MC74HC03A identical pinout LS03. device inputs compatible with Standar

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MC74HC03A identical pinout LS03. device inputs compatible with Standar

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MC74HC03A Quad 2-Input NAND Gate with Open-Drain Outputs
MC74HC03A identical pinout LS03. device inputs compatible with Standard CMOS outputs; with pullup resistors, they compatible with LSTTL outputs. HC03A NAND gate has, outputs, high-performance N-Channel transistor. This NAND gate can, therefore, with suitable pullup resistor, used wired-AND applications. Having output characteristic curves given this data sheet, this device used driver other application that only requires sinking current.
PDIP-14 SUFFIX CASE SOIC-14 SUFFIX CASE 751A HC03AG AWLYWW
MC74HC03AN AWLYYWWG
Output Drive Capability: LSTTL Loads With Suitable Pullup
Resistor Outputs Directly Interface CMOS, NMOS High Noise Immunity Characteristic CMOS Devices Operating Voltage Range: Input Current: Compliance With JEDEC Standard Requirements Chip Complexity: FETs Equivalent Gates Pb-Free Packages Available
LOGIC DIAGRAM
Denotes open-drain outputs OUTPUT PROTECTION DIODE
TSSOP-14 SUFFIX CASE 948G
ALYWG
3,6,8,11
Assembly Location Wafer Year Work Week Pb-Free Package (Note: Microdot either location)
1,4,9,12 2,5,10,13
FUNCTION TABLE
Inputs Output
Pinout: 14-Lead Packages (Top View)
High Impedance
ORDERING INFORMATION
detailed ordering shipping information package dimensions section page this data sheet.
Semiconductor Components Industries, LLC, 2006
October, 2006 Rev.
Publication Order Number: MC74HC03A/D
MC74HC03A
MAXIMUM RATINGS
Symbol Vout Iout Parameter Value Unit Supply Voltage (Referenced GND) Input Voltage (Referenced GND) Input Current, Output Voltage (Referenced GND) Output Current, Supply Current, Pins Power Dissipation Still Plastic SOIC Package TSSOP Package Tstg Storage Temperature Lead Temperature, from Case Seconds Plastic DIP, SOIC TSSOP Package
This device contains protection circuitry guard against damage high static voltages electric fields. However, precautions must taken avoid applications voltage higher than maximum rated voltages this high-impedance circuit. proper operation, Vout should constrained range (Vin Vout) VCC. Unused inputs must always tied appropriate logic voltage level (e.g., either VCC). Unused outputs must left open.
Stresses exceeding Maximum Ratings damage device. Maximum Ratings stress ratings only. Functional operation above Recommended Operating Conditions implied. Extended exposure stresses above Recommended Operating Conditions affect device reliability. Derating Plastic DIP: mW/_C from 125_C SOIC Package: mW/_C from 125_C TSSOP Package: mW/_C from 125_C high frequency heavy load considerations, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Supply Voltage (Referenced GND) Vin, Vout Input Voltage, Output Voltage (Referenced GND) Operating Temperature, Package Types Input Rise Fall Time (Figure 1000
Symbol
Parameter
Unit
DESIGN GUIDE
Criteria
Value
Unit
Internal Gate Count* Internal Gate Propagation Delay Internal Gate Power Dissipation Speed Power Product *Equivalent two-input NAND gate
0.0075
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MC74HC03A
ORDERING INFORMATION
Device MC74HC03AN MC74HC03ANG MC74HC03AD MC74HC03ADG MC74HC03ADR2 MC74HC03ADR2G MC74HC03ADTR2 MC74HC03ADTR2G MC74HC03AFEL MC74HC03AFELG Package PDIP-14 PDIP-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) TSSOP-14* TSSOP-14* SOEIAJ-14 SOEIAJ-14 (Pb-Free) 2000/Tape Reel 2500/Tape Reel Units/Rail Units/Rail Shipping
information tape reel specifications, including part orientation tape sizes, please refer Tape Reel Packaging Specifications Brochure, BRD8011/D. *This package inherently Pb-Free.
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MC74HC03A
CHARACTERISTICS (Voltages Referenced GND)
Symbol Parameter Minimum High-Level Input Voltage Condition Vout 0.1V -0.1V |Iout| 20mA Guaranteed Limit 25°C 1.50 2.10 3.15 4.20 0.50 0.90 1.35 1.80 0.26 0.26 0.26 ±0.1 ±0.5 85°C 1.50 2.10 3.15 4.20 0.50 0.90 1.35 1.80 0.33 0.33 0.33 ±1.0 ±5.0 125°C 1.50 2.10 3.15 4.20 0.50 0.90 1.35 1.80 0.40 0.40 0.40 ±1.0 Unit
