N-channel 0.0085 DPAK/IPAK STripFETIII Power MOSFET Type STD50NH0
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STD50NH02L STD50NH02L-1
N-channel 0.0085 DPAK/IPAK STripFETIII Power MOSFET
Type STD50NH02L-1 STD50NH02L
VDSS
RDS(on) <0.0105 <0.0105
Logic level device RDS(ON) Industry's benchmark Conduction losses reduced Switching losses reduced threshold drive
iPAK DPAK
Description
This device utilizes latest advanced design rules ST's proprietary STripFETtechnology. This suitable most demanding DC-DC converter application where high efficiency achieved.
Internal schematic diagram
Applications
Switching application
Order codes
Part number STD50NH02L-1 STD50NH02LT4 Marking D50NH02L D50NH02L Package IPAK DPAK Packaging Tube Tape reel
July 2006
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www.st.com
Contents
STD50NH02L STD50NH02L-1
Contents
Electrical ratings Electrical characteristics
Electrical characteristics (curves)
Test circuit
Appendix Package mechanical data Packing mechanical data Revision history
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STD50NH02L STD50NH02L-1
Electrical ratings
Electrical ratings
Table
Symbol Vspike VDGR
Absolute maximum ratings
Parameter Drain-source voltage rating Drain-source voltage (VGS Drain-gate voltage (RGS Gate- source voltage Drain current (continuous) 25°C Drain current (continuous) 100°C Drain current (pulsed) Total dissipation 25°C Derating Factor Value Max. operating junction temperature Unit W/°C
Ptot
Single pulse avalanche energy Storage temperature
Tstg
Garanted when external Rg=4.7 tfmax. Pulse width limited safe operating area. Starting 19A,
Table
Rthj-case Rthj-amb
Thermal data
Thermal resistance junction-case Thermal resistance junction-ambient Maximum lead temperature soldering purpose °C/W °C/W
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Electrical characteristics
STD50NH02L STD50NH02L-1
Electrical characteristics
(TCASE=25°C unless otherwise specified) Table
Symbol V(BR)DSS IDSS IGSS VGS(th) RDS(on)
On/off states
Parameter Drain-source breakdown voltage Zero gate voltage drain current (VGS Gate-body leakage current (VDS Gate threshold voltage Static drain-source resistance Test conditions 25mA, 20V, 125°C VGS, 250µA 10V, 12.5A 0.0085 0.012 0.0105 0.020 Min. ±100 Typ. Max. Unit
Table
Symbol Ciss Coss Crss
Dynamic
Parameter Forward transconductance Input capacitance Output capacitance Reverse transfer capacitance Test conditions 15V, Min. Typ. 1400 Max. Unit
25V, 1MHz, Gate Bias Test Signal Level Open Drain 10V, (see Figure 10V, 50A, 10V, (see Figure VDS= VGS=
Gate Input Resistance
td(on) td(off) Qoss(2)
Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge Output charge
Pulsed: Pulse duration duty cycle Qoss Coss* Coss Chapter Appendix
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STD50NH02L STD50NH02L-1
Electrical characteristics
Table
Symbol ISDM IRRM
Source drain diode
Parameter Source-drain current Source-drain current (pulsed) Forward voltage 25A, Test conditions Min. Typ. Max. Unit
Reverse recovery time 50A, di/dt 100A/µs, Reverse recovery charge 20V, 150°C Reverse recovery current (see Figure
Pulse width limited safe operating area. Pulsed: Pulse duration duty cycle
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Electrical characteristics
STD50NH02L STD50NH02L-1
Figure
Electrical characteristics (curves)
Safe operating area Figure Thermal impedance
Figure
Output characterisics
Figure
Transfer characteristics
Figure
Transconductance
Figure
Static drain-source resistance
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STD50NH02L STD50NH02L-1 Figure Gate charge gate-source voltage Figure
Electrical characteristics Capacitance variations
Figure
Normalized gate threshold voltage temperature
Figure Normalized resistance temperature
Figure Source-drain diode forward characteristics
Figure Normalized breakdown voltage temperature
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Test circuit
STD50NH02L STD50NH02L-1
Test circuit
Figure Gate charge test circuit
Figure Switching times test circuit resistive load
Figure Test circuit inductive load Figure Unclamped Inductive load test switching diode recovery times circuit
Figure Unclamped inductive waveform
Figure Switching time waveform
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STD50NH02L STD50NH02L-1
Appendix
Appendix
Figure Buck converter: power losses estimation
power losses associated with FETs synchronous buck converter estimated using equations shown table below. formulas give good approximation, sake performance comparison, different pairs devices affect converter efficiency. However very important parameter, working temperature, considered. real device behavior really dependent heat generated inside devices removed allow safer working junction temperature.
