State-of-the-Art EPIC-B BiCMOS Design Significantly Reduces Power Diss
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SN54ABT543A, SN74ABT543A OCTAL REGISTERED TRANSCEIVERS WITH 3-STATE OUTPUTS
State-of-the-Art EPIC-B BiCMOS Design Significantly Reduces Power Dissipation Protection Exceeds 2000 MIL-STD-883, Method 3015; Exceeds Using Machine Model Typical VOLP (Output Ground Bounce) 25°C High-Drive Outputs (-32-mA IOH, 64-mA IOL) Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Ceramic Flat Package, Plastic (NT) Ceramic (JT) DIPs
SN54ABT543A PACKAGE SN74ABT543A PACKAGE (TOP VIEW)
LEBA OEBA CEAB
CEBA LEAB OEAB
description
'ABT543A octal transceivers contain sets D-type latches temporary storage data flowing either direction. Separate latch-enable (LEAB LEBA) output-enable (OEAB OEBA) inputs provided each register permit independent control either direction data flow. A-to-B enable (CEAB) input must enter data from output data from CEAB LEAB low, A-to-B latches transparent; subsequent low-to-high transition LEAB puts latches storage mode. With CEAB OEAB both low, 3-state outputs active reflect data present output latches. Data flow from similar, requires using CEBA, LEBA, OEBA inputs. ensure high-impedance state during power power down, should tied through pullup resistor; minimum value resistor determined current-sinking capability driver. SN54ABT543A characterized operation over full military temperature range -55°C 125°C. SN74ABT543A characterized operation from -40°C 85°C.
SN54ABT543A PACKAGE (TOP VIEW)
OEBA LEBA
CEBA
internal connection
Please aware that important notice concerning availability, standard warranty, critical applications Texas Instruments semiconductor products disclaimers thereto appears this data sheet. EPIC-B trademark Texas Instruments Incorporated.
PRODUCTION DATA information current publication date. Products conform specifications terms Texas Instruments standard warranty. Production processing does necessarily include testing parameters.
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CEAB OEAB LEAB
Copyright 1997, Texas Instruments Incorporated
SN54ABT543A, SN74ABT543A OCTAL REGISTERED TRANSCEIVERS WITH 3-STATE OUTPUTS
FUNCTION TABLE INPUTS CEAB LEAB OEAB OUTPUT
A-to-B data flow shown; B-to-A flow control same except that uses CEBA, LEBA, OEBA. Output level before indicated steady-state input conditions were established
logic
OEBA CEBA LEBA OEAB CEAB LEAB 1EN3 2EN4
This symbol accordance with ANSI/IEEE 91-1984 Publication 617-12. numbers shown packages.
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SN54ABT543A, SN74ABT543A OCTAL REGISTERED TRANSCEIVERS WITH 3-STATE OUTPUTS
logic diagram (positive logic)
OEBA CEBA LEBA OEAB CEAB LEAB
Seven Other Channels numbers shown packages.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, -0.5 Input voltage range, (except ports) (see Note -0.5 Voltage range applied output high power-off state, -0.5 Current into output state, SN54ABT543A SN74ABT543A Input clamp current, Output clamp current, Package thermal impedance, (see Note package 104°C/W package 81°C/W package 67°C/W package 120°C/W Storage temperature range, Tstg -65°C 150°C
Stresses beyond those listed under "absolute maximum ratings" cause permanent damage device. These stress ratings only, functional operation device these other conditions beyond those indicated under "recommended operating conditions" implied. Exposure absolute-maximum-rated conditions extended periods affect device reliability. NOTES: input output negative-voltage ratings exceeded input output clamp-current ratings observed. package thermal impedance calculated accordance with EIA/JEDEC JESD51, except through-hole packages, which trace length zero.
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SN54ABT543A, SN74ABT543A OCTAL REGISTERED TRANSCEIVERS WITH 3-STATE OUTPUTS
recommended operating conditions (see Note
SN54ABT543A Supply voltage High-level input voltage Low-level input voltage Input voltage High-level output current Low-level output current Input transition rise fall rate Outputs enabled SN74ABT543A UNIT ns/V
Operating free-air temperature NOTE Unused pins (input I/O) must held high prevent them from floating.
electrical characteristics over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS Vhys IOZH IOZL Ioff ICEX ports Control inputs ports Outputs high Outputs high Outputs Outputs disabled -50* -100 ±100 ±100 -180* 250* 250* -200 ±100 ±100 ±100 -180 0.55 0.55* 0.55 0.55 25°C -1.2 SN54ABT543A -1.2 SN74ABT543A -1.2 UNIT
ICC# Control inputs ports
input Other inputs
products compliant MIL-PRF-38535, this parameter does apply. typical values parameters IOZH IOZL include input leakage current. This data sheet limit vary among suppliers. more than output should tested time, duration test should exceed second. This increase supply current each input that specified voltage level rather than GND.
