THERMALLY CONDUCTIVE ATTACH ADHESIVE DESCRIPTION ABLEBOND® 2815A

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THERMALLY CONDUCTIVE ATTACH ADHESIVE DESCRIPTION ABLEBOND® 2815A

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DEVELOPMENTAL TECHNICAL DATASHEET
THERMALLY CONDUCTIVE ATTACH ADHESIVE
DESCRIPTION ABLEBOND® 2815A attach adhesive offers high thermal conductivity minimize thermal resistance between chip substrate. This adhesive FEATURES Excellent thermal electrical conductivity Good dispensability good fillet formation Good performance Ag/Cu leadframes moisture absorption
ABLEBOND® 2815A
designed provide improved workability applications requiring high heat extraction from die.
Typical Uncured Properties Filler Type Viscosity Thixotropic Index Work Life Storage Life Cure Process Data Weight Loss Cure Recommended Cure Condition PHYSIOCHEMICAL PROPERTIES Post Cure Ionics Chloride Sodium Potassium
ABLEBOND 2815A Silver 8000 hours year ABLEBOND 2815A 6.8%
Test Description
Test Method ATM-0018 ATM-0089 ATM-0087 ATM-0068 Test Method ATM-0031 Test Method ATM-0007 ATM-0044 ATM-0002 ATM-0058 ATM-0055
Brookfield CP51 Viscosity 0.5/Viscosity increase viscosity
Test Description glass slide
ramp oven ABLEBOND 2815A µmhos/cm Test Description Teflon flask, sample/20-40 mesh, water, hours Conductometer meter penetration mode expansion mode
Water Extract Conductivity Glass Transition Temperature Coefficient Thermal Expansion Below Above
Typical properties intended specification limits. need write specification, Standard Release Specification. This developmental product that been converted high volume manufacturing being monitored process stability. During this monitoring period, certain properties adjusted slightly.
09/03
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2815A
PHYSIOCHEMICAL PROPERTIES Post Cure Dynamic Tensile Modulus Moisture Absorption Saturation THERMAL/ELECTRICAL PROPERTIES Post Cure Thermal Conductivity Volume Resistivity Bond Joint Resistance MECHANICAL PROPERTIES Post Cure Shear Strength Shear Strength (kgf/die) Temperature Chip Warpage Chip Size ABLEBOND 2815A Test Description Test Method
9900 (1,400,000 psi) Dynamic mechanical thermal 5700 (830,000 psi) analysis (DMTA) using <0.5mm thick 1800 (260,000 psi) sample 1600 (230,000 psi) 0.24% ABLEBOND 2815A W/mK 0.00004 ohm-cm 0.0002ohms ABLEBOND 2815A kgf/die 12.3 Chip Size 7.6x7.6mm (300 mil) 12.7x12.7mm (500x500mil) Dynamic vapor sorption after exposure Test Description Laser Flash 4-point probe Cu/Cu, bondline thickness Test Description mil) Ag/Cu leadframe (120 mil) Ag/Cu leadframe 0.38mm (15mil) thick 0.2mm thick Ag/Cu
ATM-0112
ATM-0093 Test Method ATM-0116 ATM-0020 ATM-0032 Test Method ATM-0052 ATM-0052
Warpage 37.6
ATM-0059
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2815A
APPLICATION GUIDELINES SHIPMENT This Ablestik product packed shipped Inside every shipment Ablestik's products small packet containing ABLECUBE. This small blue cube which retains shape ABLECUBE exposed temperatures higher than cube will melt. Please check state ABLECUBE ensure integrity shipment. ABLECUBE melted upon Receiving inspection, place entire shipment freezer contact your Ablestik Customer Service Sales Representative. UNPACKING Transfer syringes from freezer without delays. Freeze-thaw voids will form syringes syringes repeatedly thawed refrozen. STORAGE This Ablestik product must stored shelf life material only valid when material been stored specified storage condition. Incorrect storage conditions will degrade performance material both handling (e.g. dispensing screen printing) final cured properties. THAWING Allow container reach room temperature before use. After removing from freezer, syringes stand vertically while thawing. Refer Syringe Thaw Time chart thaw time recommendation. open container before contents reach ambient temperature. moisture that collects thawed container should removed prior opening container. re-freeze. Once thawed room temperature, adhesive should re-frozen. ADHESIVE APPLICATION Thawed adhesive should immediately placed dispense equipment use. adhesive transferred final dispensing reservoir, care must exercised avoid entrapment contaminants and/or into adhesive. Adhesive must completely used within product's recommended work life hours. Apply enough adhesive achieve 25-50 (1-2 mil) bondline thickness, dispensed with approximately filleting sides die. Alternate dispense amounts used depending application requirements. Star crossed shaped dispense patterns will yield fewer bondline voids than matrix style dispense pattern. Contact your Ablestik Technical Service Department detailed recommendation adhesive application, including dispensing. AVAILABILITY ABLEBOND® adhesives packaged syringes jars customer specification. Available package sizes range from 30cc ounce pound. details, refer Ablestik Standard Package Data contact your Customer Service Representative.
20021 Susana Road, Rancho Dominguez, 90221 (310) 764-4600 (310) 764-2545 Customer Service (310) 764-1783
information given recommendations made herein believed accurate guarantee their accuracy made. every case recommend that purchasers before using product conduct their tests determine whether product suitable their particular purposes under their operating conditions. representative ours authority waive change foregoing provisions but, subject such provisions, engineers available assist purchasers adapting products their needs. Nothing contained herein shall construed imply nonexistence relevant patents constitute permission, inducement recommendation practice invention covered patent, without authority from owner this patent. These materials designed manufactured implantation human body. Approval from such part product implanted human body been sought received. also expect purchasers products accordance with guiding principles American Chemistry Council's Responsible Care® program.
technical contact nearest you, visit www.ablestik.com
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THERMALLY CONDUCTIVE ATTACH ADHESIVE DESCRIPTION ABLEBOND® 2815A

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