M1005-BD Features Balanced Image Reject Mixer 12.0 Conversion Los

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M1005-BD Features Balanced Image Reject Mixer 12.0 Conversion Los

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37.0-46.0 GaAs MMIC Balanced Image Reject Mixer
M1005-BD Features
Balanced Image Reject Mixer 12.0 Conversion Loss 20.0 Image Rejection 33.0 Rejection +27.0 Input Third Order Intercept (IIP3) 100% On-Wafer Testing 100% Visual Inspection MIL-STD-883 Method 2010
Chip Device Layout
XM1005-BD
General Description
Mimix Broadband's 37.0-46.0 GaAs MMIC balanced image reject mixer used down-converter. device conversion loss 12.0 with 20.0 image rejection across band. mixer outputs provided external degree hybrid required select desired sideband. This MMIC uses Mimix Broadband's 0.15 GaAs PHEMT device model technology, based upon electron beam lithography ensure high repeatability uniformity. chip surface passivation protect provide rugged part with backside holes gold metallization allow either conductive epoxy eutectic solder attach process. This device well suited Millimeter-wave Point-to-Point Radio, LMDS, SATCOM VSAT applications.
Parameter Frequency Range (RF) Frequency Range (LO) Frequency Range (IF) Return Loss (S11) Return Loss (S22) Return Loss (S33) Conversion Loss (S21) Input Drive (PLO) Image Rejection Isolation LO/RF Isolation LO/IF Isolation RF/IF Input Third Order Intercept (IIP3) Gate Bias Voltage (Vg1)
Down-conversion operation
Absolute Maximum Ratings
Gate Bias Voltage (Vg) Input Power Pin) Input Power Pin) Storage Temperature (Tstg) Operating Temperature (Ta) +0.3 +20.0 +20.0 +165 +125
Electrical Characteristics (Ambient Temperature
Units Min. 37.0 33.0 -2.0 Typ. 10.0 12.0 +12.0 20.0 33.0 +27.0 -1.2
Max. 46.0 50.0 +0.1
Page
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data Specifications subject change without notice. ©2007 Mimix Broadband, Inc. Export this item require appropriate export licensing from U.S. Government. purchasing these parts, U.S. Domestic customers accept their obligation compliant with U.S. Export Laws.
37.0-46.0 GaAs MMIC Balanced Image Reject Mixer
M1005-BD Mixer Measurements Down Conversion
WP367_067AA102_XM1005-BD (USB, Down Conversion, IF=2GHz, F=-10dBm, PLO= +15dBm, VG1B=-1.2V): Convers gain (dB) freq (GHz) Image Rejection (dBc freq (GHz)
)=9, 10C1 )=9, 10C1 )=9, 11C1 )=9, 12C1 )=9, 13C1 (dBm )=12, (dBm )=12, (dBm )=12, (dBm )=12, (dBm )=12, (dBm )=15, (dBm )=15, (dBm )=15,
67_067AA102_XM1005-BD (LSB, Down Conversion F=-10dBm O=+9, +15dBm -1.2V): Conversio gain (dB) freq Image Rejection (dBc) freq
Image Rejec tion nversio gain
LO(dB m)=9, =R10C LO(dB m)=9, =R10C LO(dB m)=9, =R11C
Image Rejection versio (dB)
