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MC74HC14A Schmitt-Trigger Inverter
MC74HC14A identical pinout LS14, LS04 HC04. device inputs compatible with Standard CMOS outputs; with pullup resistors, they compatible with LSTTL outputs. HC14A useful "square slow input rise fall times. hysteresis voltage Schmitt trigger, HC14A finds applications noisy environments.
PDIP-14 SUFFIX CASE
Output Drive Capability: LSTTL Loads Outputs Directly Interface CMOS, NMOS Operating Voltage Range: Input Current: High Noise Immunity Characteristic CMOS Devices Compliance With JEDEC Standard Requirements Chip Complexity: FETs Equivalent Gates Pb-Free Packages Available
MC74HC14AN AWLYYWWG
SOIC-14 SUFFIX CASE 751A HC14AG AWLYWW
TSSOP-14 SUFFIX CASE 948G ALYWG
SOEIAJ-14 SUFFIX CASE Assembly Location Wafer Year Work Week Pb-Free Package (Note: Microdot either location) 74HC14A ALYWG
ORDERING INFORMATION
detailed ordering shipping information package dimensions section page this data sheet.
Semiconductor Components Industries, LLC, 2006
October, 2006 Rev.
Publication Order Number: MC74HC14A/D
MC74HC14A
Pinout: 14-Lead Packages (Top View)
LOGIC DIAGRAM
FUNCTION TABLE
Inputs Outputs
ORDERING INFORMATION
Device MC74HC14AN MC74HC14ANG MC74HC14AD MC74HC14ADG MC74HC14ADR2 MC74HC14ADR2G MC74HC14ADT MC74HC14ADTG MC74HC14ADTR2 MC74HC14ADTR2G MC74HC14AF MC74HC14AFG MC74HC14AFEL MC74HC14AFELG Package PDIP-14 PDIP-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) TSSOP-14* TSSOP-14* TSSOP-14* TSSOP-14* SOEIAJ-14 SOEIAJ-14 (Pb-Free) SOEIAJ-14* SOEIAJ-14* Units Rail 2500 Tape Reel Units Rail Units Rail Shipping
Units Rail
2500 Tape Reel
2000 Tape Reel
information tape reel specifications, including part orientation tape sizes, please refer Tape Reel Packaging Specifications Brochure, BRD8011/D. *This package inherently Pb-Free.
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MC74HC14A
MAXIMUM RATINGS
Symbol Vout Iout Parameter Value Unit Supply Voltage (Referenced GND) Input Voltage (Referenced GND) Output Voltage (Referenced GND) Input Current, Output Current, Supply Current, Pins Power Dissipation Still Air, Plastic SOIC Package TSSOP Package Tstg Storage Temperature Range Lead Temperature, from Case Seconds Plastic DIP, SOIC TSSOP Package
This device contains protection circuitry guard against damage high static voltages electric fields. However, precautions must taken avoid applications voltage higher than maximum rated voltages this high-impedance circuit. proper operation, Vout should constrained range (Vin Vout) VCC. Unused inputs must always tied appropriate logic voltage level (e.g., either VCC). Unused outputs must left open.
Stresses exceeding Maximum Ratings damage device. Maximum Ratings stress ratings only. Functional operation above Recommended Operating Conditions implied. Extended exposure stresses above Recommended Operating Conditions affect device reliability. Derating Plastic DIP: mW/_C from 125_C SOIC Package: mW/_C from 125_C TSSOP Package: mW/_C from 125_C high frequency heavy load considerations, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Unit Supply Voltage (Referenced GND)
Vin, Vout
Input Voltage, Output Voltage (Referenced GND)
Operating Temperature Range, Package Types Input Rise/Fall Time (Figure
Limit* Limit* Limit*
*When VCC,
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MC74HC14A
CHARACTERISTICS (Voltages Referenced GND)
Symbol Parameter Maximum Positive-Going Input Threshold Voltage (Figure Minimum Positive-Going Input Threshold Voltage (Figure Maximum Negative-Going Input Threshold Voltage (Figure Minimum Negative-Going Input Threshold Voltage (Figure Maximum Hysteresis Voltage (Figure Condition Vout 0.1V |Iout| 20mA |Iout| 2.4mA |Iout| 4.0mA |Iout| 5.2mA |Iout| 2.4mA |Iout| 4.0mA |Iout| 5.2mA Guaranteed Limit 25°C 1.50 2.15 3.15 4.20 1.20 1.65 2.25 3.00 0.20 0.25 0.40 0.50 2.48 3.98 5.48 0.26 0.26 0.26 ±0.1 85°C 1.50 2.15 3.15 4.20 0.95 1.45 2.25 2.95 0.95 1.45 2.05 2.65 1.20 1.65 2.25 3.00 0.20 0.25 0.40 0.50 2.34 3.84 5.34 0.33 0.33 0.33 ±1.0 125°C 1.50 2.15 3.15 4.20 0.95 1.45 2.25 2.95 0.95 1.45 2.05 2.65 1.20 1.65 2.25 3.00 0.20 0.25 0.40 0.50 2.20 3.70 5.20 0.40 0.40 0.40 ±1.0 Unit
Vout 0.1V |Iout| 20mA
Vout 0.1V |Iout| 20mA
Vout 0.1V |Iout| 20mA
VHmax Note
Vout 0.1V 0.1V |Iout| 20mA
VHmin Note
Minimum Hysteresis Voltage (Figure
Vout 0.1V 0.1V |Iout| 20mA
Minimum High-Level Output Voltage
|Iout| 20mA
Maximum Low-Level Output Voltage
|Iout| 20mA
Maximum Input Leakage Current Maximum Quiescent Supply Current (per Package)
Iout
Information typical parametric values along with frequency heavy load considerations found Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). VHmin (VT+ min) (VT- max); VHmax (VT+ max) (VT- min).
