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74HC74 identical pinout LS74. device inputs compatible with standard C
Top Searches for this datasheet74HC74 Dual Flip-Flop with Reset 74HC74 identical pinout LS74. device inputs compatible with standard CMOS outputs; with pullup resistors, they compatible with LSTTL outputs. This device consists flip-flops with individual Set, Reset, Clock inputs. Information D-input transferred corresponding output next positive going edge clock input. Both outputs available from each flip-flop. Reset inputs asynchronous. http://onsemi.com MARKING DIAGRAMS SOIC-14 SUFFIX CASE 751A HC74G AWLYWW Output Drive Capability: LSTTL Loads Outputs Directly Interface CMOS, NMOS, Operating Voltage Range: Input Current: High Noise Immunity Characteristic CMOS Devices Compliance with JEDEC Standard Requirements Performance: 2000 Machine Model Chip Complexity: FETs Equivalent Gates Pb-Free Packages Available TSSOP-14 SUFFIX CASE 948G ALYW HC74 Device Code Assembly Location Wafer Year Work Week Pb-Free Package (Note: Microdot either location) ORDERING INFORMATION detailed ordering shipping information package dimensions section page this data sheet. Semiconductor Components Industries, LLC, 2007 February, 2007 Rev. Publication Order Number: 74HC74/D 74HC74 ASSIGNMENT RESET DATA CLOCK RESET DATA CLOCK RESET DATA CLOCK RESET DATA CLOCK LOGIC DIAGRAM FUNCTION TABLE Inputs Reset Clock Data Outputs Change Change Change *Both outputs will remain high long Reset low, output states unpredictable Reset high simultaneously. Symbol Iout Tstg Vout Parameter Value Unit Supply Voltage (Referenced GND) Input Voltage (Referenced GND) Input Current, Output Current, Supply Current, Pins Power Dissipation Still Air, Storage Temperature Lead Temperature, from Case Seconds (SOIC TSSOP Package) SOIC Package TSSOP Package Output Voltage (Referenced GND) MAXIMUM RATINGS This device contains protection circuitry guard against damage high static voltages electric fields. However, precautions must taken avoid applications voltage higher than maximum rated voltages this high-impedance circuit. proper operation, Vout should constrained range (Vin Vout) VCC. Unused inputs must always tied appropriate logic voltage level (e.g., either VCC). Unused outputs must left open. Stresses exceeding Maximum Ratings damage device. Maximum Ratings stress ratings only. Functional operation above Recommended Operating Conditions implied. Extended exposure stresses above Recommended Operating Conditions affect device reliability. Derating SOIC Package: mW/_C from 125_C TSSOP Package: mW/_C from 125_C high frequency heavy load considerations, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). RECOMMENDED OPERATING CONDITIONS Symbol Vin, Vout Parameter Supply Voltage (Referenced GND) Input Voltage, Output Voltage (Referenced GND) Operating Temperature, Package Types Input Rise Fall Time (Figures 1000 Unit http://onsemi.com 74HC74 ELECTRICAL CHARACTERISTICS (Voltages Referenced GND) Guaranteed Limit Symbol Parameter Minimum High-Level Input Voltage Test Conditions Vout |Iout| |Iout| |Iout| |Iout| |Iout| |Iout| |Iout| 25_C 3.15 1.35 2.48 3.98 5.48 0.26 0.26 0.26 ±0.1 85_C 3.15 1.35 2.34 3.84 5.34 0.33 0.33 0.33 ±1.0 125_C 3.15 1.35 ±1.0 Unit Maximum Low-Level Input Voltage Vout |Iout| Minimum High-Level Output Voltage |Iout| Maximum Low-Level Output Voltage |Iout| Maximum Input Leakage Current Maximum Quiescent Supply Current (per Package) Iout NOTE: Information typical parametric values found Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). ELECTRICAL CHARACTERISTICS Input Guaranteed Limit