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SN54ABT543A, SN74ABT543A OCTAL REGISTERED TRANSCEIVERS WITH 3-STATE OUTPUTS
timing requirements over recommended ranges supply voltage operating free-air temperature (unless otherwise noted) (see Figure
SN54ABT543A 25°C Pulse duration, LEAB LEBA High Data before LEAB LEBA Setup time Data before CEAB CEBA Hold time Data after LEAB LEBA Data after CEAB CEBA High UNIT
timing requirements over recommended ranges supply voltage operating free-air temperature (unless otherwise noted) (see Figure
SN74ABT543A 25°C Pulse duration, LEAB LEBA High Data before LEAB LEBA Setup time Data before CEAB CEBA Hold time Data after LEAB LEBA Data after CEAB CEBA High UNIT
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SN54ABT543A, SN74ABT543A OCTAL REGISTERED TRANSCEIVERS WITH 3-STATE OUTPUTS
switching characteristics over recommended ranges supply voltage operating free-air temperature, (unless otherwise noted) (see Figure
SN54ABT543A PARAMETER FROM (INPUT) (OUTPUT) 25°C UNIT
tPLH tPHL tPLH tPHL tPZH tPZL tPHZ tPLZ tPZH tPZL tPHZ tPLZ
LEBA LEAB OEBA OEAB OEBA OEAB CEBA CEAB CEBA CEAB
This data sheet limit vary among suppliers.
switching characteristics over recommended ranges supply voltage operating free-air temperature, (unless otherwise noted) (see Figure
SN74ABT543A PARAMETER FROM (INPUT) (OUTPUT) 25°C UNIT
tPLH tPHL tPLH tPHL tPZH tPZL tPHZ tPLZ tPZH tPZL tPHZ tPLZ
LEBA LEAB OEBA OEAB OEBA OEAB CEBA CEAB CEBA CEAB
This data sheet limit vary among suppliers.
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SN54ABT543A, SN74ABT543A OCTAL REGISTERED TRANSCEIVERS WITH 3-STATE OUTPUTS
PARAMETER MEASUREMENT INFORMATION
From Output Under Test (see Note Open TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Open
LOAD CIRCUIT Timing Input Input VOLTAGE WAVEFORMS PULSE DURATION Input tPLH Output tPHL tPHL Output tPLH VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING NONINVERTING OUTPUTS Output Waveform Open (see Note Output Waveform (see Note tPZH VOLTAGE WAVEFORMS SETUP HOLD TIMES Data Input
Output Control tPZL
tPLZ tPHZ VOLTAGE WAVEFORMS ENABLE DISABLE TIMES LOW- HIGH-LEVEL ENABLING
NOTES: includes probe capacitance. Waveform output with internal conditions such that output except when disabled output control. Waveform output with internal conditions such that output high except when disabled output control. input pulses supplied generators having following characteristics: MHz, outputs measured time with transition measurement.
Figure Load Circuit Voltage Waveforms
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PACKAGE OPTION ADDENDUM
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4-Jun-2007
PACKAGING INFORMATION
Orderable Device 5962-9231402Q3A 5962-9231402QKA 5962-9231402QLA SN74ABT543ADBLE SN74ABT543ADBR SN74ABT543ADBRE4 SN74ABT543ADBRG4 SN74ABT543ADW SN74ABT543ADWE4 SN74ABT543ADWG4 SN74ABT543ADWR SN74ABT543ADWRE4 SN74ABT543ADWRG4 SN74ABT543ANSR SN74ABT543ANSRE4 SN74ABT543ANSRG4 SN74ABT543ANT SN74ABT543ANTE4 SN74ABT543APW SN74ABT543APWE4 SN74ABT543APWG4 SN74ABT543APWLE SN74ABT543APWR SN74ABT543APWRE4 SN74ABT543APWRG4 SNJ54ABT543AFK SNJ54ABT543AJT SNJ54ABT543AW Status ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Package Type LCCC CDIP SSOP SSOP SSOP SSOP SOIC SOIC SOIC SOIC SOIC SOIC PDIP PDIP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP LCCC CDIP Package Drawing Pins Package Plan 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Lead/Ball Finish Peak Temp
POST-PLATE Type SNPB Call NIPD NIPD NIPD NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU Call NIPDAU NIPDAU NIPDAU Type Type Call Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Type Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Call Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM
2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br)
POST-PLATE Type SNPB Type Type
Addendum-Page
PACKAGE OPTION ADDENDUM
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4-Jun-2007
marketing status values defined follows: ACTIVE: Product device recommended designs. LIFEBUY: announced that device will discontinued, lifetime-buy period effect. NRND: recommended designs. Device production support existing customers, does recommend using this part design. PREVIEW: Device been announced production. Samples available. OBSOLETE: discontinued production device.
