MC74HC175A identical pinout LS175. device inputs compatible with stand

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MC74HC175A identical pinout LS175. device inputs compatible with stand

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MC74HC175A Quad Flip-Flop with Common Clock Reset
MC74HC175A identical pinout LS175. device inputs compatible with standard CMOS outputs; with pullup resistors, they compatible with LSTTL outputs. This device consists four flip-flops with common Reset Clock inputs, separate inputs. Reset (active-low) asynchronous occurs when level applied Reset input. Information input transferred corresponding output next positive going edge Clock input.
PDIP-16 SUFFIX CASE SOIC-16 SUFFIX CASE 751B TSSOP-16 SUFFIX CASE 948F SOEIAJ-16 SUFFIX CASE 74HC175A ALYWG 175A ALYWG HC175AG AWLYWW MC74HC175AN AWLYYWW
Output Drive Capability: LSTTL Loads Outputs Directly Interface CMOS, NMOS, Operating Voltage Range: Input Current: High Noise Immunity Characteristic CMOS Devices Compliance with Requirements Defined JEDEC Standard Chip Complexity FETs 41.5 Equivalent Gates Pb-Free Packages Available*
Assembly Location Wafer Year Work Week Pb-Free Package Pb-Free Package (Note: Microdot either location)
ORDERING INFORMATION
detailed ordering shipping information package dimensions section page this data sheet.
*For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2005
June, 2005 Rev.
Publication Order Number: MC74HC175A/D
MC74HC175A
RESET CLOCK DATA INPUTS CLOCK
INVERTING NONINVERTING OUTPUTS
RESET
Figure Assignment
Figure Logic Diagram
FUNCTION TABLE
Inputs Reset Clock Outputs Change
ORDERING INFORMATION
Device MC74HC175AN MC74HC175AD MC74HC175ADG MC74HC175ADR2 MC74HC175ADR2G MC74HC175ADTR2 MC74HC175ADTR2G MC74HC175AFEL MC74HC175AFELG Package PDIP-16 SOIC-16 SOIC-16 (Pb-Free) SOIC-16 SOIC-16 (Pb-Free) TSSOP-16* TSSOP-16* SOEIAJ-16 SOEIAJ-16 (Pb-Free) Shipping Units Rail Units Rail Units Rail 2500 Units Reel 2500 Units Reel 2500 Units Reel 2500 Units Reel 2000 Units Reel 2000 Units Reel
information tape reel specifications, including part orientation tape sizes, please refer Tape Reel Packaging Specifications Brochure, BRD8011/D. *This package inherently Pb-Free.
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MC74HC175A
MAXIMUM RATINGS
Symbol Parameter Value Unit Supply Voltage (Referenced GND) Input Voltage (Referenced GND) Vout Output Voltage (Referenced GND) Input Current, Iout Output Current, Supply Current, Pins Power Dissipation Still Air, Plastic SOIC Package TSSOP Package Tstg Storage Temperature Lead Temperature, from Case Seconds (Plastic DIP, SOIC TSSOP Package)
This device contains protection circuitry guard against damage high static voltages electric fields. However, precautions must taken avoid applications voltage higher than maximum rated voltages this high-impedance circuit. proper operation, Vout should constrained range (Vin Vout) VCC. Unused inputs must always tied appropriate logic voltage level (e.g., either VCC). Unused outputs must left open.
Maximum ratings those values beyond which device damage occur. Maximum ratings applied device individual stress limit values (not normal operating conditions) valid simultaneously. these limits exceeded, device functional operation implied, damage occur reliability affected. Derating Plastic DIP: mW/_C from 125_C SOIC Package: mW/_C from 125_C TSSOP Package: mW/_C from 125_C high frequency heavy load considerations, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D).
Symbol Parameter Unit Supply Voltage (Referenced GND) Vin, Vout Input Voltage, Output Voltage (Referenced GND) Operating Temperature, Package Types Input Rise Fall Time (Figure 1000
RECOMMENDED OPERATING CONDITIONS
ELECTRICAL CHARACTERISTICS (Voltages Referenced GND)
Guaranteed Limit 85_C 3.15 1.35 1.80
Symbol
Parameter
Test Conditions
25_C 3.15 1.35 1.80
125_C 3.15 1.35 1.80
Unit
Minimum High-Level Input Voltage
Vout |Iout|
Maximum Low-Level Input Voltage
Vout |Iout|
Minimum High-Level Output Voltage
|Iout|
|Iout| |Iout| |Iout|
2.48 3.98 5.48
2.34 3.84 5.34
2.20 3.70 5.20
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MC74HC175A
ELECTRICAL CHARACTERISTICS (Voltages Referenced GND)
Guaranteed Limit 85_C Symbol Parameter Test Conditions 25_C 125_C Unit Maximum Low-Level Output Voltage |Iout| |Iout| |Iout| |Iout| 0.26 0.26 0.26 0.33 0.33 0.33 0.40 0.40 0.40 Maximum Input Leakage Current Maximum Quiescent Supply Current (per Package) Iout NOTE: Information typical parametric values found Chapter Semiconductor High-Speed CMOS Data Book (DL129/D).
