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74HC74 identical pinout LS74. device inputs compatible with standard C


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74HC74 Dual Flip-Flop with Reset
74HC74 identical pinout LS74. device inputs compatible with standard CMOS outputs; with pullup resistors, they compatible with LSTTL outputs. This device consists flip-flops with individual Set, Reset, Clock inputs. Information D-input transferred corresponding output next positive going edge clock input. Both outputs available from each flip-flop. Reset inputs asynchronous.
http://onsemi.com MARKING DIAGRAMS
SOIC-14 SUFFIX CASE 751A HC74G AWLYWW
Output Drive Capability: LSTTL Loads Outputs Directly Interface CMOS, NMOS, Operating Voltage Range: Input Current: High Noise Immunity Characteristic CMOS Devices Compliance with JEDEC Standard Requirements Performance: 2000 Machine Model Chip Complexity: FETs Equivalent Gates Pb-Free Packages Available
TSSOP-14 SUFFIX CASE 948G ALYW
HC74 Device Code Assembly Location Wafer Year Work Week Pb-Free Package (Note: Microdot either location)
ORDERING INFORMATION
detailed ordering shipping information package dimensions section page this data sheet.
Semiconductor Components Industries, LLC, 2007
February, 2007 Rev.
Publication Order Number: 74HC74/D
74HC74
ASSIGNMENT
RESET DATA CLOCK RESET DATA CLOCK RESET DATA CLOCK RESET DATA CLOCK
LOGIC DIAGRAM
FUNCTION TABLE
Inputs Reset Clock Data Outputs Change Change Change
*Both outputs will remain high long Reset low, output states unpredictable Reset high simultaneously.
Symbol Iout Tstg Vout Parameter Value Unit Supply Voltage (Referenced GND) Input Voltage (Referenced GND) Input Current, Output Current, Supply Current, Pins Power Dissipation Still Air, Storage Temperature Lead Temperature, from Case Seconds (SOIC TSSOP Package) SOIC Package TSSOP Package Output Voltage (Referenced GND)
MAXIMUM RATINGS
This device contains protection circuitry guard against damage high static voltages electric fields. However, precautions must taken avoid applications voltage higher than maximum rated voltages this high-impedance circuit. proper operation, Vout should constrained range (Vin Vout) VCC. Unused inputs must always tied appropriate logic voltage level (e.g., either VCC). Unused outputs must left open.
Stresses exceeding Maximum Ratings damage device. Maximum Ratings stress ratings only. Functional operation above Recommended Operating Conditions implied. Extended exposure stresses above Recommended Operating Conditions affect device reliability. Derating SOIC Package: mW/_C from 125_C TSSOP Package: mW/_C from 125_C high frequency heavy load considerations, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol Vin, Vout Parameter Supply Voltage (Referenced GND) Input Voltage, Output Voltage (Referenced GND) Operating Temperature, Package Types Input Rise Fall Time (Figures 1000 Unit
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74HC74
ELECTRICAL CHARACTERISTICS (Voltages Referenced GND)
Guaranteed Limit Symbol Parameter Minimum High-Level Input Voltage Test Conditions Vout |Iout| |Iout| |Iout| |Iout| |Iout| |Iout| |Iout| 25_C 3.15 1.35 2.48 3.98 5.48 0.26 0.26 0.26 ±0.1 85_C 3.15 1.35 2.34 3.84 5.34 0.33 0.33 0.33 ±1.0 125_C 3.15 1.35 ±1.0 Unit
Maximum Low-Level Input Voltage
Vout |Iout|
Minimum High-Level Output Voltage
|Iout|
Maximum Low-Level Output Voltage
|Iout|
Maximum Input Leakage Current Maximum Quiescent Supply Current (per Package)
Iout
NOTE: Information typical parametric values found Chapter Semiconductor High-Speed CMOS Data Book (DL129/D).
ELECTRICAL CHARACTERISTICS Input
Guaranteed Limit Symbol fmax Parameter Maximum Clock Frequency (50% Duty Cycle) (Figures 25_C 85_C 125_C Unit
tPLH, tPHL
Maximum Propagation Delay, Clock (Figures
tPLH, tPHL
Maximum Propagation Delay, Reset (Figures
tTLH, tTHL
Maximum Output Transition Time, Output (Figures
Maximum Input Capacitance
NOTE: propagation delays with loads other than information typical parametric values, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). Typical 25°C, Power Dissipation Capacitance (Per Flip-Flop)* Used determine no-load dynamic power consumption: VCC2 load considerations, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D).
