Push-Pull Output Sub-Microamp Comparators Quiescent Current: nA/c

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Push-Pull Output Sub-Microamp Comparators Quiescent Current: nA/c

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MCP6541/1R/1U/2/3/4
Push-Pull Output Sub-Microamp Comparators
Quiescent Current: nA/comparator (typ.) Rail-to-Rail Input: 0.3V 0.3V CMOS/TTL-Compatible Output Propagation Delay: (typ., Overdrive) Wide Supply Voltage Range: 1.6V 5.5V Available Single, Dual Quad Single available SOT-23-5, SC-70-5 packages Chip Select (CS) with MCP6543 Switching Current Internal Hysteresis: (typ.) Temperature Ranges: Industrial: -40°C +85°C Extended: -40°C +125°C
Description
Microchip Technology Inc. MCP6541/2/3/4 family comparators offered single (MCP6541, MCP6541R, MCP6541U), single with Chip Select (CS) (MCP6543), dual (MCP6542) quad (MCP6544) configurations. outputs push-pull (CMOS/TTLcompatible) capable driving heavy capacitive loads. These comparators optimized power, singlesupply operation with greater than rail-to-rail input operation. push-pull output MCP6541/1R/1U/2/3/4 family supports rail-to-rail output swing interfaces with TTL/CMOS logic. internal input hysteresis eliminates output switching internal input noise voltage, reducing current draw. output limits supply current surges dynamic power consumption while switching. This product family operates with single-supply voltage 1.6V draws less than µA/comparator quiescent current. related MCP6546/7/8/9 family comparators from Microchip open-drain output. Used with pull-up resistor, these devices used level-shifters desired voltage wired-OR logic. SC-70-5 E-Temp parts available this release data sheet. MCP6541U SOT-23-5 E-Temp only.
Typical Applications
Laptop Computers Mobile Phones Metering Systems Hand-held Electronics Timers Alarm Monitoring Circuits Windowed Comparators Multi-vibrators
Related Devices
Open-Drain Output: MCP6546/7/8/9
Package Types
MCP6541 PDIP, SOIC, MSOP VIN- VIN+ MCP6541R SOT-23-5 VIN+ MCP6542 PDIP, SOIC, MSOP MCP6544 PDIP, SOIC, TSSOP OUTD VIND- VIND+
OUTA VINA- VINA+ VIN-
OUTA OUTB VINA- VINB- VINA+ VINB+
MCP6541 SOT-23-5, SC-70-5 VIN+ VIN-
MCP6541U SOT-23-5 VIN- VIN+
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MCP6543 PDIP, SOIC, MSOP VIN- VIN+
VINC+ VINB+ VINB- VINC- OUTB OUTC
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ELECTRICAL CHARACTERISTICS
Notice: Stresses above those listed under "Absolute Maximum Ratings" cause permanent damage device. This stress rating only functional operation device those other conditions above those indicated operational listings this specification implied. Exposure maximum rating conditions extended periods affect device reliability.
Absolute Maximum Ratings
.7.0V Current Analog Input (VIN+, VIN-.±2 Analog Input (VIN) 1.0V 1.0V other Inputs Outputs. 0.3V 0.3V Difference Input voltage |VDD VSS| Output Short-Circuit Current .continuous Current Input Pins Current Output Supply Pins .±30 Storage temperature .-65°C +150°C Maximum Junction Temperature (TJ) +150°C protection pins (HBM;MM) 400V
Section 4.1.2 "Input Voltage Current Limits"
CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, +1.6V +5.5V, GND, +25°C,VIN+ VDD/2, VIN- VSS, VDD/2 (Refer Figure 1-3). Parameters
Power Supply Supply Voltage Quiescent Current comparator Input Input Voltage Range Common Mode Rejection Ratio Common Mode Rejection Ratio Common Mode Rejection Ratio Power Supply Rejection Ratio Input Offset Voltage Drift with Temperature Input Hysteresis Voltage Linear Temp. (Note Quadratic Temp. (Note Input Bias Current Temperature (I-Temp parts) Temperature (E-Temp parts) Input Offset Current Common Mode Input Impedance Differential Input Impedance Note VCMR CMRR CMRR CMRR PSRR VOS/TA VHYST ZDIFF VSS-0.3 -7.0 ±1.5 -0.035 1200 1013||4 1013||2 VDD+0.3 +7.0 5000 µV/°C µV/°C ||pF ||pF -0.3V 5.3V 2.5V 5.3V -0.3V 2.5V (Note -40°C +125°C, (Note -40°C +125°C, +85°C, (Note +125°C, (Note IOUT
Units
Conditions
µV/°C2 -40°C +125°C,
input offset voltage center (average) input-referred trip points. input hysteresis difference between input-referred trip points. VHYST different temperatures estimated using VHYST (TA) VHYST 25°C) 25°C)2 TC2. Input bias current temperature tested SC-70-5 package. Limit output current Absolute Maximum Rating
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CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, +1.6V +5.5V, GND, +25°C,VIN+ VDD/2, VIN- VSS, VDD/2 (Refer Figure 1-3). Parameters
Push-Pull Output High-Level Output Voltage Low-Level Output Voltage Short-Circuit Current Note VDD-0.2 -2.5, +1.5 VSS+0.2
Units
Conditions
IOUT IOUT
1.6V (Note 5.5V (Note
input offset voltage center (average) input-referred trip points. input hysteresis difference between input-referred trip points. VHYST different temperatures estimated using VHYST (TA) VHYST 25°C) 25°C)2 TC2. Input bias current temperature tested SC-70-5 package. Limit output current Absolute Maximum Rating
CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, +1.6V +5.5V, GND, +25°C, VIN+ VDD/2, Step Overdrive (Refer Figure Figure 1-3).