Maximum Low-Level Input Voltage
Vout 0.1V 0.1V |Iout| 20mA
Maximum Low-Level Output Voltage
Vout 0.1V 0.1V |Iout| 20mA |Iout| 2.4mA |Iout| 4.0mA |Iout| 5.2mA
Maximum Input Leakage Current Maximum Quiescent Supply Current (per Package) Maximum Three-State Leakage Current
Iout Output High-Impedance State Vout
NOTE: Information typical parametric values found Chapter Semiconductor High-Speed CMOS Data Book (DL129/D).
CHARACTERISTICS 50pF, Input 6ns)
Symbol tPLZ, tPZL Parameter Maximum Propagation Delay, Input Output (Figures Guaranteed Limit 25°C 85°C 125°C Unit
tTLH, tTHL
Maximum Output Transition Time, Output (Figures
Cout
Maximum Input Capacitance Maximum Three-State Output Capacitance (Output High-Impedance State)
NOTE: propagation delays with loads other than information typical parametric values, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). Typical 25°C, Power Dissipation Capacitance (Per Buffer)*
Used determine no-load dynamic power consumption: Semiconductor High-Speed CMOS Data Book (DL129/D).
load considerations, Chapter
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MC74HC03A
INPUT tPZL OUTPUT tTHL tPLZ HIGH IMPEDANCE *Includes probe capacitance DEVICE UNDER TEST
OUTPUT
TEST POINT
Figure Switching Waveforms
TYPICAL T=25°C SINK CURRENT (mA) T=25°C T=85°C T=125°C EXPECTED MINIMUM* VCC=5V
Figure Test Circuit
OUTPUT VOLTAGE (VOLTS)
*The expected minimum curves guarantees, design aids.
Figure Open-Drain Output Characteristics
PULLUP RESISTOR
HC03 HC03
LED1
HC03 HC03
OUTPUT
LED2 ENABLE
DESIGN EXAMPLE CONDITIONS: ID^10mA TYPICAL CURVE, ID=10mA, VDS^0.4V 1.7V 0.4V 10mA 290W 270W
HC03
OUTPUT A1B1 A2B2 AnBn
Figure Wired
Figure Driver With Blanking http://onsemi.com
MC74HC03A
PACKAGE DIMENSIONS
PDIP-14 CASE 646-06 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION CENTER LEADS WHEN FORMED PARALLEL. DIMENSION DOES INCLUDE MOLD FLASH. ROUNDED CORNERS OPTIONAL. INCHES 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 0.052 0.095 0.008 0.015 0.115 0.135 0.290 0.310 0.015 0.039 MILLIMETERS 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 1.32 2.41 0.20 0.38 2.92 3.43 7.37 7.87 0.38 1.01
SEATING PLANE
0.13 (0.005)
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MC74HC03A
PACKAGE DIMENSIONS
SOIC-14 CASE 751A-03 ISSUE
0.25 (0.010)
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.127 (0.005) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION.
SEATING PLANE
0.25 (0.010)
MILLIMETERS 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 0.19 0.25 0.10 0.25 5.80 6.20 0.25 0.50
INCHES 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 0.008 0.009 0.004 0.009 0.228 0.244 0.010 0.019
SOLDERING FOOTPRINT*
7.04 0.58
1.52
1.27 PITCH
DIMENSIONS: MILLIMETERS
*For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D.
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MC74HC03A
PACKAGE DIMENSIONS
TSSOP-14 CASE 948G-01 ISSUE
0.10 (0.004) 0.15 (0.006)
0.25 (0.010)
IDENT.
DETAIL
0.15 (0.006)
SECTION
0.10 (0.004) SEATING
PLANE
DETAIL
SOLDERING FOOTPRINT*
7.06
0.36
1.26
*For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D.
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NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSION DOES INCLUDE MOLD FLASH, PROTRUSIONS GATE BURRS. MOLD FLASH GATE BURRS SHALL EXCEED 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE INTERLEAD FLASH PROTRUSION. INTERLEAD FLASH PROTRUSION SHALL EXCEED 0.25 (0.010) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. TERMINAL NUMBERS SHOWN REFERENCE ONLY. DIMENSION DETERMINED DATUM PLANE -W-. MILLIMETERS INCHES 4.90 5.10 0.193 0.200 4.30 4.50 0.169 0.177 1.20 0.047 0.05 0.15 0.002 0.006 0.50 0.75 0.020 0.030 0.65 0.026 0.50 0.60 0.020 0.024 0.09 0.20 0.004 0.008 0.09 0.16 0.004 0.006 0.19 0.30 0.007 0.012 0.19 0.25 0.007 0.010 6.40 0.252
0.65 PITCH
DIMENSIONS: MILLIMETERS
MC74HC03A
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MC74HC03A/D

MC74HC03A identical pinout LS03. device inputs compatible with Standar

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