MC74AC574/74ACT574 high-speed, power octal flip-flop with buffered com
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MC74AC574, MC74ACT574 Octal Flip-Flop with 3-State Outputs
MC74AC574/74ACT574 high-speed, power octal flip-flop with buffered common Clock (CP) buffered common Output Enable (OE). information presented inputs stored flip-flops LOW-to-HIGH Clock (CP) transition. MC74AC574/74ACT574 functionally identical MC74AC374/74ACT374 except pinouts.
Inputs Outputs Opposite Sides Package Allowing Easy
Interface with Microprocessors Useful Input Output Port Microprocessors Functionally Identical MC74AC374/74ACT374 3-State Outputs Bus-Oriented Applications Outputs Source/Sink ACT574 Compatible Inputs Pb-Free Packages Available
PDIP-20 SUFFIX CASE
SOIC-20W SUFFIX CASE 751D
TSSOP-20 SUFFIX CASE 948E
SOEIAJ-20 SUFFIX CASE
Figure Pinout: 20-Lead Packages Conductors
(Top View)
DEVICE MARKING INFORMATION
general marking information device marking section page this data sheet.
ASSIGNMENT
D0-D7 O0-O7 FUNCTION Data Inputs Clock Pulse Input 3-State Output Enable Input 3-State Outputs
ORDERING INFORMATION
detailed ordering shipping information package dimensions section page this data sheet.
Figure Logic Symbol
Semiconductor Components Industries, LLC, 2006
December, 2006 Rev.
Publication Order Number: MC74AC574/D
MC74AC574, MC74ACT574
FUNCTIONAL DESCRIPTION FUNCTION TABLE
Inputs Internal Outputs Function Hold Hold Load Load Data Available Data Available Change Data Change Data
MC74AC574/74ACT574 consists eight edgetriggered flip-flops with individual D-type inputs 3-state true outputs. buffered clock buffered Output Enable common flip-flops. eight flip-flops will store state their individual inputs that meet setup hold time requirements LOW-to-HIGH Clock (CP) transition. With Output Enable (OE) LOW, contents eight flip-flops available outputs. When HIGH, outputs high impedance state. Operation input does affect state flip-flops.
HIGH Voltage Level Voltage Level Immaterial High Impedance LOW-to-HIGH Clock Transition Change
NOTE:
This diagram provided only understanding logic operations should used estimate propagation delays.
Figure Logic Diagram
MAXIMUM RATINGS
Symbol VOUT IOUT Tstg Parameter Supply Voltage (Referenced GND) Input Voltage (Referenced GND) Output Voltage (Referenced GND) Input Current, Output Sink/Source Current, Current Output Storage Temperature Value -0.5 +7.0 -0.5 +0.5 -0.5 +0.5 +150 Unit
Stresses exceeding Maximum Ratings damage device. Maximum Ratings stress ratings only. Functional operation above Recommended Operating Conditions implied. Extended exposure stresses above Recommended Operating Conditions affect device reliability.
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MC74AC574, MC74ACT574
RECOMMENDED OPERATING CONDITIONS
Symbol VIN, VOUT Supply Voltage Input Voltage, Output Voltage (Ref. GND) Input Rise Fall Time (Note Devices except Schmitt Inputs Input Rise Fall Time (Note Devices except Schmitt Inputs Junction Temperature (PDIP) Operating Ambient Temperature Range Output Current High Output Current Parameter ns/V ns/V Unit
from VCC; individual Data Sheets devices that differ from typical input rise fall times. from individual Data Sheets devices that differ from typical input rise fall times.
CHARACTERISTICS
74AC Symbol Parameter Maximum Level Input Voltage Minimum High Level Output Voltage Maximum Level Output Voltage IOLD IOHD Maximum Input Leakage Current Minimum Dynamic Output Current Maximum Quiescent Supply Current +25°C Minimum High Level Input Voltage 2.25 2.75 2.25 2.75 2.99 4.49 5.49 0.002 0.001 0.001 3.15 3.85 1.35 1.65 2.56 3.86 4.86 0.36 0.36 0.36 ±0.1 74AC -40°C +85°C Guaranteed Limits 3.15 3.85 1.35 1.65 *VIN 2.46 3.76 4.76 *VIN 0.44 0.44 0.44 ±1.0 VCC, VOLD 1.65 VOHD 3.85 IOUT IOUT VOUT VOUT Unit Conditions
outputs loaded; thresholds input associated with output under test. Maximum test duration output loaded time. NOTE: Note: guaranteed less than equal respective limit VCC.
