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17-Aug-2007 PACKAGING INFORMATION Orderable Device CD54AC374
Top Searches for this datasheetThis data sheet applicable CD54/74AC374, CD54/74AC534, CD54/74ACT374, CD54ACT534. CD74ACT534 acquired from Harris Semiconductor. 17-Aug-2007 PACKAGING INFORMATION Orderable Device CD54AC374F3A CD54ACT374F3A CD54ACT534F3A CD74AC374E CD74AC374EE4 CD74AC374M CD74AC374M96 CD74AC374M96E4 CD74AC374M96G4 CD74AC374ME4 CD74AC374MG4 CD74AC534M96 CD74AC534M96E4 CD74AC534M96G4 CD74ACT374E CD74ACT374EE4 CD74ACT374M CD74ACT374M96 CD74ACT374M96E4 CD74ACT374M96G4 CD74ACT374ME4 CD74ACT374MG4 Status ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Package Type CDIP CDIP CDIP PDIP PDIP SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC PDIP PDIP SOIC SOIC SOIC SOIC SOIC SOIC Package Drawing Pins Package Plan Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS Sb/Br) Lead/Ball Finish Call Call Call NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU Peak Temp Type Type Call Type Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Type Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) marketing status values defined follows: ACTIVE: Product device recommended designs. LIFEBUY: announced that device will discontinued, lifetime-buy period effect. NRND: recommended designs. Device production support existing customers, does recommend using this part design. PREVIEW: Device been announced production. Samples available. OBSOLETE: discontinued production device. Addendum-Page PACKAGE OPTION ADDENDUM 17-Aug-2007 Plan planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), Green (RoHS Sb/Br) please check latest availability information additional product content details. TBD: Pb-Free/Green conversion plan been defined. Pb-Free (RoHS): TI's terms "Lead-Free" "Pb-Free" mean semiconductor products that compatible with current RoHS requirements substances, including requirement that lead exceed 0.1% weight homogeneous materials. Where designed soldered high temperatures, Pb-Free products suitable specified lead-free processes. Pb-Free (RoHS Exempt): This component RoHS exemption either lead-based flip-chip solder bumps used between package, lead-based adhesive used between leadframe. component otherwise considered Pb-Free (RoHS compatible) defined above. Green (RoHS Sb/Br): defines "Green" mean Pb-Free (RoHS compatible), free Bromine (Br) Antimony (Sb) based flame retardants exceed 0.1% weight homogeneous material) MSL, Peak Temp. Moisture Sensitivity Level rating according JEDEC industry standard classifications, peak solder temperature. Important Information Disclaimer:The information provided this page represents TI's knowledge belief date that provided. bases knowledge belief information provided third parties, makes representation warranty accuracy such information. Efforts underway better integrate information from third parties. taken continues take reasonable steps provide representative accurate information have conducted destructive testing chemical analysis incoming materials chemicals. suppliers consider certain information proprietary, thus numbers other limited information available release. event shall TI's liability arising such information exceed total purchase price part(s) issue this document sold Customer annual basis. Addendum-Page PACKAGE MATERIALS INFORMATION 30-Apr-2007 TAPE REEL INFORMATION Pack Materials-Page PACKAGE MATERIALS INFORMATION 30-Apr-2007 Device Package Pins Site Reel Diameter (mm) Reel Width (mm) (mm) (mm) (mm) (mm) Pin1 (mm) Quadrant CD74AC374M96 CD74AC534M96 CD74ACT374M96 10.8 10.8 10.8 13.0 13.0 13.0 TAPE REEL INFORMATION Device CD74AC374M96 CD74AC534M96 CD74ACT374M96 Package Pins Site Length (mm) 333.2 333.2 333.2 Width (mm) 333.2 333.2 333.2 Height (mm) 31.75 31.75 31.75 Pack Materials-Page PACKAGE MATERIALS INFORMATION 30-Apr-2007 Pack Materials-Page IMPORTANT NOTICE Texas Instruments Incorporated subsidiaries (TI) reserve right make corrections, modifications, enhancements, improvements, other changes products services time discontinue product service without notice. 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