Plan planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), Green (RoHS Sb/Br) please check latest availability information additional product content details. TBD: Pb-Free/Green conversion plan been defined. Pb-Free (RoHS): TI's terms "Lead-Free" "Pb-Free" mean semiconductor products that compatible with current RoHS requirements substances, including requirement that lead exceed 0.1% weight homogeneous materials. Where designed soldered high temperatures, Pb-Free products suitable specified lead-free processes. Pb-Free (RoHS Exempt): This component RoHS exemption either lead-based flip-chip solder bumps used between package, lead-based adhesive used between leadframe. component otherwise considered Pb-Free (RoHS compatible) defined above. Green (RoHS Sb/Br): defines "Green" mean Pb-Free (RoHS compatible), free Bromine (Br) Antimony (Sb) based flame retardants exceed 0.1% weight homogeneous material)
MSL, Peak Temp. Moisture Sensitivity Level rating according JEDEC industry standard classifications, peak solder temperature. Important Information Disclaimer:The information provided this page represents TI's knowledge belief date that provided. bases knowledge belief information provided third parties, makes representation warranty accuracy such information. Efforts underway better integrate information from third parties. taken continues take reasonable steps provide representative accurate information have conducted destructive testing chemical analysis incoming materials chemicals. suppliers consider certain information proprietary, thus numbers other limited information available release. event shall TI's liability arising such information exceed total purchase price part(s) issue this document sold Customer annual basis.
Addendum-Page
PACKAGE MATERIALS INFORMATION
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19-May-2007
TAPE REEL INFORMATION
Pack Materials-Page
PACKAGE MATERIALS INFORMATION
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19-May-2007
Device
Package Pins
Site
Reel Diameter (mm)
Reel Width (mm)
(mm)
(mm)
(mm)
(mm)
Pin1 (mm) Quadrant
SN74ABT543ADBR SN74ABT543ADWR SN74ABT543ANSR SN74ABT543APWR
10.75 6.95
15.7 15.4
TAPE REEL INFORMATION
Device SN74ABT543ADBR SN74ABT543ADWR SN74ABT543ANSR SN74ABT543APWR Package Pins Site Length (mm) 342.9 346.0 346.0 342.9 Width (mm) 336.6 346.0 346.0 336.6 Height (mm) 28.58 41.0 41.0 28.58
Pack Materials-Page
PACKAGE MATERIALS INFORMATION
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Pack Materials-Page
MECHANICAL DATA
MCER004A JANUARY 1995 REVISED JANUARY 1997
(R-GDIP-T**)
LEADS SHOWN
CERAMIC DUAL-IN-LINE
PINS
1.280 (32,51) 1.240 (31,50) 0.300 (7,62) 0.245 (6,22)
1.460 (37,08) 1.440 (36,58) 0.291 (7,39) 0.285 (7,24)
0.070 (1,78) 0.030 (0,76)
0.100 (2,54)
0.015 (0,38)
0.320 (8,13) 0.290 (7,37)
0.200 (5,08) Seating Plane 0.130 (3,30)
0.023 (0,58) 0.015 (0,38) 0.100 (2,54) 0.014 (0,36) 0.008 (0,20)
0°-15°
4040110/C 08/96 NOTES: linear dimensions inches (millimeters). This drawing subject change without notice. This package hermetically sealed with ceramic using glass frit. Index point provided terminal identification. Falls within 1835 GDIP3-T24, GDIP4-T28, JEDEC MO-058 MO-058
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MECHANICAL DATA
MCFP007 OCTOBER 1994
(R-GDFP-F24)
0.375 (9,53) 0.340 (8,64)
CERAMIC DUAL FLATPACK
Base Seating Plane
0.006 (0,15) 0.004 (0,10) 0.090 (2,29) 0.045 (1,14) 0.395 (10,03) 0.360 (9,14) 0.045 (1,14) 0.026 (0,66) 0.360 (9,14) 0.240 (6,10) 0.019 (0,48) 0.015 (0,38)
0.360 (9,14) 0.240 (6,10)
0.050 (1,27) 0.640 (16,26) 0.490 (12,45)
0.030 (0,76) 0.015 (0,38)
1.115 (28,32) 0.840 (21,34)
4040180-5 03/95 NOTES: linear dimensions inches (millimeters). This drawing subject change without notice. This package hermetically sealed with ceramic using glass frit. Falls within MIL-STD-1835 GDFP2-F24 JEDEC MO-070AD Index point provided terminal identification only.
