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MC74HC132A identical pinout LS132. device inputs compatible with stand
Top Searches for this datasheetMC74HC132A Quad 2-Input NAND Gate with Schmitt-Trigger Inputs MC74HC132A identical pinout LS132. device inputs compatible with standard CMOS outputs; with pull-up resistors, they compatible with LSTTL outputs. HC132A used enhance noise immunity square slowly changing waveforms. Output Drive Capability: LSTTL Loads Outputs Directly Interface CMOS, NMOS, Operating Voltage Range: Input Current: High Noise Immunity Characteristic CMOS Devices Compliance with Requirements Defined JEDEC Standard Chip Complexity: FETs Equivalent Gates Pb-Free Packages Available PDIP-14 SUFFIX CASE SOIC-14 SUFFIX CASE 751A MC74HC132AN AWLYYWWG HC132AG AWLYWW TSSOP-14 SUFFIX CASE 948G 132A ALYWG SOEIAJ-14 SUFFIX CASE Assembly Location Wafer Year Work Week Pb-Free Package (Note: Microdot either location) 74HC132A ALYWG Figure Assignment FUNCTION TABLE Inputs Output ORDERING INFORMATION detailed ordering shipping information package dimensions section page this data sheet. Semiconductor Components Industries, LLC, 2006 December, 2006 Rev. Publication Order Number: MC74HC132A/D MC74HC132A Figure Logic Diagram ORDERING INFORMATION Device MC74HC132AN MC74HC132ANG MC74HC132AD MC74HC132ADG MC74HC132ADR2 MC74HC132ADR2G MC74HC132ADT MC74HC132ADTR2 MC74HC132ADTR2G MC74HC132AFELG Package PDIP-14 PDIP-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) TSSOP-14* TSSOP-14* TSSOP-14* SOEIAJ-14 (Pb-Free) 2500 Tape Reel 2000 Tape Reel 2500 Tape Reel Units Rail Units Rail Tape Ammo Shipping information tape reel specifications, including part orientation tape sizes, please refer Tape Reel Packaging Specifications Brochure, BRD8011/D. *This package inherently Pb-Free. http://onsemi.com MC74HC132A MAXIMUM RATINGS Symbol VOUT IOUT IGND TSTG Positive Supply Voltage Digital Input Voltage Output Voltage Input Diode Current Output Diode Current Output Current, Supply Current, Pins Ground Current Ground Storage Temperature Range Lead Temperature, from Case Seconds Junction Temperature Under Bias Thermal Resistance 14-PDIP 14-SOIC 14-TSSOP PDIP SOIC TSSOP Output 3-State High State Parameter Value *0.5 )7.0 *0.5 )7.0 *0.5 )7.0 *0.5 )0.5 )150 )150 Level Oxygen Index: Human Body Model (Note Machine Model (Note Charged Device Model (Note Above Below 85_C (Note 0.125 u2000 u100 u500 $300 Unit _C/W Power Dissipation Still 85_C VESD Moisture Sensitivity Flammability Rating Withstand Voltage ILatch-Up Latch-Up Performance Stresses exceeding Maximum Ratings damage device. Maximum Ratings stress ratings only. Functional operation above Recommended Operating Conditions implied. Extended exposure stresses above Recommended Operating Conditions affect device reliability. Tested EIA/JESD22-A114-A. Tested EIA/JESD22-A115-A. Tested JESD22-C101-A. Tested EIA/JESD78. high frequency heavy load considerations, Chapter 2the Semiconductor High-Speed CMOS Data Book (DL129/D). RECOMMENDED OPERATING CONDITIONS Symbol Parameter Supply Voltage (Referenced GND) Unit VIN, VOUT Input Voltage, Output Voltage (Referenced GND) Operating Temperature, Package Types Input Rise Fall Time (Figure )125 Limit (Note When VCC, quiescent current. Unused inputs left open. inputs must tied high-logic voltage level low-logic input voltage level. http://onsemi.com MC74HC132A ELECTRICAL CHARACTERISTICS (Voltages Referenced GND) Symbol VT+max Parameter Maximum Positive-Going Input Threshold Voltage (Figure Minimum Positive-Going Input Threshold Voltage (Figure Test Conditions VOUT |IOUT| VOUT |IOUT| Guaranteed Limit *55_C 25_C 3.15 v85_C 3.15 0.95 2.25 2.95 0.95 2.05 2.65 v125_C 3.15 Unit VT+min 0.95 2.25 2.95 0.95 2.05 2.65 VT-max Maximum Negative-Going Input Threshold Voltage (Figure Minimum Negative-Going Input Threshold Voltage (Figure Maximum Hysteresis Voltage (Figure Minimum Hysteresis Voltage (Figure VOUT |IOUT| VOUT |IOUT| VT-min VHmax (Note VOUT |IOUT| VOUT |IOUT| VT-min VT+max |IOUT| 2.25 2.25 2.25 VHmin (Note Minimum High-Level Output Voltage -VT-min VT+max |IOUT| |IOUT| 3.98 5.48 3.84 5.34 Maximum Low-Level Output Voltage VT+max |IOUT| VT+max |IOUT| |IOUT| 0.26 0.26 0.33 0.33 Maximum Input Leakage Current