MC74HC157A identical pinout LS157. device inputs compatible with stand
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MC74HC157A Quad 2-Input Data Selectors Multiplexers
MC74HC157A identical pinout LS157. device inputs compatible with standard CMOS outputs; with pullup resistors, they compatible with LSTTL outputs. This device routes nibbles single port determined Select input. data presented outputs noninverted form. high level Output Enable input sets four outputs level.
PDIP-16 SUFFIX CASE SOIC-16 SUFFIX CASE 751B TSSOP-16 SUFFIX CASE 948F SOEIAJ-16 SUFFIX CASE 74HC157A ALYWG 157A ALYWG HC157AG AWLYWW MC74HC157AN AWLYYWWG
Output Drive Capability: LSTTL Loads Outputs Directly Interface CMOS, NMOS, Operating Voltage Range: Input Current: High Noise Immunity Characteristic CMOS Devices Compliance with Requirements Defined JEDEC Standard Chip Complexity: FETs 20.5 Equivalent Gates Pb-Free Packages Available*
Assembly Location Wafer Year Work Week Pb-Free Package Pb-Free Package (Note: Microdot either location)
ORDERING INFORMATION
detailed ordering shipping information package dimensions section page this data sheet.
*For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2005
June, 2005 Rev.
Publication Order Number: MC74HC157A/D
MC74HC157A
NIBBLE INPUTS NIBBLE INPUTS SELECT OUTPUT ENABLE DATA OUTPUTS
SELECT
OUTPUT ENABLE
Figure Assignment
Figure Logic Diagram FUNCTION TABLE
Inputs Output Enable Select Outputs
don't care levels respective Data-Word Inputs.
ORDERING INFORMATION
Device MC74HC157AN MC74HC157ANG MC74HC157AD MC74HC157ADG MC74HC157ADR2 MC74HC157ADR2G MC74HC157ADTR2 MC74HC157ADTR2G MC74HC157AFEL MC74HC157AFELG Package PDIP-16 PDIP-16 (Pb-Free) SOIC-16 SOIC-16 (Pb-Free) SOIC-16 SOIC-16 (Pb-Free) TSSOP-16* TSSOP-16* SOEIAJ-16 SOEIAJ-16 (Pb-Free) Shipping Units Rail Units Rail Units Rail Units Rail 2500 Units Reel 2500 Units Reel 2500 Units Reel 2500 Units Reel 2000 Units Reel 2000 Units Reel
information tape reel specifications, including part orientation tape sizes, please refer Tape Reel Packaging Specifications Brochure, BRD8011/D. *This package inherently Pb-Free.
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MC74HC157A
MAXIMUM RATINGS
Symbol Parameter Value Unit Supply Voltage (Referenced GND) Input Voltage (Referenced GND) Vout Output Voltage (Referenced GND) Input Current, Iout Output Current, Supply Current, Pins Power Dissipation Still Air, Plastic SOIC Package TSSOP Package Tstg Storage Temperature Lead Temperature, from Case Seconds (Plastic DIP, SOIC TSSOP Package)
This device contains protection circuitry guard against damage high static voltages electric fields. However, precautions must taken avoid applications voltage higher than maximum rated voltages this high-impedance circuit. proper operation, Vout should constrained range (Vin Vout) VCC. Unused inputs must always tied appropriate logic voltage level (e.g., either VCC). Unused outputs must left open.
Maximum ratings those values beyond which device damage occur. Maximum ratings applied device individual stress limit values (not normal operating conditions) valid simultaneously. these limits exceeded, device functional operation implied, damage occur reliability affected. Derating Plastic DIP: mW/_C from 125_C SOIC Package: mW/_C from 125_C TSSOP Package: mW/_C from 125_C high frequency heavy load considerations, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter
Unit
Supply Voltage (Referenced GND) Input Voltage, Output Voltage (Referenced GND)
Vin, Vout
Operating Temperature, Package Types Input Rise Fall Time (Figure
1000
ELECTRICAL CHARACTERISTICS (Voltages Referenced GND)
Guaranteed Limit 85_C 3.15 1.35
Symbol
Parameter
Test Conditions
25_C 3.15 1.35
125_C 3.15 1.35
Unit
Minimum High-Level Input Voltage
Vout |Iout|
Maximum Low-Level Input Voltage
Vout |Iout|
Minimum High-Level Output Voltage
|Iout|
|Iout| |Iout| |Iout|
2.48 3.98 5.48
2.34 3.84 5.34
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MC74HC157A
ELECTRICAL CHARACTERISTICS (Voltages Referenced GND)
Guaranteed Limit 85_C Symbol Parameter Test Conditions 25_C 125_C Unit Maximum Low-Level Output Voltage |Iout| |Iout| |Iout| |Iout| 0.26 0.26 0.26 0.33 0.33 0.33 Maximum Input Leakage Current Maximum Three-State Leakage Current Maximum Quiescent Supply Current (per Package) Output High-Impedance State Vout Iout NOTE: Information typical parametric values found Chapter Semiconductor High-Speed CMOS Data Book (DL129/D).