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MC74AC574, MC74ACT574
CHARACTERISTICS (For Figures Waveforms AND8277/D www.onsemi.com)
74AC Symbol Parameter VCC* fmax tPLH tPHL tPZH tPZL tPHZ tPLZ Maximum Clock Frequency Propagation Delay Propagation Delay Output Enable Time Output Enable Time Output Disable Time Output Disable Time +25°C 13.5 10.5 74AC -40°C +85°C 13.5 11.5 10.5 Unit Fig.
Voltage Range ±0.3 Voltage Range ±0.5
OPERATING REQUIREMENTS
74AC Symbol Parameter VCC* +25°C Setup Time, HIGH Hold Time, HIGH 74AC -40°C +85°C Unit Fig.
Guaranteed Minimum
Pulse Width HIGH *Voltage Range ±0.3 Voltage Range ±0.5
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MC74AC574, MC74ACT574
CHARACTERISTICS
74ACT Symbol Parameter Maximum Level Output Voltage DICCT Maximum Input Leakage Current Additional Max. ICC/Input Maximum 3-State Current Minimum Dynamic Output Current Maximum Quiescent Supply Current +25°C Minimum High Level Input Voltage Maximum Level Input Voltage Minimum High Level Output Voltage 4.49 5.49 0.001 0.001 ±0.5 3.86 4.86 0.36 0.36 ±0.1 74ACT -40°C +85°C Guaranteed Limits 3.76 4.76 0.44 0.44 ±1.0 ±5.0 VOUT VOUT IOUT *VIN IOUT *VIN VCC, (OE) VIL, VCC, VCC, VOLD 1.65 VOHD 3.85 Unit Conditions
IOLD IOHD
*All outputs loaded; thresholds input associated with output under test. Maximum test duration output loaded time.
CHARACTERISTICS (For Figures Waveforms AND8277/D www.onsemi.com)
74ACT Symbol Parameter VCC* fmax tPLH tPHL tPZH tPZL tPHZ tPLZ Maximum Clock Frequency Propagation Delay Propagation Delay Output Enable Time Output Enable Time Output Disable Time Output Disable Time +25°C 10.5 74ACT -40°C +85°C 11.5 Unit Fig.
*Voltage Range ±0.5
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MC74AC574, MC74ACT574
OPERATING REQUIREMENTS
74ACT Symbol Parameter VCC* Setup Time, HIGH Hold Time, HIGH +25°C 74ACT -40°C +85°C Guaranteed Minimum Unit Fig.
Pulse Width HIGH *Voltage Range ±0.3 Voltage Range ±0.5
CAPACITANCE
Symbol Input Capacitance Power Dissipation Capacitance Parameter Value Unit Test Conditions
MARKING DIAGRAMS
PDIP-20
SOIC-20W
TSSOP-20
SOEIAJ-20
MC74AC574N AWLYYWWG AC574 AWLYYWWG
ALYWG
74AC574 AWLYWWG
MC74ACT574N AWLYYWWG ACT574 AWLYYWWG
ALYWG
74ACT574 AWLYWWG
Assembly Location Wafer Year Work Week Pb-Free Package (Note: Microdot either location)
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MC74AC574, MC74ACT574
ORDERING INFORMATION
Device MC74AC574N MC74AC574NG MC74ACT574N MC74ACT574NG MC74AC574DW MC74AC574DWG MC74AC574DWR2 MC74AC574DWR2G MC74ACT574DW MC74ACT574DWG MC74ACT574DWR2 MC74ACT574DWR2G MC74AC574DTR2 MC74AC574DTR2G MC74ACT574DTR2 MC74ACT574DTR2G MC74AC574M MC74AC574MG MC74AC574MEL MC74AC574MELG MC74ACT574M MC74ACT574MG MC74ACT574MEL MC74ACT574MELG Package PDIP-20 PDIP-20 (Pb-Free) PDIP-20 PDIP-20 (Pb-Free) SOIC-20 SOIC-20 (Pb-Free) SOIC-20 SOIC-20 (Pb-Free) SOIC-20 SOIC-20 (Pb-Free) SOIC-20 SOIC-20 (Pb-Free) TSSOP-20* TSSOP-20* TSSOP-20* TSSOP-20* SOEIAJ-20 SOEIAJ-20 (Pb-Free) SOEIAJ-20 SOEIAJ-20 (Pb-Free) SOEIAJ-20 SOEIAJ-20 (Pb-Free) SOEIAJ-20 SOEIAJ-20 (Pb-Free) 2000 Tape Reel Units Rail 2000 Tape Reel Units Rail 2500 Tape Reel 2500 Tape Reel 1000 Tape Reel Units Rail 1000 Tape Reel Units Rail Units Rail Shipping
information tape reel specifications, including part orientation tape sizes, please refer Tape Reel Packaging Specifications Brochure, BRD8011/D. *These packages inherently Pb-Free.