Parameters
Rise Time Fall Time Propagation Delay (High-to-Low) Propagation Delay (Low-to-High) Propagation Delay Skew Maximum Toggle Frequency Input Noise Voltage Note
tPHL tPLH tPDS fMAX fMAX
0.85 0.85 ±0.2
Units
µVP-P (Note 1.6V 5.5V
Conditions
Propagation Delay Skew defined tPDS tPLH tPHL.
MCP6543 CHIP SELECT (CS) CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, +1.6V +5.5V, GND, +25°C, VIN+ VDD/2, VIN- VSS, (Refer Figures 1-3).
Parameters
Specifications Logic Threshold, Input Current, High Specifications Logic Threshold, High Input Current, High Input High, Current Input High, Current Comparator Output Leakage Dynamic Specifications Comparator Output Turn-on Time High Comparator Output High Turn-off Time Hysteresis
ICSL ICSH IO(LEAK) tOFF VCS_HYST
Units
Conditions
VOUT VDD, VOUT VDD/2, VIN- VOUT VDD/2, VIN-
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VOUT Hi-Z -0.6 (typ.) tOFF Hi-Z (typ.) (typ.) VOUT VIN- VIN+ VDD/2 tPLH tPHL
(typ.) (typ.)
FIGURE 1-1: Timing Diagram MCP6543.
FIGURE 1-2: Diagram.
Propagation Delay Timing
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TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, +1.6V +5.5V GND. Parameters Temperature Ranges Specified Temperature Range Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 5L-SC-70 Thermal Resistance, 5L-SOT-23 Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC Thermal Resistance, 8L-MSOP Thermal Resistance, 14L-PDIP Thermal Resistance, 14L-SOIC Thermal Resistance, 14L-TSSOP Note: °C/W °C/W °C/W °C/W °C/W °C/W °C/W °C/W +125 +150 Note Units Conditions
MCP6541/2/3/4 I-Temp parts operate over this extended temperature range, with reduced performance. case, Junction Temperature (TJ) must exceed Absolute Maximum specification +150°C.
Test Circuit Configuration
This test circuit configuration used determine specifications.
MCP654X
VOUT
FIGURE 1-3: Test Circuit Push-Pull Output Comparators.
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Note:
TYPICAL PERFORMANCE CURVES
graphs tables provided following this note statistical summary based limited number samples provided informational purposes only. performance characteristics listed herein tested guaranteed. some graphs tables, data presented outside specified operating range (e.g., outside specified power supply range) therefore outside warranted range.
Note: Unless otherwise indicated, +1.6V +5.5V, GND, +25°C, VIN+ VDD/2, VIN- GND, VDD/2,
Percentage Occurrences Input Offset Voltage (mV) 1200 Samples Percentage Occurrences Input Hysteresis Voltage (mV) 1200 Samples
FIGURE 2-1: VSS.
Input Offset Voltage
FIGURE 2-4: VSS.
Percentage Occurrences 5.5V
Input Hysteresis Voltage
Percentage Occurrences
1200 Samples -40°C +125°C
Samples -40°C +125°C
1.6V
-0.020
Input Offset Voltage Drift (µV/°C)
Input Hysteresis Voltage Linear Temp. Co.; (µV/°C)
FIGURE 2-2: VSS.