freq
(GHz)
LO(dB m)=9, =R12C LO(dB m)=9, =R13C LO(dB m)=12, 10C11 LO(dB m)=12, 10C14 LO(dB m)=12, 11C11 LO(dB m)=12, 12C13 LO(dB m)=12, 13C10 LO(dB m)=15, 10C11 LO(dB m)=15, 10C14 LO(dB m)=15, 11C11 LO(dB m)=15, 12C13 LO(dB m)=15, 13C10 LO(dB m)=9, LO(dB m)=9, LO(dB m)=9, LO(dB m)=9, LO(dB m)=9, LO(dB m)=12, LO(dB m)=12, LO(dB m)=12, LO(dB m)=12, LO(dB m)=12, LO(dB m)=15, LO(dB m)=15, LO(dB m)=15, LO(dB m)=15, LO(dB m)=15,
(dBm )=15, (dBm )=15, m)=9, 10C1 m)=9, 10C1 m)=9, 11C1 m)=9, 12C1 m)=9, 13C1 m)=12, m)=12, m)=12, m)=12, m)=12, m)=15, m)=15, m)=15, m)=15, m)=15,
WP367 _067A A102_XM1005-BD_5dev ices (USB, onv, 2GHz, PLO= 15dBm, VG1B =-1.2V): IP1dB
IIP1 dBm)=9, IIP1 dBm)=9, IIP1 dBm)=9, IIP1 dBm)=9, IIP1 dBm)=9,
67_067AA102_XM1005-BD_5 devic (LSB onv, =2GH O=+9, +15dB =-1.2V):
m)=9, 10C11 m)=9, 10C14 m)=9, 11C11 m)=9, 12C13 m)=9, 13C10 m)=12, 10C1 m)=12, 10C1 m)=12, 11C1 m)=12, 12C1 m)=12, 13C1 m)=15, 10C1 m)=15, 10C1 m)=15, 11C1 m)=15, 12C1 m)=15, 13C1 OIP1 dBm)=9, OIP1 dBm)=9, OIP1 dBm)=9, OIP1 dBm)=9, OIP1 dBm)=9, m)=12, m)=12, m)=12, m)=12, m)=12, m)=15, m)=15, m)=15, m)=15, m)=15,
IIP1 dBm)=12, IIP1 dBm)=12, IIP1 dBm)=12, IIP1 dBm)=12, IIP1 dBm)=12,
OIP1dB IIP1dB
IIP1 dBm)=15,
OIP1dB IIP1d
IIP1 dBm)=15, IIP1 dBm)=15, IIP1 dBm)=15, IIP1 dBm)=15, m)=9, m)=9, m)=9, m)=9, m)=9, m)=12, m)=12, m)=12, m)=12, m)=12, m)=15, m)=15, m)=15, m)=15, m)=15,
(GHz)
WP367_067A A102_XM1005-BD (USB Down Conv, 2GHz F1-R F2=100MHz, F=-7dB VG1B =-1.3V): IIP3 (dBm) freq
freq GHz)
dBm) dBm) dBm) dBm) dBm)
367_067AA102_XM1005-BD Down onv, 2GHz, F1-RF 2=100MHz, F=-7dB =-1.3V): IIP3 freq (GHz)
(GHz)
IIP3 (dBm)=9, 10C1 IIP3 (dBm)=9, 10C1 IIP3 (dBm)=9, 11C1 IIP3 (dBm)=9, 12C1 IIP3 (dBm)=9, 13C1 IIP3 dBm)=12, IIP3 dBm)=12, IIP3 dBm)=12, IIP3 dBm)=12, IIP3 dBm)=12, IIP3 dBm)=15, IIP3 dBm)=15, IIP3 dBm)=15, IIP3 dBm)=15, IIP3 dBm)=15, OIP3 dBm)=9, OIP3 dBm)=9, OIP3 dBm)=9, OIP3 dBm)=9, OIP3 dBm)=9, m)=12 =R10 m)=12 =R10 m)=12 =R11 m)=12 =R12 m)=12 =R13 m)=15 =R10 m)=15 =R10 m)=15 =R11 m)=15 =R12 m)=15 =R13
(dBm )=12, (dBm )=12, (dBm )=12, (dBm )=12,
(dBm )=12, (dBm )=15, (dBm )=15,
IIP3
(dBm )=15, (dBm )=15, OIP3, (dBm )=9, OIP3, (dBm )=9, OIP3, (dBm )=9, OIP3, (dBm )=9, OIP3, (dBm )=9, OIP3, (dBm )=12, OIP3, (dBm )=12, OIP3, (dBm )=12, OIP3, (dBm )=12,
IIP3 (dBm)
(dBm )=15,
OIP3, (dBm )=12, OIP3, (dBm )=15, OIP3, (dBm )=15, OIP3, (dBm )=15,
OIP3, (dBm )=15, OIP3, (dBm )=15,
freq GHz)
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page
Characteristic Data Specifications subject change without notice. ©2007 Mimix Broadband, Inc. Export this item require appropriate export licensing from U.S. Government. purchasing these parts, U.S. Domestic customers accept their obligation compliant with U.S. Export Laws.