ELECTRICAL CHARACTERISTICS Input
Guaranteed Limit 85_C
Symbol fmax
Parameter
25_C
125_C
Unit
Maximum Clock Frequency (50% Duty Cycle) (Figures
tPLH, tPHL
Maximum Propagation Delay, Clock (Figures
tPHL
Maximum Propagation Delay, Reset (Figures
tTLH, tTHL
Maximum Output Transition Time, Output (Figures
Maximum Input Capacitance
NOTES: propagation delays with loads other than Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). Information typical parametric values found Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). Typical 25°C, Power Dissipation Capacitance (Per Flip-Flop)*
Used determine no-load dynamic power consumption: VCC2 load considerations, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D).
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NOTE: Information typical parametric values found Chapter Semiconductor High-Speed CMOS Data Book (DL129/D).
TIMING REQUIREMENTS (Input
Symbol
trec
Maximum Input Rise Fall Times (Figure
Minimum Pulse Width, Reset (Figure
Minimum Pulse Width, Clock (Figure
Minimum Recovery Time, Reset Inactive Clock (Figure
Minimum Hold Time, Clock Data (Figure
Minimum Setup Time, Data Clock (Figure
Parameter
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MC74HC175A
25_C 1000 Guaranteed Limit 85_C 1000 125_C 1000 Unit
MC74HC175A
SWITCHING WAVEFORMS
RESET CLOCK 1/fmax tPLH tPHL tPHL tPLH trec CLOCK
tTLH
tTHL
Figure
Figure
VALID DATA CLOCK
Figure
TEST CIRCUIT
TEST POINT OUTPUT DEVICE UNDER TEST
*Includes probe capacitance
Figure
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MC74HC175A
EXPANDED LOGIC DIAGRAM
CLOCK
RESET
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MC74HC175A
PACKAGE DIMENSIONS
PDIP-16 SUFFIX CASE 648-08 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION CENTER LEADS WHEN FORMED PARALLEL. DIMENSION DOES INCLUDE MOLD FLASH. ROUNDED CORNERS OPTIONAL.
SEATING PLANE
0.25 (0.010)
INCHES 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 0.050 0.008 0.015 0.110 0.130 0.295 0.305 0.020 0.040
MILLIMETERS 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 1.27 0.21 0.38 2.80 3.30 7.50 7.74 0.51 1.01
SOIC-16 SUFFIX CASE 751B-05 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.127 (0.005) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. MILLIMETERS 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 0.19 0.25 0.10 0.25 5.80 6.20 0.25 0.50 INCHES 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 0.008 0.009 0.004 0.009 0.229 0.244 0.010 0.019
0.25 (0.010)
SEATING PLANE
0.25 (0.010)
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MC74HC175A
PACKAGE DIMENSIONS
TSSOP-16 SUFFIX CASE 948F-01 ISSUE
0.10 (0.004) 0.15 (0.006)
IDENT.
0.15 (0.006)
0.25 (0.010)
DETAIL
0.10 (0.004) SEATING
PLANE
DETAIL
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SECTION
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSION DOES INCLUDE MOLD FLASH. PROTRUSIONS GATE BURRS. MOLD FLASH GATE BURRS SHALL EXCEED 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE INTERLEAD FLASH PROTRUSION. INTERLEAD FLASH PROTRUSION SHALL EXCEED 0.25 (0.010) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. TERMINAL NUMBERS SHOWN REFERENCE ONLY. DIMENSION DETERMINED DATUM PLANE -W-. MILLIMETERS 4.90 5.10 4.30 4.50 1.20 0.05 0.15 0.50 0.75 0.65 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 INCHES 0.193 0.200 0.169 0.177 0.047 0.002 0.006 0.020 0.030 0.026 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252
MC74HC175A
PACKAGE DIMENSIONS
SOEIAJ-16 SUFFIX CASE 966-01 ISSUE
DETAIL
VIEW
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD FLASH PROTRUSIONS MEASURED PARTING LINE. MOLD FLASH PROTRUSIONS SHALL EXCEED 0.15 (0.006) SIDE. TERMINAL NUMBERS SHOWN REFERENCE ONLY. LEAD WIDTH DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS LEAD WIDTH DIMENSION MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT LOCATED LOWER RADIUS FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS ADJACENT LEAD 0.46 0.018). MILLIMETERS 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 7.40 8.20 0.50 0.85 1.10 1.50 0.70 0.90 0.78 INCHES 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 0.291 0.323 0.020 0.033 0.043 0.059 0.028 0.035 0.031
0.13 (0.005)
0.10 (0.004)
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MC74HC175A/D

MC74HC175A identical pinout LS175. device inputs compatible with stand

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