MC74ACT241 octal buffer line driver designed employed memory address d

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MC74ACT241 octal buffer line driver designed employed memory address d

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MC74ACT241 Octal Buffer/Line Driver with 3-State Outputs
MC74ACT241 octal buffer line driver designed employed memory address driver, clock driver oriented transmitter receiver which provides improved board density.
3-State Outputs Drive Lines Buffer Memory Address
Registers Outputs Source/Sink Compatible Inputs Pb-Free Packages Available
SOIC-20W SUFFIX CASE 751D
MARKING DIAGRAMS
ACT241 AWLYYWWG
TSSOP-20 SUFFIX CASE 948E ALYWG
Figure Pinout: 20-Lead Packages Conductors
(Top View)
TRUTH TABLE
Inputs Outputs (Pins SOEIAJ-20 SUFFIX CASE 74ACT241 AWLYWWG
HIGH Voltage Level Voltage Level Immaterial High Impedance
TRUTH TABLE
Inputs Outputs (Pins
Assembly Location Wafer Year Work Week Pb-Free Package (Note: Microdot either location)
ORDERING INFORMATION
detailed ordering shipping information package dimensions section page this data sheet.
HIGH Voltage Level Voltage Level Immaterial High Impedance
Semiconductor Components Industries, LLC, 2006
December, 2006 Rev.
Publication Order Number: MC74ACT241/D
MC74ACT241
MAXIMUM RATINGS
Symbol IGND TSTG VESD Supply Voltage Input Voltage Output Voltage (Note Input Diode Current Output Diode Current Output Sink/Source Current Supply Current Output Ground Current Output Storage Temperature Range Lead temperature, from Case Seconds Junction temperature under Bias Thermal Resistance Power Dissipation Still 85_C Moisture Sensitivity Flammability Rating Withstand Voltage Oxygen Index: Human Body Model (Note Machine Model (Note Charged Device Model (Note Above Below 85_C (Note SOIC TSSOP SOIC TSSOP Parameter Value *0.5 )7.0 *0.5 )0.5 *0.5 )0.5 $100 )150 )150 Level 0.125 2000 1000 $100 Unit _C/W
ILatchup
Latchup Performance
Stresses exceeding Maximum Ratings damage device. Maximum Ratings stress ratings only. Functional operation above Recommended Operating Conditions implied. Extended exposure stresses above Recommended Operating Conditions affect device reliability. absolute maximum rating must observed. Tested EIA/JESD22-A114-A. Tested EIA/JESD22-A115-A. Tested JESD22-C101-A. Tested EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol Vin, Vout Parameter Input Voltage (Referenced GND) Input Voltage, Output Voltage (Referenced GND) Operating Temperature, Package Types Input Rise Fall Time (Note Output Current High Output Current Unit ns/V
Unused Inputs left open. inputs must tied high voltage level logic voltage level. from refer individual Data Sheets devices that differ from typical input rise fall times.
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MC74ACT241
CHARACTERISTICS
Maximum Level Output Voltage DICCT Maximum Input Leakage Current Additional Maximum ICC/Input Maximum 3-State Current +255C 4.49 5.49 0.001 0.001 -405C +855C Unit Conditions VOUT VOUT IOUT *VIN IOUT *VIN VCC, (OE) VIL, VCC, VCC, VOLD 1.65 VOHD 3.85
Symbol
Parameter Minimum High Level Input Voltage Maximum Level Input Voltage Minimum High Level Output Voltage
Guaranteed Limits 3.86 4.86 0.36 0.36 ±0.1 ±0.5 3.76 4.76 0.44 0.44 ±1.0 ±5.0
IOLD IOHD
Minimum Dynamic Output Current Maximum Quiescent Supply Current
*All outputs loaded; thresholds input associated with output under test. Maximum test duration output loaded time.
CHARACTERISTICS (For Figures Waveforms, Figures
+255C 10.0 10.5 10.5 -405C +855C 10.0 10.0 10.0 11.0 11.5 11.5 Unit
Symbol tPLH tPHL tPZH tPZL tPHZ tPLZ