37.0-46.0 GaAs MMIC Balanced Image Reject Mixer
M1005-BD Mixer Measurements Conversion
WP36 7_067AD102_XM1005-BD convers ion, Vg=-1V, =2GH -10dB +18dBm, 05): onversio gain freq (GHz)
onvers
m)=9, m)=9, m)=9, m)=9, m)=9, m)=12, m)=12, m)=12, m)=12, m)=12, m)=15, m)=15, m)=15, m)=15, m)=15, m)=18, m)=18, m)=18, m)=18, m)=18, m)=9, m)=9, m)=9, m)=9, m)=9, m)=12, m)=12, m)=12, m)=12, m)=12, m)=15, m)=15, m)=15, m)=15, m)=15, m)=18,
67_067AD102_XM1005-BD conversion =-1V, IF=2GH PLO= +18dB 10dB Convers (GHz)
m)=9,
(GHz
m)=9, m)=9, m)=9, m)=9, m)=12, m)=12, m)=12, m)=12, m)=12, m)=15, m)=15, m)=15, m)=15, m)=15, m)=18, m)=18, m)=18, m)=18, m)=18, m)=9, m)=9,
nversion gain (dB)
(GHz
m)=9, m)=9, m)=9, m)=12, m)=12, m)=12, m)=12, m)=12, m)=15, m)=15, m)=15, m)=15, m)=15, m)=18, m)=18, m)=18, m)=18, m)=18,
m)=18, m)=18, m)=18, m)=18,
WP367_067AD102_XM1005-BD conv ersion =-1V, 2GHz -10dBm, PLO= +18dB gain freq
WP367_067AD102_XM1005-BD onversion, LSB, Vg=- IF=2GHz, dBm, PLO= +18dBm, gain (dB) (GHz)
PLO( dBm)=9, =R5C10
iso, LO(dB m)=9,
PLO( dBm)=9, =R5C12 PLO( dBm)=9, =R6C11 PLO( dBm)=9, =R7C10 PLO( dBm)=9, =R7C13
iso, LO(dB m)=9, iso, LO(dB m)=9, iso, LO(dB m)=9, iso, LO(dB m)=9, iso, LO(dB m)=12, iso, LO(dB m)=12, iso, LO(dB m)=12, iso, LO(dB m)=12, iso, LO(dB m)=12, iso, LO(dB m)=15, iso, LO(dB m)=15, iso, LO(dB m)=15, iso, LO(dB m)=15, iso, LO(dB m)=15, iso, LO(dB m)=18, iso, LO(dB m)=18, iso, LO(dB m)=18,
(dB)
PLO( dBm)=12, 5C10 PLO( dBm)=12, 6C11 PLO( dBm)=12, 7C10 PLO( dBm)=12, 7C13 PLO( dBm)=15, 5C10 PLO( dBm)=15, 5C12 PLO( dBm)=15, 6C11 PLO( dBm)=15, 7C10
gain (dB)
PLO( dBm)=12, 5C12
PLO( dBm)=15, 7C13 PLO( dBm)=18, 5C10 PLO( dBm)=18, 5C12 PLO( dBm)=18, 6C11
PLO( dBm)=18, 7C10 PLO( dBm)=18, 7C13
iso, LO(dB m)=18, iso, LO(dB m)=18,
(GHz
freq (GHz)
67_067AD102_XM1005-BD onversi =2GHz, IF1-IF2=100MHz, F=-5dB O=+9 +15dB g=-1.25V, 04): IIP3 (dBm freq freq
367_067AD102_XM1005-BD Conversion, LSB, F=2GHz, -IF2=100MHz, IF=-5dB PLO=+ +15dBm, -1.25V, 04): IIP3 (dBm freq (GHz) (dBm) (GHz
IIP3 )=9, IIP3 )=9, IIP3 )=9, IIP3 )=9, IIP3 )=9, IIP3 )=12,
m)=9, 5C10 m)=9, 5C12 m)=9, 6C11 m)=9, 7C10 m)=9, 7C13 m)=12 =R5C10 m)=12 =R5C12 m)=12 =R6C11 m)=12 =R7C10 m)=12 =R7C13 m)=15 =R5C10 m)=15 =R5C12 m)=15 =R6C11 m)=15 =R7C10 m)=15 =R7C13 m)=9, RC=R5C m)=9, RC=R5C m)=9, RC=R6C m)=9, RC=R7C m)=9, RC=R7C m)=12, RC=R5 m)=12, RC=R5 m)=12, RC=R6 m)=12, RC=R7 m)=12, RC=R7 m)=15, RC=R5 m)=15, RC=R5 m)=15, RC=R6 m)=15, RC=R7 m)=15, RC=R7