Inverting Input, Output Voltage
Input Offset Voltage Drift
FIGURE 2-5: Input Hysteresis Voltage Linear Temp. (TC1) VSS.
Percentage Occurrences Samples -40°C +125°C 5.5V 1.6V
5.5V VOUT
-0.060
-0.056
-0.052
-0.048
-0.044
-0.040
-0.036
-0.032
-0.028
-0.024
Time ms/div)
Input Hysteresis Voltage Quadratic Temp. Co.; (µV/°C2)
FIGURE 2-3: MCP6541/1R/1U/2/3/4 comparators show phase reversal.
FIGURE 2-6: Input Hysteresis Voltage Quadratic Temp. (TC2) VSS.
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-0.016
VIN-
MCP6541/1R/1U/2/3/4
Note: Unless otherwise indicated, +1.6V +5.5V, GND, 25°C, VIN+ VDD/2, VIN- GND, VDD/2,
-0.2 -0.4 -0.6 -0.8 -1.0
Input Offset Voltage (mV)
1.6V
5.5V
Input Hysteresis Voltage (mV)
1.6V
5.5V
Ambient Temperature (°C)
Ambient Temperature (°C)
FIGURE 2-7: Input Offset Voltage Ambient Temperature VSS.
Input Offset Voltage (mV) -0.5 -1.0 -1.5 -2.0 -0.4 -0.2 Common Mode Input Voltage +125°C +125°C +85°C +25°C -40°C 1.6V
FIGURE 2-10: Input Hysteresis Voltage Ambient Temperature VSS.
Input Hysteresis Voltage (mV) -0.4 -0.2 Common Mode Input Voltage -40°C 1.6V
+125°C +85°C +25°C
FIGURE 2-8: Input Offset Voltage Common Mode Input Voltage 1.6V.
Input Offset Voltage (mV) -0.5 -1.0 -1.5 -2.0 -0.5 Common Mode Input Voltage +85°C +125°C 5.5V -40°C +25°C
FIGURE 2-11: Input Hysteresis Voltage Common Mode Input Voltage 1.6V.
Input Hysteresis Voltage (mV) -0.5 Common Mode Input Voltage 5.5V +125°C +85°C +25°C -40°C
FIGURE 2-9: Input Offset Voltage Common Mode Input Voltage 5.5V.
FIGURE 2-12: Input Hysteresis Voltage Common Mode Input Voltage 5.5V.
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Note: Unless otherwise indicated, +1.6V +5.5V, GND, 25°C, VIN+ VDD/2, VIN- GND, VDD/2,
Input Bias, Offset Currents CMRR, PSRR (dB) Ambient Temperature (°C) PSRR, VIN+ VSS, 1.6V 5.5V Input Referred 10000 +125°C 1000 100p IOS, +125°C IOS, +85°C +85°C 5.5V
CMRR, VIN+ -0.3 5.3V, 5.0V
100f Common Mode Input Voltage
FIGURE 2-13: Temperature.
1000
CMRR,PSRR Ambient
FIGURE 2-16: Input Bias Current, Input Offset Current Common Mode Input Voltage.
Quiescent Current Comparator (µA) +125°C +85°C +25°C -40°C Power Supply Voltage
Input Bias, Offset Currents (pA)
5.5V
Ambient Temperature (°C)
FIGURE 2-14: Input Bias Current, Input Offset Current Ambient Temperature.
Quiescent Current comparator (µA) Common Mode Input Voltage Sweep VIN+, VIN- VDD/2 Sweep VIN-, VIN+ VDD/2 1.6V
FIGURE 2-17: Quiescent Current Power Supply Voltage.
Quiescent Current Comparator (µA) Common Mode Input Voltage Sweep VIN+, VIN- VDD/2 Sweep VIN-, VIN+ VDD/2 5.5V
FIGURE 2-15: Quiescent Current Common Mode Input Voltage 1.6V.
FIGURE 2-18: Quiescent Current Common Mode Input Voltage 5.5V.
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Note: Unless otherwise indicated, +1.6V +5.5V, GND, 25°C, VIN+ VDD/2, VIN- GND, VDD/2,
Output Short Circuit Current Magnitude (mA) Supply Current (µA) Toggle Frequency (kHz) Power Supply Voltage -40°C +25°C +85°C +125°C
Overdrive VDD/2 infinity
5.5V 1.6V
FIGURE 2-19: Frequency.
