N (33.72lbf) power terminals limited (11.24lbf) signals terminals. This acceptable maximum value push force vary depending mounting operating conditions. 150N 150N 150N POWER MODULE push force website http://www.advancedpower.com Other recent searchesZXMN6A09DN8 - ZXMN6A09DN8 ZXMN6A09DN8 Datasheet VDZ3 - VDZ3 VDZ3 Datasheet SUD40N08-16 - SUD40N08-16 SUD40N08-16 Datasheet SRR7032 - SRR7032 SRR7032 Datasheet PC-16 - PC-16 PC-16 Datasheet KID65506F - KID65506F KID65506F Datasheet AOD448 - AOD448 AOD448 Datasheet AOD448L - AOD448L AOD448L Datasheet
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