(dBm (dBm)
IIP3 )=12, IIP3 )=12, IIP3 )=12, IIP3 )=12,
OIP3 (dBm IIP3 (dBm
IIP3 )=15, IIP3 )=15, IIP3 )=15, IIP3 )=15, IIP3 )=15,
m)=9, m)=9, m)=9, m)=9,
m)=9, m)=12, =R5C1 m)=12, =R5C1 m)=12, =R6C1
m)=12, =R7C1 m)=12, =R7C1 m)=15, =R5C1 m)=15, =R5C1
m)=15, =R6C1 m)=15, =R7C1 m)=15, =R7C1
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page
Characteristic Data Specifications subject change without notice. ©2007 Mimix Broadband, Inc. Export this item require appropriate export licensing from U.S. Government. purchasing these parts, U.S. Domestic customers accept their obligation compliant with U.S. Export Laws.
37.0-46.0 GaAs MMIC Balanced Image Reject Mixer
M1005-BD
0.879 (0.035) 1.279 (0.050)
Mechanical Drawing
2.100 (0.083)
XM1005-BD
1.350 (0.053)
0.693 (0.027)
0.750 (0.030)
0.879 (0.035)
1.590 (0.063)
(Note: Engineering designator 40IRM0540) Units: millimeters (inches) Bond dimensions shown center bond pad. Thickness: 0.110 0.010 (0.0043 0.0004), Backside ground, Bond Pad/Backside Metallization: Gold Bond Pads 0.100 0.100 (0.004 0.004). Bond centers approximately 0.109 (0.004) from edge chip. Dicing tolerance: 0.005 (+/- 0.0002). Approximate weight: 1.592 Bond (RF) Bond (IF1)
Vg1a
Bond (Vg1a) Bond (LO)
Bond (Vg1b) Bond (IF2)
Bias Arrangement
XM1005-BD
Bypass Capacitors Note
Vg1b
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
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Characteristic Data Specifications subject change without notice. ©2007 Mimix Broadband, Inc. Export this item require appropriate export licensing from U.S. Government. purchasing these parts, U.S. Domestic customers accept their obligation compliant with U.S. Export Laws.
37.0-46.0 GaAs MMIC Balanced Image Reject Mixer
M1005-BD
Note Biasing pHEMT mixer devices operated using separate gate voltage Vg1a Vg1b. Vg1a Vg1b=-1.2V optimum conversion loss performance. Bias applied through Vg1a Vg1b. Note Bias Arrangement Each (Vg1a, Vg1b) needs have bypass capacitance (~100-200 close device possible. Additional bypass capacitance (~0.01 also recommended. Note USB/LSB Selection
Upper Side Band Operation (USB): With connected direct port coupled port respectively shown diagram, signal will reside isolated port. input port must loaded with ohms. Lower Side Band Operation (LSB): With connected direct port coupled port respectively shown diagram, signal will reside input port. isolated port must loaded with ohms.
