Outputs Source/Sink Pb-Free Packages Available PDIP-14 SUFFIX CAS
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MC74AC86, MC74ACT86 Quad 2-Input Exclusive-OR Gate
Outputs Source/Sink Pb-Free Packages Available
PDIP-14 SUFFIX CASE
MAXIMUM RATINGS
Rating Supply Voltage (Referenced GND) Input Voltage (Referenced GND) Output Voltage (Referenced GND) Input Current, Output Sink/Source Current, Current Output Storage Temperature Symbol Vout Iout Tstg Value -0.5 +7.0 -0.5 +0.5 -0.5 +0.5 +150 Unit
SOIC-14 SUFFIX CASE 751A
TSSOP-14 SUFFIX CASE 948G
SOEIAJ-14 SUFFIX CASE
Stresses exceeding Maximum Ratings damage device. Maximum Ratings stress ratings only. Functional operation above Recommended Operating Conditions implied. Extended exposure stresses above Recommended Operating Conditions affect device reliability.
Pinout: 14-Lead Packages Conductors (Top View)
ORDERING INFORMATION
detailed ordering shipping information package dimensions section page this data sheet.
DEVICE MARKING INFORMATION
general marking information device marking section page this data sheet.
Semiconductor Components Industries, LLC, 2006
October, 2006 Rev.
Publication Order Number: MC74AC86/D
MC74AC86, MC74ACT86
RECOMMENDED OPERATING CONDITIONS
Symbol Vin, Vout Supply Voltage Input Voltage, Output Voltage (Ref. GND) Input Rise Fall Time (Note Devices except Schmitt Inputs Input Rise Fall Time (Note Devices except Schmitt Inputs Junction Temperature (PDIP) Operating Ambient Temperature Range Output Current High Output Current Parameter ns/V ns/V Unit
from VCC; individual Data Sheets devices that differ from typical input rise fall times. from individual Data Sheets devices that differ from typical input rise fall times.
CHARACTERISTICS
74AC 74AC -40°C +85°C Unit Conditions VOUT VOUT IOUT
Symbol
Parameter Minimum High Level Input Voltage Maximum Level Input Voltage Minimum High Level Output Voltage
+25°C 2.25 2.75 2.25 2.75 2.99 4.49 5.49 0.002 0.001 0.001 3.15 3.85 1.35 1.65 2.56 3.86 4.86 0.36 0.36 0.36 ±0.1
Guaranteed Limits 3.15 3.85 1.35 1.65 2.46 3.76 4.76 0.44 0.44 0.44 ±1.0
*VIN IOUT
Maximum Level Output Voltage
*VIN VCC, VOLD 1.65 VOHD 3.85
IOLD IOHD
Maximum Input Leakage Current Minimum Dynamic Output Current Maximum Quiescent Supply Current
*All outputs loaded; thresholds input associated with output under test. Maximum test duration output loaded time. NOTE: guaranteed less than equal respective limit VCC.
MC74AC86, MC74ACT86
CHARACTERISTICS (For Figures Waveforms Section Semiconductor FACT Data Book, DL138/D)
74AC +25°C 11.5 11.5 74AC -40°C +85°C 12.5 12.5 Unit
Symbol tPLH tPHL Propagation Delay Inputs Outputs Propagation Delay Inputs Outputs
Parameter
VCC*
Fig.
*Voltage Range ±0.3 Voltage Range ±0.5
CHARACTERISTICS
74ACT 74ACT -40°C +85°C Unit Conditions VOUT VOUT IOUT *VIN IOUT *VIN VCC, VOLD 1.65 VOHD 3.85 3.76 4.76 0.44 0.44 ±1.0
Symbol
Parameter Minimum High Level Input Voltage Maximum Level Input Voltage Minimum High Level Output Voltage
+25°C 4.49 5.49 0.001 0.001 3.86 4.86 0.36 0.36 ±0.1
Guaranteed Limits
Maximum Level Output Voltage
DICCT IOLD IOHD
Maximum Input Leakage Current Additional Max. ICC/Input Minimum Dynamic Output Current Maximum Quiescent Supply Current
*All outputs loaded; thresholds input associated with output under test. Maximum test duration output loaded time.
CHARACTERISTICS (For Figures Waveforms Section Semiconductor FACT Data Book, DL138/D)
74ACT +25°C 74ACT -40°C +85°C 10.0 10.5 Unit
Symbol tPLH tPHL Propagation Delay Propagation Delay
Parameter
VCC*
Fig.