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MC74AC574, MC74ACT574
PACKAGE DIMENSIONS
PDIP-20 SUFFIX PLASTIC PACKAGE CASE 738-03 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION CENTER LEAD WHEN FORMED PARALLEL. DIMENSION DOES INCLUDE MOLD FLASH.
SEATING PLANE
0.25 (0.010)
0.25 (0.010)
INCHES 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 0.050 0.070 0.100 0.008 0.015 0.110 0.140 0.300 0.020 0.040
MILLIMETERS 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 1.27 1.77 2.54 0.21 0.38 2.80 3.55 7.62 0.51 1.01
SOIC-20W SUFFIX CASE 751D-05 ISSUE
0.25
NOTES: DIMENSIONS MILLIMETERS. INTERPRET DIMENSIONS TOLERANCES ASME Y14.5M, 1994. DIMENSIONS INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL 0.13 TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. MILLIMETERS 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 10.05 10.55 0.25 0.75 0.50 0.90
0.25
SEATING PLANE
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MC74AC574, MC74ACT574
PACKAGE DIMENSIONS
TSSOP-20 SUFFIX CASE 948E-02 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSION DOES INCLUDE MOLD FLASH, PROTRUSIONS GATE BURRS. MOLD FLASH GATE BURRS SHALL EXCEED 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE INTERLEAD FLASH PROTRUSION. INTERLEAD FLASH PROTRUSION SHALL EXCEED 0.25 (0.010) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. TERMINAL NUMBERS SHOWN REFERENCE ONLY. DIMENSION DETERMINED DATUM PLANE -W-. MILLIMETERS INCHES 6.40 6.60 0.252 0.260 4.30 4.50 0.169 0.177 0.047 1.20 0.05 0.15 0.002 0.006 0.50 0.75 0.020 0.030 0.65 0.026 0.27 0.37 0.011 0.015 0.09 0.20 0.004 0.008 0.09 0.16 0.004 0.006 0.19 0.30 0.007 0.012 0.19 0.25 0.007 0.010 6.40 0.252
IDENT
0.15 (0.006)
DETAIL
0.100 (0.004) SEATING
PLANE
DETAIL
SOLDERING FOOTPRINT*
7.06
0.36
1.26
*For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D.
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SECTION 0.25 (0.010)
0.15 (0.006)
0.10 (0.004)
0.65 PITCH
DIMENSIONS: MILLIMETERS
MC74AC574, MC74ACT574
PACKAGE DIMENSIONS
SOEIAJ-20 SUFFIX CASE 967-01 ISSUE
DETAIL
VIEW
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD FLASH PROTRUSIONS MEASURED PARTING LINE. MOLD FLASH PROTRUSIONS SHALL EXCEED 0.15 (0.006) SIDE. TERMINAL NUMBERS SHOWN REFERENCE ONLY. LEAD WIDTH DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS LEAD WIDTH DIMENSION MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT LOCATED LOWER RADIUS FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS ADJACENT LEAD 0.46 0.018). MILLIMETERS 2.05 0.05 0.20 0.35 0.50 0.15 0.25 12.35 12.80 5.10 5.45 1.27 7.40 8.20 0.50 0.85 1.10 1.50 0.70 0.90 0.81 INCHES 0.081 0.002 0.008 0.014 0.020 0.006 0.010 0.486 0.504 0.201 0.215 0.050 0.291 0.323 0.020 0.033 0.043 0.059 0.028 0.035 0.032
0.13 (0.005)
0.10 (0.004)
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MC74AC574/D
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