Maximum Quiescent Supply Current (per Package) IOUT $0.1 $1.0 $1.0 VHmin (VT+min) (VT-max); VHmax (VT+max) (VT-min). Information typical parametric values found Semiconductor High-Speed CMOS Data Book (DL129/D). http://onsemi.com MC74HC132A ELECTRICAL CHARACTERISTICS Input Symbol tPLH, tPHL tTLH, tTHL Parameter Maximum Propagation Delay, Input Output (Figures Maximum Output Transition Time, Output (Figures Maximum Input Capacitance Guaranteed Limit *55_C 25_C v85_C v125_C Unit propagation delays with loads other than information typical parametric values, Semiconductor High-Speed CMOS Data Book (DL129/D). Typical 25°C, Power Dissipation Capacitance (per Gate) (Note Used determine no-load dynamic power consumption: Semiconductor High-Speed CMOS Data Book (DL129/D). load considerations, TEST POINT INPUT tTHL tPHL tTLH *Includes probe capacitance tPLH DEVICE UNDER TEST OUTPUT Figure Switching Waveforms Figure Test Circuit http://onsemi.com MC74HC132A TYPICAL INPUT THRESHOLD VOLTAGE (VOLTS) VHtyp VCC, POWER SUPPLY VOLTAGE (VOLTS) VHtyp typ) typ) Figure Typical Input Threshold, VT+, Versus Power Supply Voltage VOUT VOUT SCHMITT TRIGGER SQUARES INPUTS WITH SLOW RISE FALL TIMES VOUT SCHMITT TRIGGER OFFERS MAXIMUM NOISE IMMUNITY Figure Typical Schmitt-Trigger Applications http://onsemi.com MC74HC132A PACKAGE DIMENSIONS PDIP-14 CASE 646-06 ISSUE NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION CENTER LEADS WHEN FORMED PARALLEL. DIMENSION DOES INCLUDE MOLD FLASH. ROUNDED CORNERS OPTIONAL. INCHES 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 0.052 0.095 0.008 0.015 0.115 0.135 0.290 0.310 0.015 0.039 MILLIMETERS 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 1.32 2.41 0.20 0.38 2.92 3.43 7.37 7.87 0.38 1.01 SEATING PLANE 0.13 (0.005) http://onsemi.com MC74HC132A PACKAGE DIMENSIONS SOIC-14 CASE 751A-03 ISSUE 0.25 (0.010) NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.127 (0.005) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. SEATING PLANE 0.25 (0.010) MILLIMETERS 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 0.19 0.25 0.10 0.25 5.80 6.20 0.25 0.50 INCHES 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 0.008 0.009 0.004 0.009 0.228 0.244 0.010 0.019 SOLDERING FOOTPRINT* 7.04 1.52 0.58 1.27 PITCH DIMENSIONS: MILLIMETERS *For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com MC74HC132A PACKAGE DIMENSIONS TSSOP-14 CASE 948G-01 ISSUE 0.10 (0.004) 0.15 (0.006) 0.25 (0.010) IDENT. DETAIL 0.15 (0.006) SECTION 0.10 (0.004) SEATING PLANE DETAIL SOLDERING FOOTPRINT* 7.06 0.36 1.26 *For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSION DOES INCLUDE MOLD FLASH, PROTRUSIONS GATE BURRS. MOLD FLASH GATE BURRS SHALL EXCEED 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE INTERLEAD FLASH PROTRUSION. INTERLEAD FLASH PROTRUSION SHALL EXCEED 0.25 (0.010) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. TERMINAL NUMBERS SHOWN REFERENCE ONLY. DIMENSION DETERMINED DATUM PLANE -W-. MILLIMETERS 4.90 5.10 4.30 4.50 1.20 0.05 0.15 0.50 0.75 0.65 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 INCHES 0.193 0.200 0.169 0.177 0.047 0.002 0.006 0.020 0.030 0.026 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 0.65 PITCH DIMENSIONS: MILLIMETERS MC74HC132A PACKAGE DIMENSIONS SOEIAJ-14 CASE 965-01 ISSUE DETAIL VIEW NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD FLASH PROTRUSIONS MEASURED PARTING LINE. MOLD FLASH PROTRUSIONS SHALL EXCEED 0.15 (0.006) SIDE. TERMINAL NUMBERS SHOWN REFERENCE ONLY. LEAD WIDTH DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS LEAD WIDTH DIMENSION MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT LOCATED LOWER RADIUS FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS ADJACENT LEAD 0.46 0.018). 0.50 MILLIMETERS 2.05 0.05 0.20 0.35 0.50 0.10 0.20 9.90 10.50 5.10 5.45 1.27 7.40 8.20 0.50 0.85 1.10 1.50 0.70 0.90 1.42 INCHES 0.081 0.002 0.008 0.014 0.020 0.004 0.008 0.390 0.413 0.201 0.215 0.050 0.291 0.323 0.020 0.033 0.043 0.059 0.028 0.035 0.056 0.13 (0.005) 0.10 (0.004) Semiconductor registered trademarks Semiconductor Components Industries, (SCILLC). SCILLC reserves right make changes without further notice products herein. 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