*Voltage Range ±0.5
MC74AC86, MC74ACT86
CAPACITANCE
Symbol Input Capacitance Power Dissipation Capacitance Parameter Value Unit Test Conditions
ORDERING INFORMATION
Device MC74AC86N MC74AC86NG MC74ACT86N MC74ACT86NG MC74AC86D MC74AC86DG MC74AC86DR2 MC74AC86DR2G MC74ACT86D MC74ACT86DG MC74ACT86DR2 MC74ACT86DR2G MC74AC86DTR2 MC74ACT86DTR2 MC74ACT86MEL MC74ACT86MELG Package PDIP-14 PDIP-14 (Pb-Free) PDIP-14 PDIP-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) TSSOP-14* TSSOP-14* SOEIAJ-14 SOEIAJ-14 (Pb-Free) 2000 Tape Reel 2500 Tape Reel Units Rail 2500 Tape Reel Units Rail Shipping
Units Rail
information tape reel specifications, including part orientation tape sizes, please refer Tape Reel Packaging Specifications Brochure, BRD8011/D. *This package inherently Pb-Free.
MC74AC86, MC74ACT86
MARKING DIAGRAMS
PDIP-14 MC74AC86N AWLYYWWG SOIC-14 AC86G AWLYWW TSSOP-14 ALYWG SOEIAJ-14 74ACT86 ALYWG
ACT86G AWLYWW
Assembly Location Wafer Year Work Week Pb-Free Package (Note: Microdot either location)
MC74AC86, MC74ACT86
PACKAGE DIMENSIONS
PDIP-14 CASE 646-06 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION CENTER LEADS WHEN FORMED PARALLEL. DIMENSION DOES INCLUDE MOLD FLASH. ROUNDED CORNERS OPTIONAL. INCHES 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 0.052 0.095 0.008 0.015 0.115 0.135 0.290 0.310 0.015 0.039 MILLIMETERS 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 1.32 2.41 0.20 0.38 2.92 3.43 7.37 7.87 0.38 1.01
SEATING PLANE
0.13 (0.005)
MC74AC86, MC74ACT86
PACKAGE DIMENSIONS
SOIC-14 CASE 751A-03 ISSUE
0.25 (0.010)
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.127 (0.005) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION.
SEATING PLANE
0.25 (0.010)
MILLIMETERS 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 0.19 0.25 0.10 0.25 5.80 6.20 0.25 0.50
INCHES 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 0.008 0.009 0.004 0.009 0.228 0.244 0.010 0.019
SOLDERING FOOTPRINT*
7.04 0.58
1.52
1.27 PITCH
DIMENSIONS: MILLIMETERS
*For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D.
MC74AC86, MC74ACT86
PACKAGE DIMENSIONS
TSSOP-14 CASE 948G-01 ISSUE
0.10 (0.004) 0.15 (0.006)
0.25 (0.010)
IDENT.
DETAIL
0.15 (0.006)
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSION DOES INCLUDE MOLD FLASH, PROTRUSIONS GATE BURRS. MOLD FLASH GATE BURRS SHALL EXCEED 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE INTERLEAD FLASH PROTRUSION. INTERLEAD FLASH PROTRUSION SHALL EXCEED 0.25 (0.010) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. TERMINAL NUMBERS SHOWN REFERENCE ONLY. DIMENSION DETERMINED DATUM PLANE -W-. MILLIMETERS INCHES 4.90 5.10 0.193 0.200 4.30 4.50 0.169 0.177 1.20 0.047 0.05 0.15 0.002 0.006 0.50 0.75 0.020 0.030 0.65 0.026 0.50 0.60 0.020 0.024 0.09 0.20 0.004 0.008 0.09 0.16 0.004 0.006 0.19 0.30 0.007 0.012 0.19 0.25 0.007 0.010 6.40 0.252
SECTION
0.10 (0.004) SEATING
PLANE
DETAIL
SOLDERING FOOTPRINT*
7.06
0.36
1.26
*For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D.
0.65 PITCH
DIMENSIONS: MILLIMETERS
MC74AC86, MC74ACT86
PACKAGE DIMENSIONS
SOEIAJ-14 CASE 965-01 ISSUE
DETAIL
VIEW
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD FLASH PROTRUSIONS MEASURED PARTING LINE. MOLD FLASH PROTRUSIONS SHALL EXCEED 0.15 (0.006) SIDE. TERMINAL NUMBERS SHOWN REFERENCE ONLY. LEAD WIDTH DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS LEAD WIDTH DIMENSION MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT LOCATED LOWER RADIUS FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS ADJACENT LEAD 0.46 0.018). 0.50 MILLIMETERS 2.05 0.05 0.20 0.35 0.50 0.10 0.20 9.90 10.50 5.10 5.45 1.27 7.40 8.20 0.50 0.85 1.10 1.50 0.70 0.90 1.42 INCHES 0.081 0.002 0.008 0.014 0.020 0.004 0.008 0.390 0.413 0.201 0.215 0.050 0.291 0.323 0.020 0.033 0.043 0.059 0.028 0.035 0.056
0.13 (0.005)
0.10 (0.004)
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MC74AC86/D
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