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These Common Anode Epitaxial Planar QUAD Diodes designed ultra high sp


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NSDEMP11XV6T1, NSDEMP11XV6T5 Common Anode Quad Array Switching Diode
These Common Anode Epitaxial Planar QUAD Diodes designed ultra high speed switching applications. NSDEMP11XV6T1 device housed SOT-563 package which designed power surface mount applications, where board space premium.
Fast These Pb-Free Devices
MAXIMUM RATINGS 25°C)
Rating Reverse Voltage Peak Reverse Voltage Forward Current Peak Forward Current Peak Forward Surge Current Symbol IFSM (Note Value Unit
mAdc mAdc SOT-563 CASE 463A PLASTIC
THERMAL CHARACTERISTICS
Characteristic (One Junction Heated) Total Device Dissipation Derate above 25°C Thermal Resistance, Junction-to-Ambient Characteristic (Both Junctions Heated) Total Device Dissipation Derate above 25°C Thermal Resistance, Junction-to-Ambient Junction Storage Temperature RqJA Tstg 25°C RqJA 25°C
MARKING DIAGRAM
Symbol (Note (Note (Note (Note (Note (Note +150 Unit mW/°C °C/W Device Code Date Code Pb-Free Package (Note: Microdot either location)
Symbol
Unit mW/°C °C/W
ORDERING INFORMATION
Device NSDEMP11XV6T1 Package Shipping
SOT-563* 4000/Tape Reel
Stresses exceeding Maximum Ratings damage device. Maximum Ratings stress ratings only. Functional operation above Recommended Operating Conditions implied. Extended exposure stresses above Recommended Operating Conditions affect device reliability. FR-4 Minimum
NSDEMP11XV6T1G SOT-563* 4000/Tape Reel NSDEMP11XV6T5 SOT-563* 8000/Tape Reel
NSDEMP11XV6T5G SOT-563* 8000/Tape Reel information tape reel specifications, including part orientation tape sizes, please refer Tape Reel Packaging Specifications Brochure, BRD8011/D. *This package inherently Pb-Free.
Semiconductor Components Industries, LLC, 2006
May, 2006 Rev.
Publication Order Number: NSDEMP11XV6T1/D
NSDEMP11XV6T1, NSDEMP11XV6T5
ELECTRICAL CHARACTERISTICS 25°C)
Characteristic Reverse Voltage Leakage Current Forward Voltage Reverse Breakdown Voltage Diode Capacitance Reverse Recovery Time Symbol (Note Condition Unit mAdc
Test Circuit NSDEMP11XV6T1 Figure
TYPICAL ELECTRICAL CHARACTERISTICS
FORWARD CURRENT (mA) 85°C -40°C REVERSE CURRENT 150°C 125°C
85°C 55°C
25°C
0.01 25°C REVERSE VOLTAGE (VOLTS)
FORWARD VOLTAGE (VOLTS)
0.001
Figure Forward Voltage
1.75 DIODE CAPACITANCE (pF)
Figure Reverse Current
1.25
0.75
REVERSE VOLTAGE (VOLTS)
Figure Diode Capacitance
0.35
RECOVERY TIME EQUIVALENT TEST CIRCUIT
INPUT PULSE
OUTPUT PULSE
Figure Reverse Recovery Time Test Circuit NSDEMP11XV6T1 http://onsemi.com
NSDEMP11XV6T1, NSDEMP11XV6T5
PACKAGE DIMENSIONS
SOT-563, LEAD CASE 463A-01 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETERS MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS MINIMUM THICKNESS BASE MATERIAL. MILLIMETERS 0.50 0.55 0.60 0.17 0.22 0.27 0.08 0.12 0.18 1.50 1.60 1.70 1.10 1.20 1.30 0.10 0.20 0.30 1.50 1.60 1.70 INCHES 0.021 0.023 0.009 0.011 0.005 0.007 0.062 0.066 0.047 0.051 0.02 0.004 0.008 0.012 0.059 0.062 0.066 0.020 0.007 0.003 0.059 0.043
0.08 (0.003)
SOLDERING FOOTPRINT*
0.0118 0.45 0.0177 0.0394
1.35 0.0531
0.0197 0.0197
SCALE 20:1 inches
*For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D.
Semiconductor registered trademarks Semiconductor Components Industries, (SCILLC). SCILLC reserves right make changes without further notice products herein. SCILLC makes warranty, representation guarantee regarding suitability products particular purpose, does SCILLC assume liability arising application product circuit, specifically disclaims liability, including without limitation special, consequential incidental damages. "Typical" parameters which provided SCILLC data sheets and/or specifications vary different applications actual performance vary over time. operating parameters, including "Typicals" must validated each customer application customer's technical experts. SCILLC does convey license under patent rights rights others. SCILLC products designed, intended, authorized components systems intended surgical implant into body, other applications intended support sustain life, other application which failure SCILLC product could create situation where personal injury death occur. Should Buyer purchase SCILLC products such unintended unauthorized application, Buyer shall indemnify hold SCILLC officers, employees, subsidiaries, affiliates, distributors harmless against claims, costs, damages, expenses, reasonable attorney fees arising directly indirectly, claim personal injury death associated with such unintended unauthorized use, even such claim alleges that SCILLC negligent regarding design manufacture part. SCILLC Equal Opportunity/Affirmative Action Employer. This literature subject applicable copyright laws resale manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center Semiconductor P.O. 5163, Denver, Colorado 80217 Phone: 303-675-2175 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East Africa Technical Support: Phone: 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit additional information, please contact your local Sales Representative
http://onsemi.com
NSDEMP11XV6T1/D

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