side (SW2) device requires: Very RDS(on) reduce conduction losses Small Qgls reduce gate charge losses Small Coss reduce losses output capacitance Small reduce losses during turn-on Cgd/Cgs ratio lower than Vth/Vgg ratio especially with drain source voltage avoid cross conduction phenomenon; high side (SW1) device requires: Small allow higher gate current peak limit voltage feedback gate Small have faster commutation reduce gate charge losses RDS(on) reduce conduction losses.
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Appendix
STD50NH02L STD50NH02L-1
Table
Power losses calculation
High side switching (SW1) side switch (SW2)
Pconduction
DS(on)SW1
DS(on)SW2
Pswitching
gsth(SW1) gd(SW1)
Zero Voltage Switching
Recovery
applicable
rr(SW2)
Pdiode Conductio applicable
Vf(SW2) deadtime gls(SW2)
oss(SW2)
Pgate(QG)
g(SW1)
PQoss
oss(SW1)
Dissipated during turn-on
Table
Paramiters meaning
Meaning Duty-cycle Post threshold gate charge Third quadrant gate charge state losses On-off transition losses Conduction reverse recovery diode losses Gate drive losses Output capacitance losses
Parameter Qgsth Qgls Pconduction Pswitching Pdiode Pgate PQoss
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STD50NH02L STD50NH02L-1
Package mechanical data
Package mechanical data
order meet environmental requirements, offers these devices ECOPACK® packages. These packages have Lead-free second level interconnect category second level interconnect marked package inner label, compliance with JEDEC Standard JESD97. maximum ratings related soldering conditions also marked inner label. ECOPACK trademark. ECOPACK specifications available www.st.com
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Package mechanical data
STD50NH02L STD50NH02L-1
TO-251 (IPAK) MECHANICAL DATA
DIM. MIN. 0.45 0.48 15.9 0.95 16.3 0.017 0.019 0.236 0.252 0.173 0.626 0.354 0.031 0.031 0.64 TYP. MAX. 0.85 0.012 0.037 0.023 0.023 0.244 0.260 0.181 0.641 0.370 0.047 0.039 MIN. 0.086 0.035 0.027 0.025 0.204 inch TYP. MAX. 0.094 0.043 0.051 0.031 0.212 0.033
0068771-E
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STD50NH02L STD50NH02L-1
Package mechanical data
DPAK MECHANICAL DATA
DIM. MIN. (L1) 0.03 0.64 0.45 0.48 2.28 9.35 0.023 0.008 10.1 0.173 0.368 0.039 0.110 0.031 0.039 0.252 0.185 0.090 0.181 0.397 MAX. 0.23 MIN. 0.086 0.035 0.001 0.025 0.204 0.017 0.019 0.236 0.200 0.260 TYP. MAX. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 inch
0068772-F
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Packing mechanical data
STD50NH02L STD50NH02L-1
Packing mechanical data
DPAK FOOTPRINT
dimensions millimeters
TAPE REEL SHIPMENT
REEL MECHANICAL DATA
DIM. 12.8 20.2 16.4 22.4 18.4 13.2 MIN. MAX. 0.059 0.504 0.520 0.795 0.645 0.724 1.968 0.881 BULK 2500 inch MIN. MAX. 12.992
TAPE MECHANICAL DATA
DIM.
BASE 2500
MIN. 10.4 1.65 2.55
15.7 16.3
inch MIN. MAX. 0.267 0.275 0.409 0.417 0.476 0.059 0.063 0.059 0.065 0.073 0.291 0.299 0.100 0.108 0.153 0.161 0.311 0.319 0.075 0.082 1.574
0.618 0.641
MAX. 10.6 12.1 1.85 2.75
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STD50NH02L STD50NH02L-1
Revision history
Revision history
Table
Date 21-Jun-2004 11-Jul-2006
Revision history
Revision Preliminary version template, content change Changes
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STD50NH02L STD50NH02L-1
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