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MC74ACT640 octal transceiver designed asynchronous two-way communicati
Top Searches for this datasheetMC74ACT640 Octal 3-State Inverting Transciever MC74ACT640 octal transceiver designed asynchronous two-way communication between data buses. device transmits data from when HIGH, from when LOW. enable input used disable device buses effectively isolated. Bidirectional Data Path Outputs Sink mA/Source Compatible Inputs Pb-Free Packages Available* PDIP-20 SUFFIX CASE SOIC-20W SUFFIX CASE 751D SOEIAJ-20 SUFFIX CASE Figure Pinout: 20-Lead Packages Conductors (Top View) ORDERING INFORMATION Device MC74ACT640N MC74ACT640NG MC74ACT640DW MC74ACT640DWG MC74ACT640DWR2 Package PDIP-20 PDIP-20 (Pb-Free) SOIC-20 SOIC-20 (Pb-Free) SOIC-20 SOIC-20 (Pb-Free) Shipping Units/Rail Units/Rail Units/Rail Units/Rail 1000 Tape Reel 1000 Tape Reel ASSIGNMENT A0-A7 B0-B7 FUNCTION Side Inputs 3-State Outputs Output Enable Input Transmit/Receive Input Side Inputs 3-State Outputs TRUTH TABLE Applied Inputs Valid Direction I/PO/P MC74ACT640DWR2G Output MC74ACT640MEL MC74ACT640MELG SOEIAJ-20 2000 Tape Reel SOEIAJ-20 2000 Tape (Pb-Free) Reel HIGH Voltage Level Voltage Level Immaterial *For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2006 information tape reel specifications, including part orientation tape sizes, please refer Tape Reel Packaging Specifications Brochure, BRD8011/D. DEVICE MARKING INFORMATION general marking information device marking section page this data sheet. December, 2006 Rev. Publication Order Number: MC74ACT640/D MC74ACT640 MAXIMUM RATINGS Symbol IGND TSTG VESD Supply Voltage Input Voltage Output Voltage Input Diode Current Output Diode Current Output Sink/Source Current Supply Current Output Ground Current Output Storage Temperature Range Lead temperature, from Case Seconds Junction temperature under Bias Thermal resistance Power Dissipation Still 85_C Moisture Sensitivity Flammability Rating Withstand Voltage Oxygen Index: Human Body Model (Note Machine Model (Note Charged Device Model (Note Above Below 85_C (Note PDIP SOIC PDIP SOIC (Note Parameter Value *0.5 )7.0 *0.5 )0.5 *0.5 )0.5 )150 )150 Level 0.125 2000 1000 $100 Unit _C/W ILatchup Latchup Performance Stresses exceeding Maximum Ratings damage device. Maximum Ratings stress ratings only. Functional operation above Recommended Operating Conditions implied. Extended exposure stresses above Recommended Operating Conditions affect device reliability. absolute maximum rating must observed. Tested EIA/JESD22-A114-A. Tested EIA/JESD22-A115-A. Tested JESD22-C101-A. Tested EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Vin, Vout Parameter Input Voltage (Referenced GND) Input Voltage, Output Voltage (Referenced GND) Operating Temperature, Package Types Input Rise Fall Time (Note Junction Temperature (PDIP) Output Current High Output Current Unit ns/V Unused Inputs left open. inputs must tied high voltage level logic voltage level. from refer individual Data Sheets devices that differ from typical input rise fall times. http://onsemi.com MC74ACT640 CHARACTERISTICS +255C 4.49 5.49 -405C +855C Unit Conditions VOUT VOUT IOUT *VIN IOUT *VIN VCC, (OE) VIL, VCC, VCC, VOLD 1.65 Symbol Parameter Minimum High Level Input Voltage Guaranteed Limits 3.86 4.86 3.76 4.76 0.44 0.44 ±1.0 ±0.5 ±5.0 Maximum Level Input Voltage Minimum High Level Output Voltage Maximum Level Output Voltage 0.001 0.001 0.36 0.36 ±0.1 DICCT Maximum Input Leakage Current Additional Max. ICC/Input Maximum 3-State Current IOLD IOHD Minimum Dynamic Output Current Maximum Quiescent Supply Current *All outputs loaded; thresholds input associated with output under test. Maximum test duration output loaded time. CHARACTERISTICS (For Figures Waveforms, Figures VCC* +255C 10.0 10.0 10.0 10.0 -405C +855C 11.0 11.0 11.0 11.0 Unit Symbol tPLH tPHL tPZH tPZL tPHZ tPLZ Propagation Delay Propagation Delay Output Enable Time Output Enable Time Output Disable Time Output Disable Time Parameter *Voltage Range ±0.5 CAPACITANCE Symbol CI/O Input Capacitance Input/Output Capacitance Power Dissipation Capacitance Parameter Value Unit Test Conditions http://onsemi.com MC74ACT640 SWITCHING WAVEFORMS INPUT tPHL OUTPUT tTHL tTLH tPLH tPZL tPLZ tPZH tPHZ HIGH IMPEDANCE HIGH IMPEDANCE Figure Figure INPUT OUTPUT DEVICE UNDER TEST SCOPE TEST POINT *Includes probe capacitance Figure Test Circuit MARKING DIAGRAMS PDIP-20 SOIC-20W SOEIAJ-20 MC74ACT640N AWLYYWWG ACT640 AWLYYWWG 74ACT640 AWLYWWG Assembly Location Wafer Year Work Week Pb-Free Package http://onsemi.com MC74ACT640 PACKAGE DIMENSIONS PDIP-20 SUFFIX PLASTIC PACKAGE CASE 738-03 ISSUE NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION CENTER LEAD WHEN FORMED PARALLEL. DIMENSION DOES INCLUDE MOLD FLASH. SEATING PLANE 0.25 (0.010) 0.25 (0.010) INCHES 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 0.050 0.070 0.100 0.008 0.015 0.110 0.140 0.300 0.020 0.040 MILLIMETERS 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 1.27 1.77 2.54 0.21 0.38 2.80 3.55 7.62 0.51 1.01 SOIC-20W SUFFIX CASE 751D-05 ISSUE 0.25 NOTES: DIMENSIONS MILLIMETERS. INTERPRET DIMENSIONS TOLERANCES ASME Y14.5M, 1994. DIMENSIONS INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL 0.13 TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. MILLIMETERS 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 10.05 10.55 0.25 0.75 0.50 0.90 0.25 SEATING PLANE http://onsemi.com MC74ACT640 PACKAGE DIMENSIONS SOEIAJ-20 SUFFIX CASE 967-01 ISSUE DETAIL VIEW NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD FLASH PROTRUSIONS MEASURED PARTING LINE. MOLD FLASH PROTRUSIONS SHALL EXCEED 0.15 (0.006) SIDE. TERMINAL NUMBERS SHOWN REFERENCE ONLY. LEAD WIDTH DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS LEAD WIDTH DIMENSION MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT LOCATED LOWER RADIUS FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS ADJACENT LEAD 0.46 0.018). MILLIMETERS 2.05 0.05 0.20 0.35 0.50 0.15 0.25 12.35 12.80 5.10 5.45 1.27 7.40 8.20 0.50 0.85 1.10 1.50 0.70 0.90 0.81 INCHES 0.081 0.002 0.008 0.014 0.020 0.006 0.010 0.486 0.504 0.201 0.215 0.050 0.291 0.323 0.020 0.033 0.043 0.059 0.028 0.035 0.032 0.13 (0.005) 0.10 (0.004) Semiconductor registered trademarks Semiconductor Components Industries, (SCILLC). SCILLC reserves right make changes without further notice products herein. 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