Output Voltage Headroom VOL-VSS: +125°C +85°C +25°C -40°C
Supply Current Toggle
FIGURE 2-22: Output Short Circuit Current Magnitude Power Supply Voltage.
Output Voltage Headroom VSS: +125°C +85°C +25°C -40°C
1.6V
VDD-VOH: +125°C +85°C +25°C -40°C Output Current (mA)
5.5V Output Current (mA)
VOH: +125°C +85°C +25°C -40°C
FIGURE 2-20: Output Voltage Headroom Output Current 1.6V.
Percentage Occurrences High-to-Low Propagation Delay (µs) 1.6V 5.5V Samples Overdrive VDD/2
FIGURE 2-23: Output Voltage Headroom Output Current 5.5V.
Percentage Occurrences Low-to-High Propagation Delay (µs) 1.6V 5.5V Samples Overdrive VDD/2
FIGURE 2-21: Delay.
High-to-Low Propagation
FIGURE 2-24: Delay.
Low-to-High Propagation
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Note: Unless otherwise indicated, +1.6V +5.5V, GND, 25°C, VIN+ VDD/2, VIN- GND, VDD/2,
-2.0 -1.5 -1.0 -0.5 Propagation Delay Skew (µs) 5.5V 1.6V
Percentage Occurrences
Propagation Delay (µs)
Samples Overdrive VDD/2
Overdrive VDD/2 tPLH 5.5V tPHL 5.5V
tPLH 1.6V
tPHL 1.6V
Ambient Temperature (°C)
FIGURE 2-25:
Propagation Delay Skew.
FIGURE 2-28: Propagation Delay Ambient Temperature.
Propagation Delay (µs)
VDD/2 tPLH Overdrive tPHL Overdrive tPLH Overdrive tPHL Overdrive Power Supply Voltage
Propagation Delay (µs)
VDD/2 tPHL 5.5V tPLH 1.6V tPHL 1.6V
tPLH 5.5V Input Overdrive (mV) 1000
FIGURE 2-26: Propagation Delay Power Supply Voltage.
Propagation Delay (µs) Common Mode Input Voltage tPLH tPHL 1.6V Overdrive
FIGURE 2-29: Overdrive.
Propagation Delay (µs)
Propagation Delay Input
5.5V Overdrive tPHL tPLH
Common Mode Input Voltage
FIGURE 2-27: Propagation Delay Common Mode Input Voltage 1.6V.
FIGURE 2-30: Propagation Delay Common Mode Input Voltage 5.5V.
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Note: Unless otherwise indicated, +1.6V +5.5V, GND, 25°C, VIN+ VDD/2, VIN- GND, VDD/2,
Overdrive VDD/2 tPHL 1.6V tPLH 1.6V tPHL 5.5V tPLH 5.5V Load Capacitance (nF) -0.5 Chip Select, Output Voltage 5.5V
Propagation Delay (µs)
VOUT
Time (ms)
FIGURE 2-31: Capacitance.
1.E-03 Supply Current Comparator 1.E-04 100µ 1.E-05 1.E-06 100n 1.E-07 1.E-08 1.E-09 100p 1.E-10
Propagation Delay Load
FIGURE 2-34: Chip Select (CS) Step Response (MCP6543 only).
1.E-03 Supply Current Comparator Comparator Turns Comparator Shuts
Comparator Turns
Comparator Shuts
100µ 1.E-04 1.E-05 1.E-06 100n 1.E-07 1.E-08 1.E-09 100p 1.E-10
Hysteresis High-to-Low Low-to-High
Hysteresis Low-to-High High-to-Low
1.6V 1.E-11
5.5V 1.E-11 Chip Select (CS) Voltage
Chip Select (CS) Voltage
FIGURE 2-32: Supply Current (shoot through current) Chip Select (CS) Voltage 1.6V (MCP6543 only).
Output Voltage, Chip Select Voltage (V), Supply Current (µA) Time ms/div) Charging output capacitance 1.6V Start-up VOUT -1.6 -3.2 -4.9 -6.5 -8.1
FIGURE 2-35: Supply Current (shoot through current) Chip Select (CS) Voltage 5.5V (MCP6543 only).
Output Voltage, Chip Select Voltage
VOUT
Start-up
Supply Current Comparator (µA)
5.5V Charging output capacitance
Time (0.5 ms/div)
FIGURE 2-33: Supply Current (charging current) Chip Select (CS) pulse 1.6V (MCP6543 only).