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MECHANICAL DATA
MLCC006B OCTOBER 1996
(S-CQCC-N**)
TERMINAL SHOWN
LEADLESS CERAMIC CHIP CARRIER
TERMINALS
0.342 (8,69) 0.442 (11,23) 0.640 (16,26) 0.739 (18,78) 0.938 (23,83) 1.141 (28,99) 0.358 (9,09) 0.458 (11,63) 0.660 (16,76) 0.761 (19,32) 0.962 (24,43) 1.165 (29,59) 0.307 (7,80) 0.406 (10,31) 0.495 (12,58) 0.495 (12,58) 0.850 (21,6) 1.047 (26,6)
0.358 (9,09) 0.458 (11,63) 0.560 (14,22) 0.560 (14,22) 0.858 (21,8) 1.063 (27,0)
0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25)
0.020 (0,51) 0.010 (0,25)
0.055 (1,40) 0.045 (1,14)
0.045 (1,14) 0.035 (0,89)
0.028 (0,71) 0.022 (0,54) 0.050 (1,27)
0.045 (1,14) 0.035 (0,89)
4040140 10/96 NOTES: linear dimensions inches (millimeters). This drawing subject change without notice. This package hermetically sealed with metal lid. terminals gold plated. Falls within JEDEC MS-004
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MECHANICAL DATA
MPDI004 OCTOBER 1994
(R-PDIP-T**)
PINS SHOWN
PLASTIC DUAL-IN-LINE PACKAGE
PINS
1.260 (32,04) 1.230 (31,24) 0.310 (7,87) 0.290 (7,37)
1.425 (36,20) 1.385 (35,18) 0.315 (8,00) 0.295 (7,49)
0.280 (7,11) 0.250 (6,35)
0.070 (1,78)
0.020 (0,51)
0.200 (5,08) Seating Plane 0.125 (3,18)
0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.010 (0,25) 0.010 (0,25)
4040050 04/95 NOTES: linear dimensions inches (millimeters). This drawing subject change without notice.
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MECHANICAL DATA
MSSO002E JANUARY 1995 REVISED DECEMBER 2001
(R-PDSO-G**)
PINS SHOWN 0,65 0,38 0,22 0,15
PLASTIC SMALL-OUTLINE
0,25 0,09 5,60 5,00 8,20 7,40
Gage Plane 0,25 0,95 0,55
Seating Plane 2,00 0,05 0,10
PINS
6,50
6,50
7,50
8,50
10,50
10,50
12,90
5,90
5,90
6,90
7,90
9,90
9,90
12,30 4040065 12/01
NOTES:
linear dimensions millimeters. This drawing subject change without notice. Body dimensions include mold flash protrusion exceed 0,15. Falls within JEDEC MO-150
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MECHANICAL DATA
MTSS001C JANUARY 1995 REVISED FEBRUARY 1999
(R-PDSO-G**)
PINS SHOWN
PLASTIC SMALL-OUTLINE PACKAGE
0,65
0,30 0,19
0,10
0,15 4,50 4,30 6,60 6,20 Gage Plane 0,25 0,75 0,50
Seating Plane 1,20 0,15 0,05 0,10
PINS
3,10
5,10
5,10
6,60
7,90
9,80
2,90
4,90
4,90
6,40
7,70
9,60
4040064/F 01/97 NOTES: linear dimensions millimeters. This drawing subject change without notice. Body dimensions include mold flash protrusion exceed 0,15. Falls within JEDEC MO-153
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