Symbol fmax Parameter Maximum Clock Frequency (50% Duty Cycle) (Figures 25_C 85_C 125_C Unit tPLH, tPHL Maximum Propagation Delay, Clock (Figures tPLH, tPHL Maximum Propagation Delay, Reset (Figures tTLH, tTHL Maximum Output Transition Time, Output (Figures Maximum Input Capacitance NOTE: propagation delays with loads other than information typical parametric values, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). Typical 25°C, Power Dissipation Capacitance (Per Flip-Flop)* Used determine no-load dynamic power consumption: VCC2 load considerations, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). http://onsemi.com 74HC74 TIMING REQUIREMENTS (Input Guaranteed Limit Symbol Parameter Minimum Setup Time, Data Clock (Figure 25_C 1000 85_C 1000 125_C 1000 Unit Minimum Hold Time, Clock Data (Figure trec Minimum Recovery Time, Reset Inactive Clock (Figure Minimum Pulse Width, Clock (Figure Minimum Pulse Width, Reset (Figure Maximum Input Rise Fall Times (Figures ORDERING INFORMATION Device 74HC74D 74HC74DG 74HC74DR2 74HC74DR2G 74HC74DTR2 74HC74DTR2G Package SOIC-14 SOIC-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) TSSOP-14* TSSOP-14* 2500 Tape Reel Units Rail Shipping information tape reel specifications, including part orientation tape sizes, please refer Tape Reel Packaging Specifications Brochure, BRD8011/D. *This package inherently Pb-Free. http://onsemi.com 74HC74 SWITCHING WAVEFORMS CLOCK 1/fmax tPLH RESET tPHL tPLH CLOCK trec tPHL tTLH tTHL Figure Figure VALID DATA TEST POINT *Includes probe capacitance DEVICE UNDER TEST OUTPUT CLOCK Figure Figure DATA CLOCK RESET Figure EXPANDED LOGIC DIAGRAM http://onsemi.com 74HC74 PACKAGE DIMENSIONS SOIC-14 CASE 751A-03 ISSUE 0.25 (0.010) NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.127 (0.005) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. SEATING PLANE 0.25 (0.010) MILLIMETERS 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 0.19 0.25 0.10 0.25 5.80 6.20 0.25 0.50 INCHES 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 0.008 0.009 0.004 0.009 0.228 0.244 0.010 0.019 SOLDERING FOOTPRINT* 7.04 0.58 1.52 1.27 PITCH DIMENSIONS: MILLIMETERS *For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 74HC74 PACKAGE DIMENSIONS TSSOP-14 CASE 948G-01 ISSUE 0.10 (0.004) 0.15 (0.006) 0.25 (0.010) IDENT. DETAIL 0.15 (0.006) NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSION DOES INCLUDE MOLD FLASH, PROTRUSIONS GATE BURRS. MOLD FLASH GATE BURRS SHALL EXCEED 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE INTERLEAD FLASH PROTRUSION. INTERLEAD FLASH PROTRUSION SHALL EXCEED 0.25 (0.010) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. TERMINAL NUMBERS SHOWN REFERENCE ONLY. DIMENSION DETERMINED DATUM PLANE -W-. MILLIMETERS 4.90 5.10 4.30 4.50 1.20 0.05 0.15 0.50 0.75 0.65 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 INCHES 0.193 0.200 0.169 0.177 0.047 0.002 0.006 0.020 0.030 0.026 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 SECTION 0.10 (0.004) SEATING PLANE DETAIL SOLDERING FOOTPRINT* 7.06 0.36 1.26 *For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 0.65 PITCH DIMENSIONS: MILLIMETERS 74HC74 Semiconductor registered trademarks Semiconductor Components Industries, (SCILLC). SCILLC reserves right make changes without further notice products herein. SCILLC makes warranty, representation guarantee regarding suitability products particular purpose, does SCILLC assume liability arising application product circuit, specifically disclaims liability, including without limitation special, consequential incidental damages. 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