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N-channel 0.009 DPAK gate charge STripFETII Power MOSFET Type STD
Top Searches for this datasheetSTD40NF3LL N-channel 0.009 DPAK gate charge STripFETII Power MOSFET Type STD40NF3LL VDSS RDS(on) <0.011 Logic level device Optimal RDS(on) trade-off Conduction losses reduced Switching losses reduced threshold drive DPAK Description This application specific Power MOSFET third generation STMicroelectronics unique "Single Feature SizeTM" strip-based process. resulting transistor shows best trade-off between on-resistance gate charge. When used high side buck regulators, gives best performance terms both conduction switching losses. This extremely important motherboards where fast switching high efficiency paramount importance. Internal schematic diagram Applications Switching application Order codes Part number STD40NF3LLT4 Marking D40NF3LL@ Package DPAK Packaging Tape reel February 2007 1/13 www.st.com Contents STD40NF3LL Contents Electrical ratings Electrical characteristics Electrical characteristics (curves) Test circuit Package mechanical data Packing mechanical data Revision history 2/13 STD40NF3LL Electrical ratings Electrical ratings Table Symbol VDGR ID(1) Absolute maximum ratings Parameter Drain-source voltage (VGS Drain-gate voltage (RGS Gate- source voltage Drain current (continuous) 25°C Drain current (continuous) 100°C Drain current (pulsed) Total dissipation 25°C Derating Factor Value 0.53 Max. operating junction temperature Unit W/°C V/ns Ptot dv/dt Peak diode recovery voltage slope Single pulse avalanche energy Storage temperature Tstg Current limited package Pulse width limited safe operating area. 40A, di/dt 350A/µs, V(BR)DSS, TJMAX Starting 20A, Table Rthj-case Rthj-amb Thermal data Thermal resistance junction-case Thermal resistance junction-ambient Maximum lead temperature soldering purpose 1.88 °C/W °C/W 3/13 Electrical characteristics STD40NF3LL Electrical characteristics (TCASE=25°C unless otherwise specified) Table Symbol V(BR)DSS On/off states Parameter Drain-source breakdown voltage Zero gate voltage drain current (VGS Gate-body leakage current (VDS Gate threshold voltage Static drain-source resistance Test conditions 250µA, rating rating, 125°C ±16V VGS, 250µA 10V, 4.5V, 0.0090 0.0115 0.0110 0.0135 Min. ±100 Typ. Max. Unit IDSS IGSS VGS(th) RDS(on) Table Symbol Ciss Coss Crss td(on) td(off) Dynamic Parameter Forward transconductance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge Test conditions 15V, Min. Typ. 1650 Max. Unit 25V, 1MHz, 15V, =4.5V (see Figure 15V, 20A, 4.5V, (see Figure Pulsed: Pulse duration duty cycle 1.5%. 4/13 STD40NF3LL Electrical characteristics Table Symbol ISDM IRRM Source drain diode Parameter Source-drain current Source-drain current (pulsed) Forward voltage 40A, Test conditions Min. Typ. Max. Unit Reverse recovery time 40A, di/dt 100A/µs, Reverse recovery charge 15V, 150°C Reverse recovery current (see Figure Pulse width limited safe operating area. Pulsed: Pulse duration duty cycle 1.5% 5/13 Electrical characteristics STD40NF3LL Figure Electrical characteristics (curves) Safe operating area Figure Thermal impedance Figure Output characteristics Figure Transfer characteristics Figure Transconductance Figure Static drain-source resistance 6/13 STD40NF3LL Figure Gate charge gate-source voltage Figure Electrical characteristics Capacitance variations Figure Normalized gate threshold voltage temperature Figure Normalized resistance temperature Figure Source-drain diode forward characteristics Figure Normalized breakdown voltage temperature 7/13 Test circuit STD40NF3LL Test circuit Figure Gate charge test circuit Figure Switching times test circuit resistive load Figure Test circuit inductive load Figure Unclamped Inductive load test switching diode recovery times circuit Figure Unclamped inductive waveform Figure Switching time waveform 8/13 STD40NF3LL Package mechanical data Package mechanical data order meet environmental requirements, offers these devices ECOPACK® packages. These packages have Lead-free second level interconnect. category second level interconnect marked package inner label, compliance with JEDEC Standard JESD97. maximum ratings related soldering conditions also marked inner label. ECOPACK trademark. ECOPACK specifications available www.st.com 9/13 Package mechanical data STD40NF3LL DPAK MECHANICAL DATA DIM. MIN. (L1) 0.03 0.64 0.45 0.48 2.28 9.35 0.023 0.008 10.1 0.173 0.368 0.039 0.110 0.031 0.039 0.252 0.185 0.090 0.181 0.397 MAX. 0.23 MIN. 0.086 0.035 0.001 0.025 0.204 0.017 0.019 0.236 0.200 0.260 TYP. MAX. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 inch 0068772-F 10/13 STD40NF3LL Packing mechanical data Packing mechanical data DPAK FOOTPRINT dimensions millimeters TAPE REEL SHIPMENT REEL MECHANICAL DATA DIM. 12.8 20.2 16.4 22.4 18.4 13.2 MIN. MAX. 0.059 0.504 0.520 0.795 0.645 0.724 1.968 0.881 BULK 2500 inch MIN. MAX. 12.992 TAPE MECHANICAL DATA DIM. BASE 2500 MIN. 10.4 1.65 2.55 15.7 16.3 inch MIN. MAX. 0.267 0.275 0.409 0.417 0.476 0.059 0.063 0.059 0.065 0.073 0.291 0.299 0.100 0.108 0.153 0.161 0.311 0.319 0.075 0.082 1.574 0.618 0.641 MAX. 10.6 12.1 1.85 2.75 11/13 Revision history STD40NF3LL Revision history Table Date 21-Jun-2004 11-Jul-2006 20-Feb-2007 Revision history Revision Changes datasheet according DSG/CT/2C13 marking:D40NF3LL@ template, content change Typo mistake page 12/13 STD40NF3LL Please Read Carefully: Information this document provided solely connection with products. STMicroelectronics subsidiaries ("ST") reserve right make changes, corrections, modifications improvements, this document, products services described herein time, without notice. products sold pursuant ST's terms conditions sale. 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