Guaranteed Limit 85_C Symbol tPLH, tPHL Parameter 25_C 125_C Unit Maximum Propagation Delay, Input Output (Figures tPLH, tPHL Maximum Propagation Delay, Select Output (Figures tPLH, tPHL Maximum Propagation Delay, Output Enable Output (Figures tTLH, tTHL Maximum Output Transition Time, Output (Figures Maximum Input Capacitance NOTE: propagation delays with loads other than information typical parametric values, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). Typical 25°C,
ELECTRICAL CHARACTERISTICS Input
Power Dissipation Capacitance (Per Package)*
Used determine no-load dynamic power consumption: Semiconductor High-Speed CMOS Data Book (DL129/D).
load considerations, Chapter
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MC74HC157A
DESCRIPTIONS
INPUTS (Pins
Nibble inputs. data present these pins transferred outputs when Select input level Output Enable input level. data presented outputs noninverted form.
(Pins
data present these pins noninverted form. Output Enable input high level, outputs level.
CONTROL INPUTS Select (Pin
Nibble inputs. data present these pins transferred outputs when Select input high level Output Enable input level. data presented outputs noninverted form.
OUTPUTS (Pins
Nibble select. This input determines data word transferred outputs. level this input selects inputs high level selects inputs.
Output Enable (Pin
Output Enable input. level this input allows selected input data presented outputs. high level this input sets outputs level.
Data outputs. selected input Nibble presented these outputs when Output Enable input level. SWITCHING WAVEFORMS
INPUT tPLH OUTPUT tTLH tTHL tPHL SELECT tPLH OUTPUT tTLH tTHL tPHL
Figure HC157A
OUTPUT ENABLE tPHL OUTPUT tTHL
Figure versus Selected, Noninverted
tPLH
tTLH
Figure HC157A
TEST POINT OUTPUT DEVICE UNDER TEST
*Includes probe capacitance
Figure Test Circuit
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MC74HC157A
EXPANDED LOGIC DIAGRAM
OUTPUT ENABLE SELECT
DATA OUTPUTS
NIBBLE OUTPUTS
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MC74HC157A
PACKAGE DIMENSIONS
PDIP-16 SUFFIX CASE 648-08 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION CENTER LEADS WHEN FORMED PARALLEL. DIMENSION DOES INCLUDE MOLD FLASH. ROUNDED CORNERS OPTIONAL.
SEATING PLANE
0.25 (0.010)
INCHES 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 0.050 0.008 0.015 0.110 0.130 0.295 0.305 0.020 0.040
MILLIMETERS 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 1.27 0.21 0.38 2.80 3.30 7.50 7.74 0.51 1.01
SOIC-16 SUFFIX CASE 751B-05 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.127 (0.005) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. MILLIMETERS 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 0.19 0.25 0.10 0.25 5.80 6.20 0.25 0.50 INCHES 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 0.008 0.009 0.004 0.009 0.229 0.244 0.010 0.019
0.25 (0.010)
SEATING PLANE
0.25 (0.010)
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MC74HC157A
PACKAGE DIMENSIONS
TSSOP-16 SUFFIX CASE 948F-01 ISSUE
0.10 (0.004) 0.15 (0.006)
IDENT.
0.15 (0.006)
0.25 (0.010)
DETAIL
0.10 (0.004) SEATING
PLANE
DETAIL
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SECTION
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSION DOES INCLUDE MOLD FLASH. PROTRUSIONS GATE BURRS. MOLD FLASH GATE BURRS SHALL EXCEED 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE INTERLEAD FLASH PROTRUSION. INTERLEAD FLASH PROTRUSION SHALL EXCEED 0.25 (0.010) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. TERMINAL NUMBERS SHOWN REFERENCE ONLY. DIMENSION DETERMINED DATUM PLANE -W-. MILLIMETERS 4.90 5.10 4.30 4.50 1.20 0.05 0.15 0.50 0.75 0.65 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 INCHES 0.193 0.200 0.169 0.177 0.047 0.002 0.006 0.020 0.030 0.026 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252
MC74HC157A
PACKAGE DIMENSIONS
SOEIAJ-16 SUFFIX CASE 966-01 ISSUE
DETAIL
VIEW
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD FLASH PROTRUSIONS MEASURED PARTING LINE. MOLD FLASH PROTRUSIONS SHALL EXCEED 0.15 (0.006) SIDE. TERMINAL NUMBERS SHOWN REFERENCE ONLY. LEAD WIDTH DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS LEAD WIDTH DIMENSION MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT LOCATED LOWER RADIUS FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS ADJACENT LEAD 0.46 0.018). MILLIMETERS 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 7.40 8.20 0.50 0.85 1.10 1.50 0.70 0.90 0.78 INCHES 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 0.291 0.323 0.020 0.033 0.043 0.059 0.028 0.035 0.031
0.13 (0.005)
0.10 (0.004)
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MC74HC157A
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MC74HC157A/D
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