Note: coupled port alternate input port loca tion Coupled Direct ports reverse.
alternate method Selection LSB:
Phase Combiner
Phas Combiner
Page
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data Specifications subject change without notice. ©2007 Mimix Broadband, Inc. Export this item require appropriate export licensing from U.S. Government. purchasing these parts, U.S. Domestic customers accept their obligation compliant with U.S. Export Laws.
37.0-46.0 GaAs MMIC Balanced Image Reject Mixer
M1005-BD Device Schematic
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page
Characteristic Data Specifications subject change without notice. ©2007 Mimix Broadband, Inc. Export this item require appropriate export licensing from U.S. Government. purchasing these parts, U.S. Domestic customers accept their obligation compliant with U.S. Export Laws.
37.0-46.0 GaAs MMIC Balanced Image Reject Mixer
M1005-BD Handling Assembly Information
CAUTION! Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which hazardous human body environment. safety, observe following procedures: ingest. alter form this product into gas, powder, liquid through burning, crushing, chemical processing these by-products dangerous human body inhaled, ingested, swallowed. Observe government laws company regulations when discarding this product. This product must discarded accordance with methods specified applicable hazardous waste procedures. Life Support Policy Mimix Broadband's products authorized critical components life support devices systems without express written approval President General Counsel Mimix Broadband. used herein: Life support devices systems devices systems which, intended surgical implant into body, support sustain life, whose failure perform when properly used accordance with instructions provided labeling, reasonably expected result significant injury user. critical component component life support device system whose failure perform reasonably expected cause failure life support device system, affect safety effectiveness. Gallium Arsenide (GaAs) devices susceptible electrostatic mechanical damage. supplied antistatic containers, which should opened cleanroom conditions appropriately grounded anti-static workstation. Devices need careful handling using correctly designed collets, vacuum pickups with care, sharp tweezers. Attachment GaAs Products from Mimix Broadband 0.100 (0.004") thick have vias through backside enable grounding circuit. Microstrip substrates should brought close possible. mounting surface should clean flat. using conductive epoxy, recommended epoxies Tanaka TS3332LD, DM6030HK DM6030HK-Pt cured nitrogen atmosphere manufacturer's cure schedule. Apply epoxy sparingly avoid getting surface die. epoxy fillet should visible around total periphery. additional information please Mimix "Epoxy Specifications Bare Die" application note. eutectic mounting preferred, then fluxless gold-tin (AuSn) preform, approximately 0.0012 thick, placed between attachment surface should used. bonder that utilizes heated collet provides scrubbing action ensure total wetting prevent void formation nitrogen atmosphere recommended. gold-tin eutectic (80% melting point approximately (Note: Gold Germanium should avoided). work station temperature should Exposure these extreme temperatures should kept minimum. collet should heated, pre-heated avoid excessive thermal shock. Avoidance bridges force impact critical during placement. Wire Bonding Windows surface passivation above bond pads provided allow wire bonding die's gold bond pads. recommended wire bonding procedure uses 0.076 0.013 (0.003" 0.0005") 99.99% pure gold ribbon with 0.5-2% elongation minimize port bond inductance. Gold 0.025 (0.001") diameter wedge ball bonds acceptable Bias connections. Aluminum wire should avoided. Thermo-compression bonding recommended though thermosonic bonding used providing ultrasonic content bond minimized. Bond force, time ultrasonics critical parameters. Bonds should made from bond pads package substrate. bonds should short possible. RoHS Compliant Parts Mimix products RoHS compliant unless specifically ordered with Tin-Lead finish.
Ordering Information
Part Number Ordering XM1005-BD-000V XM1005-BD-EV1
Description vacuum release paks XM1005-BD evaluation module
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page
Characteristic Data Specifications subject change without notice. ©2007 Mimix Broadband, Inc. Export this item require appropriate export licensing from U.S. Government. purchasing these parts, U.S. Domestic customers accept their obligation compliant with U.S. Export Laws.

M1005-BD Features Balanced Image Reject Mixer 12.0 Conversion Los

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