Parameter Propagation Delay Data Output Propagation Delay Data Output Output Enable Time Output Enable Time Output Disable Time Output Disable Time
VCC*
*Voltage Range ±0.5
CAPACITANCE
Symbol Input Capacitance Power Dissipation Capacitance Parameter Value Unit Test Conditions
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MC74ACT241
SWITCHING WAVEFORMS
INPUT DATA 1/fmax tPLH OUTPUT
tPHL
Figure
tPZL tPLZ OUTPUT (12, tPZH tPHZ OUTPUT HIGH IMPEDANCE HIGH IMPEDANCE
Figure
INPUT OUTPUT DEVICE UNDER TEST SCOPE TEST POINT
*Includes probe capacitance
Figure Test Circuit
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MC74ACT241
ORDERING INFORMATION
Device MC74ACT241DW MC74ACT241DWG MC74ACT241DWR2 MC74ACT241DWR2G MC74ACT241DTR2 MC74ACT241DTR2G MC74ACT241MEL MC74ACT241MELG Package SOIC-20 SOIC-20 (Pb-Free) SOIC-20 SOIC-20 (Pb-Free) TSSOP-20* TSSOP-20* SOEIAJ-20 SOEIAJ-20 (Pb-Free) 2000 Tape Reel 2500 Tape Reel 1000 Tape Reel Units Rail Shipping
information tape reel specifications, including part orientation tape sizes, please refer Tape Reel Packaging Specifications Brochure, BRD8011/D. *These packages inherently Pb-Free.
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MC74ACT241
PACKAGE DIMENSIONS
SOIC-20W SUFFIX CASE 751D-05 ISSUE
0.25
NOTES: DIMENSIONS MILLIMETERS. INTERPRET DIMENSIONS TOLERANCES ASME Y14.5M, 1994. DIMENSIONS INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL 0.13 TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. MILLIMETERS 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 10.05 10.55 0.25 0.75 0.50 0.90
0.25
SEATING PLANE
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MC74ACT241
PACKAGE DIMENSIONS
TSSOP-20 SUFFIX CASE 948E-02 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSION DOES INCLUDE MOLD FLASH, PROTRUSIONS GATE BURRS. MOLD FLASH GATE BURRS SHALL EXCEED 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE INTERLEAD FLASH PROTRUSION. INTERLEAD FLASH PROTRUSION SHALL EXCEED 0.25 (0.010) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. TERMINAL NUMBERS SHOWN REFERENCE ONLY. DIMENSION DETERMINED DATUM PLANE -W-. MILLIMETERS INCHES 6.40 6.60 0.252 0.260 4.30 4.50 0.169 0.177 0.047 1.20 0.05 0.15 0.002 0.006 0.50 0.75 0.020 0.030 0.65 0.026 0.27 0.37 0.011 0.015 0.09 0.20 0.004 0.008 0.09 0.16 0.004 0.006 0.19 0.30 0.007 0.012 0.19 0.25 0.007 0.010 6.40 0.252
IDENT
0.15 (0.006)
DETAIL
0.100 (0.004) SEATING
PLANE
DETAIL
SOLDERING FOOTPRINT*
7.06
0.36
1.26
*For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D.
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SECTION 0.25 (0.010)
0.15 (0.006)
0.10 (0.004)
0.65 PITCH
DIMENSIONS: MILLIMETERS
MC74ACT241
PACKAGE DIMENSIONS
SOEIAJ-20 SUFFIX CASE 967-01 ISSUE
DETAIL
VIEW
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD FLASH PROTRUSIONS MEASURED PARTING LINE. MOLD FLASH PROTRUSIONS SHALL EXCEED 0.15 (0.006) SIDE. TERMINAL NUMBERS SHOWN REFERENCE ONLY. LEAD WIDTH DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS LEAD WIDTH DIMENSION MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT LOCATED LOWER RADIUS FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS ADJACENT LEAD 0.46 0.018). MILLIMETERS 2.05 0.05 0.20 0.35 0.50 0.15 0.25 12.35 12.80 5.10 5.45 1.27 7.40 8.20 0.50 0.85 1.10 1.50 0.70 0.90 0.81 INCHES 0.081 0.002 0.008 0.014 0.020 0.006 0.010 0.486 0.504 0.201 0.215 0.050 0.291 0.323 0.020 0.033 0.043 0.059 0.028 0.035 0.032
0.13 (0.005)
0.10 (0.004)
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PUBLICATION ORDERING INFORMATION
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MC74ACT241/D

MC74ACT241 octal buffer line driver designed employed memory address d

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