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74HC74
TIMING REQUIREMENTS (Input
Guaranteed Limit Symbol Parameter Minimum Setup Time, Data Clock (Figure 25_C 1000 85_C 1000 125_C 1000 Unit
Minimum Hold Time, Clock Data (Figure
trec
Minimum Recovery Time, Reset Inactive Clock (Figure
Minimum Pulse Width, Clock (Figure
Minimum Pulse Width, Reset (Figure
Maximum Input Rise Fall Times (Figures
ORDERING INFORMATION
Device 74HC74D 74HC74DG 74HC74DR2 74HC74DR2G 74HC74DTR2 74HC74DTR2G Package SOIC-14 SOIC-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) TSSOP-14* TSSOP-14* 2500 Tape Reel Units Rail Shipping
information tape reel specifications, including part orientation tape sizes, please refer Tape Reel Packaging Specifications Brochure, BRD8011/D. *This package inherently Pb-Free.
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74HC74
SWITCHING WAVEFORMS
CLOCK 1/fmax tPLH
RESET tPHL tPLH CLOCK trec
tPHL
tTLH
tTHL
Figure
Figure
VALID DATA
TEST POINT *Includes probe capacitance DEVICE UNDER TEST OUTPUT
CLOCK
Figure
Figure
DATA
CLOCK
RESET
Figure EXPANDED LOGIC DIAGRAM
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74HC74
PACKAGE DIMENSIONS
SOIC-14 CASE 751A-03 ISSUE
0.25 (0.010)
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.127 (0.005) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION.
SEATING PLANE
0.25 (0.010)
MILLIMETERS 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 0.19 0.25 0.10 0.25 5.80 6.20 0.25 0.50
INCHES 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 0.008 0.009 0.004 0.009 0.228 0.244 0.010 0.019
SOLDERING FOOTPRINT*
7.04 0.58
1.52
1.27 PITCH
DIMENSIONS: MILLIMETERS
*For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D.
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74HC74
PACKAGE DIMENSIONS
TSSOP-14 CASE 948G-01 ISSUE
0.10 (0.004) 0.15 (0.006)
0.25 (0.010)
IDENT.
DETAIL
0.15 (0.006)
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSION DOES INCLUDE MOLD FLASH, PROTRUSIONS GATE BURRS. MOLD FLASH GATE BURRS SHALL EXCEED 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE INTERLEAD FLASH PROTRUSION. INTERLEAD FLASH PROTRUSION SHALL EXCEED 0.25 (0.010) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. TERMINAL NUMBERS SHOWN REFERENCE ONLY. DIMENSION DETERMINED DATUM PLANE -W-. MILLIMETERS 4.90 5.10 4.30 4.50 1.20 0.05 0.15 0.50 0.75 0.65 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 INCHES 0.193 0.200 0.169 0.177 0.047 0.002 0.006 0.020 0.030 0.026 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252
SECTION
0.10 (0.004) SEATING
PLANE
DETAIL
SOLDERING FOOTPRINT*
7.06
0.36
1.26
*For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D.
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0.65 PITCH
DIMENSIONS: MILLIMETERS
74HC74
Semiconductor registered trademarks Semiconductor Components Industries, (SCILLC). SCILLC reserves right make changes without further notice products herein. SCILLC makes warranty, representation guarantee regarding suitability products particular purpose, does SCILLC assume liability arising application product circuit, specifically disclaims liability, including without limitation special, consequential incidental damages. "Typical" parameters which provided SCILLC data sheets and/or specifications vary different applications actual performance vary over time. operating parameters, including "Typicals" must validated each customer application customer's technical experts. SCILLC does convey license under patent rights rights others. SCILLC products designed, intended, authorized components systems intended surgical implant into body, other applications intended support sustain life, other application which failure SCILLC product could create situation where personal injury death occur. Should Buyer purchase SCILLC products such unintended unauthorized application, Buyer shall indemnify hold SCILLC officers, employees, subsidiaries, affiliates, distributors harmless against claims, costs, damages, expenses, reasonable attorney fees arising directly indirectly, claim personal injury death associated with such unintended unauthorized use, even such claim alleges that SCILLC negligent regarding design manufacture part. SCILLC Equal Opportunity/Affirmative Action Employer. This literature subject applicable copyright laws resale manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center Semiconductor P.O. 5163, Denver, Colorado 80217 Phone: 303-675-2175 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East Africa Technical Support: Phone: 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit additional information, please contact your local Sales Representative
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74HC74/D

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