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MC74HC14A
CHARACTERISTICS 50pF, Input 6ns)
Symbol tPLH, tPHL Parameter Maximum Propagation Delay, Input Output (Figures Guaranteed Limit 25°C 85°C 125°C Unit
tTLH, tTHL
Maximum Output Transition Time, Output (Figures
Maximum Input Capacitance
NOTE: propagation delays with loads other than information typical parametric values, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). Typical 25°C, Power Dissipation Capacitance (Per Inverter)* Used determine no-load dynamic power consumption: load considerations, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D).
tPLH OUTPUT tTLH
INPUT
tPHL
tTHL
Figure Switching Waveforms
TEST POINT OUTPUT DEVICE UNDER TEST
*Includes probe capacitance
Figure Test Circuit
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MC74HC14A
TYPICAL INPUT THRESHOLD VOLTAGE (VOLTS
(VT+) VHtyp
(VT-)
VCC, POWER SUPPLY VOLTAGE (VOLTS) VHtyp (VT+ typ) (VT- typ)
Figure Typical Input Threshold, VT+, versus Power Supply Voltage
Schmitt-Trigger Squares Inputs With Slow Rise Fall Times Vout Vout
Schmitt-Trigger Offers Maximum Noise Immunity
Figure Typical Schmitt-Trigger Applications
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MC74HC14A
PACKAGE DIMENSIONS
PDIP-14 CASE 646-06 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION CENTER LEADS WHEN FORMED PARALLEL. DIMENSION DOES INCLUDE MOLD FLASH. ROUNDED CORNERS OPTIONAL. INCHES 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 0.052 0.095 0.008 0.015 0.115 0.135 0.290 0.310 0.015 0.039 MILLIMETERS 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 1.32 2.41 0.20 0.38 2.92 3.43 7.37 7.87 0.38 1.01
SEATING PLANE
0.13 (0.005)
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MC74HC14A
PACKAGE DIMENSIONS
SOIC-14 CASE 751A-03 ISSUE
0.25 (0.010)
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.127 (0.005) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION.
SEATING PLANE
0.25 (0.010)
MILLIMETERS 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 0.19 0.25 0.10 0.25 5.80 6.20 0.25 0.50
INCHES 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 0.008 0.009 0.004 0.009 0.228 0.244 0.010 0.019
SOLDERING FOOTPRINT*
7.04 0.58
1.52
1.27 PITCH
DIMENSIONS: MILLIMETERS
*For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D.
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MC74HC14A
PACKAGE DIMENSIONS
TSSOP-14 CASE 948G-01 ISSUE
0.10 (0.004) 0.15 (0.006)
0.25 (0.010)
IDENT.
DETAIL
0.15 (0.006)
SECTION
0.10 (0.004) SEATING
PLANE
DETAIL
SOLDERING FOOTPRINT*
7.06
0.36
1.26
*For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D.
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NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSION DOES INCLUDE MOLD FLASH, PROTRUSIONS GATE BURRS. MOLD FLASH GATE BURRS SHALL EXCEED 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE INTERLEAD FLASH PROTRUSION. INTERLEAD FLASH PROTRUSION SHALL EXCEED 0.25 (0.010) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. TERMINAL NUMBERS SHOWN REFERENCE ONLY. DIMENSION DETERMINED DATUM PLANE -W-. MILLIMETERS INCHES 4.90 5.10 0.193 0.200 4.30 4.50 0.169 0.177 1.20 0.047 0.05 0.15 0.002 0.006 0.50 0.75 0.020 0.030 0.65 0.026 0.50 0.60 0.020 0.024 0.09 0.20 0.004 0.008 0.09 0.16 0.004 0.006 0.19 0.30 0.007 0.012 0.19 0.25 0.007 0.010 6.40 0.252
0.65 PITCH
DIMENSIONS: MILLIMETERS
MC74HC14A
PACKAGE DIMENSIONS
SOEIAJ-14 CASE 965-01 ISSUE
DETAIL
VIEW
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD FLASH PROTRUSIONS MEASURED PARTING LINE. MOLD FLASH PROTRUSIONS SHALL EXCEED 0.15 (0.006) SIDE. TERMINAL NUMBERS SHOWN REFERENCE ONLY. LEAD WIDTH DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS LEAD WIDTH DIMENSION MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT LOCATED LOWER RADIUS FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS ADJACENT LEAD 0.46 0.018). 0.50 MILLIMETERS 2.05 0.05 0.20 0.35 0.50 0.10 0.20 9.90 10.50 5.10 5.45 1.27 7.40 8.20 0.50 0.85 1.10 1.50 0.70 0.90 1.42 INCHES 0.081 0.002 0.008 0.014 0.020 0.004 0.008 0.390 0.413 0.201 0.215 0.050 0.291 0.323 0.020 0.033 0.043 0.059 0.028 0.035 0.056
0.13 (0.005)
0.10 (0.004)
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MC74HC14A/D
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