MC74ACT564 high-speed, power octal flip-flop with buffered common Cloc

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MC74ACT564 high-speed, power octal flip-flop with buffered common Cloc

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MC74ACT564 Octal D-Type Flip-Flop with 3-State Outputs
MC74ACT564 high-speed, power octal flip-flop with buffered common Clock (CP) buffered common Output Enable (OE). information presented inputs stored flip-flops LOW-to-HIGH Clock (CP) transition. MC74ACT564 device functionally indentical MC74ACT574, with inverted outputs.
Inputs Outputs Opposite Sides Package Allowing
Easy Interface with Microprocessors Useful Input Output Port Microprocessor Functionally Indentical MC74ACT574 with Inverted Outputs 3-State Outputs Bus-Oriented Applications Outputs Source/Sink Compatible Inputs Pb-Free Packages Available*
PDIP-20 SUFFIX CASE
SOIC-20W SUFFIX CASE 751D
ORDERING INFORMATION
detailed ordering shipping information package dimensions section page this data sheet.
DEVICE MARKING INFORMATION
general marking information device marking section page this data sheet.
Figure Pinout: 20-Lead Packages Conductors
(Top View)
ASSIGNMENT
D0-D7 O0-O7 FUNCTION Data Inputs Clock Pulse Input 3-State Output Enable Input 3-State Outputs
Figure Logic Symbol
*For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2006
December, 2006 Rev.
Publication Order Number: MC74ACT564/D
MC74ACT564
Please note that this diagram provided only understanding logic operations should used estimate propagation delays.
Figure Logic Diagram
FUNCTION TABLE
Inputs Internal Outputs Function Hold Hold Load Load Data Available Data Available Change Data Change Data
HIGH Voltage Level Voltage Level Immaterial High Impedance LOW-to-HIGH Transition Change
FUNCTIONAL DESCRIPTION MC74ACT564 consists eight edge-triggered flip-flops with individual D-type inputs 3-state complementary outputs. buffered clock buffered Output Enable common flip-flops. eight flip-flops will store state their individual inputs that
meet setup hold times requirements LOW-to-HIGH Clock (CP) transition. With Output Enable (OE) LOW, contents eight flip-flops available outputs. When HIGH, outputs high impedance state. Operation input does affect state flip-flops.
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MC74ACT564
MAXIMUM RATINGS
Symbol IGND TSTG VESD Supply Voltage Input Voltage Output Voltage Input Diode Current Output Diode Current Output Sink/Source Current Supply Current Output Ground Current Output Storage Temperature Range Lead Temperature, from Case Seconds Junction Temperature under Bias Thermal Resistance Power Dissipation Still 85_C Moisture Sensitivity Flammability Rating Oxygen Index: PDIP SOIC PDIP SOIC (Note Parameter Value *0.5 )7.0 *0.5 )0.5 *0.5 )0.5 )150 )150 Level 94-V0 0.125 2000 1000 $100 Unit _C/W
Withstand Voltage Human Body Model (Note Machine Model (Note Charged Device Model (Note Latchup Performance Above Below 85_C (Note
ILatchup
Stresses exceeding Maximum Ratings damage device. Maximum Ratings stress ratings only. Functional operation above Recommended Operating Conditions implied. Extended exposure stresses above Recommended Operating Conditions affect device reliability. absolute maximum rating must observed. Tested EIA/JESD22-A114-A. Tested EIA/JESD22-A115-A. Tested JESD22-C101-A. Tested EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol Vin, Vout Parameter Input Voltage (Referenced GND) Input Voltage, Output Voltage (Referenced GND) Operating Temperature, Package Types Input Rise Fall Time (Note Junction Temperature (PDIP) Output Current High Output Current Unit ns/V
Unused Inputs left open. inputs must tied high voltage level logic voltage level. from refer individual Data Sheets devices that differ from typical input rise fall times.
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MC74ACT564
CHARACTERISTICS
+255C 4.49 5.49 3.86 4.86 0.001 0.001 0.36 0.36 ±0.1 ±0.5 -405C +855C Unit Conditions VOUT VOUT IOUT *VIN IOUT *VIN VCC, (OE) VIL, VCC, VCC, VOLD 1.65 VOHD 3.85
Symbol
Parameter Minimum High Level Input Voltage
Guaranteed Limits 3.76 4.76 0.44 0.44 ±1.0 ±5.0
Maximum Level Input Voltage
Minimum High Level Output Voltage
Maximum Level Output Voltage
DICCT
Maximum Input Leakage Current Additional Max. ICC/Input Maximum 3-State Current
IOLD IOHD
Minimum Dynamic Output Current Maximum Quiescent Supply Current
*All outputs loaded; thresholds input associated with output under test. Maximum test duration output loaded time.
CHARACTERISTICS (For Figures Waveforms, Figures
Symbol fmax tPLH tPHL tPZH tPZL tPHZ tPLZ Parameter Maximum Clock Frequency Propagation Delay Propagation Delay Output Enable Time Output Enable Time Output Disable Time Output Disable Time VCC* +25°C 10.5 10.5 -40°C +85°C 11.5 10.5 11.5 Unit
*Voltage Range ±0.5
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MC74ACT564
OPERATING REQUIREMENTS
Symbol Parameter Setup Time, HIGH Hold Time, HIGH Pulse Width HIGH VCC* +25°C -40°C +85°C Guaranteed Minimum Unit
*Voltage Range ±0.3 *Voltage Range ±0.5
CAPACITANCE
Symbol Input Capacitance Power Dissipation Capacitance Parameter Value Unit Test Conditions
ORDERING INFORMATION
Device MC74ACT564N MC74ACT564NG MC74ACT564DWR2 MC74ACT564DWR2G Package PDIP-20 PDIP-20 (Pb-Free) SOIC-20 SOIC-20 (Pb-Free) 1000 Tape Reel Units Rail Shipping
information tape reel specifications, including part orientation tape sizes, please refer Tape Reel Packaging Specifications Brochure, BRD8011/D.
MARKING DIAGRAMS
PDIP-20
SOIC-20W
MC74ACT564N AWLYYWWG ACT564 AWLYYWWG
Assembly Location Wafer Year Work Week Pb-Free Package
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MC74ACT564
SWITCHING WAVEFORMS
1/fmax tPLH
tPHL
Figure
Figure
VALID DATA
Figure
INPUT OUTPUT DEVICE UNDER TEST SCOPE TEST POINT
*Includes probe capacitance
Figure Test Circuit
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MC74ACT564
PACKAGE DIMENSIONS
PDIP-20 SUFFIX PLASTIC PACKAGE CASE 738-03 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION CENTER LEAD WHEN FORMED PARALLEL. DIMENSION DOES INCLUDE MOLD FLASH.
SEATING PLANE
0.25 (0.010)
0.25 (0.010)
INCHES 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 0.050 0.070 0.100 0.008 0.015 0.110 0.140 0.300 0.020 0.040
MILLIMETERS 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 1.27 1.77 2.54 0.21 0.38 2.80 3.55 7.62 0.51 1.01
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MC74ACT564
PACKAGE DIMENSIONS
SOIC-20W SUFFIX CASE 751D-05 ISSUE
0.25
NOTES: DIMENSIONS MILLIMETERS. INTERPRET DIMENSIONS TOLERANCES ASME Y14.5M, 1994. DIMENSIONS INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL 0.13 TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. MILLIMETERS 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 10.05 10.55 0.25 0.75 0.50 0.90
0.25
SEATING PLANE
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MC74ACT564/D

MC74ACT564 high-speed, power octal flip-flop with buffered common Cloc

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