FIGURE 2-36: Supply Current (charging current) Chip Select (CS) pulse 5.5V (MCP6543 only).
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Note: Unless otherwise indicated, +1.6V +5.5V, GND, 25°C, VIN+ VDD/2, VIN- GND, VDD/2,
1.E-02 1.E-03 1.E-04 100µ 1.E-05 1.E-06 100n 1.E-07 1.E-08 1.E-09 100p 1.E-10 1.E-11 1.E-12
Input Current Magnitude
+125°C +85°C +25°C -40°C
-1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 Input Voltage
FIGURE 2-37: Voltage
Input Bias Current Input
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DESCRIPTIONS
Descriptions pins listed Table 3-1.
TABLE 3-1:
FUNCTION TABLE
MCP6541R MCP6541U MCP6542 MCP6543 MCP6544
MCP6541 MCP6541 (PDIP, (SOT-23-5, SOIC, SC-70-5) MSOP)
Symbol
Description
OUT, OUTA Digital Output (comparator VIN-, VINA- Inverting Input (comparator VIN+, VINA+ Non-inverting Input (comparator VINB+ VINB- OUTB OUTC VINC- VINC+ VIND+ VIND- OUTD Positive Power Supply Non-inverting Input (comparator Inverting Input (comparator Digital Output (comparator Digital Output (comparator Inverting Input (comparator Non-inverting Input (comparator Negative Power Supply Non-inverting Input (comparator Inverting Input (comparator Digital Output (comparator Chip Select Internal Connection
Analog Inputs
Power Supply (VSS VDD)
comparator non-inverting inverting inputs high-impedance CMOS inputs with bias currents.
Digital Input
positive power supply (VDD) 1.6V 5.5V higher than negative power supply (VSS). normal operation, other pins voltages between VDD. Typically, these parts used single (positive) supply configuration. this case, connected ground connected supply. will need local bypass capacitor (typically 0.01 within pin. These share bulk capacitor with nearby analog parts (within mm), required.
This CMOS, Schmitt-triggered input that places part into power mode operation.
Digital Outputs
comparator outputs CMOS, push-pull digital outputs. They designed compatible with CMOS logic capable driving heavy capacitive loads.
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APPLICATIONS INFORMATION
MCP6541/2/3/4 family push-pull output comparators fabricated Microchip's state-of-the-art CMOS process. They suitable wide range applications requiring very power consumption. resistors limit possible current drawn input pin. Diodes prevent input (VIN+ VIN-) from going above VDD. When implemented shown, resistors also limit current through
4.1.1
Comparator Inputs
PHASE REVERSAL
MCP6541/1R/1U/2/3/4 comparator family uses CMOS transistors input. They designed prevent phase inversion when input pins exceed supply voltages. Figure shows input voltage exceeding both supplies with resulting phase inversion.
MCP6G0X
VOUT
4.1.2
INPUT VOLTAGE CURRENT LIMITS
protection inputs depicted shown Figure 4-1. This structure chosen protect input transistors, minimize input bias current (IB). input diodes clamp inputs when they more than diode drop below VSS. They also clamp voltages that above VDD; their breakdown voltage high enough allow normal operation, enough bypass events within specified limits. Bond
(minimum expected (minimum expected
FIGURE 4-2:
Protecting Analog Inputs.
also possible connect diodes left resistors this case, currents through diodes need limited some other mechanism. resistor then serves in-rush current limiter; current into input pins (VIN+ VIN-) should very small. significant amount current flow inputs when common mode voltage (VCM) below ground (VSS); Figure 2-37. Applications that high impedance need limit useable voltage range.
VIN+ Bond
Input Stage
Bond
VIN-
4.1.3
Bond
NORMAL OPERATION
FIGURE 4-1: Structures.
Simplified Analog Input
order prevent damage and/or improper operation these amplifiers, circuits they must limit currents (and voltages) VIN+ VIN- pins (see Absolute Maximum Ratings beginning Section "Electrical Characteristics"). Figure shows recommended approach protecting these inputs. internal diodes prevent input pins (VIN+ VIN-) from going below ground,
input stage this family devices uses differential input stages parallel: operates input voltages other high input voltages. With this topology, input voltage 0.3V above 0.3V below VSS. Therefore, input offset voltage measured both 0.3V 0.3V ensure proper operation. MCP6541/1R/1U/2/3/4 family internally-set hysteresis that small enough maintain input offset accuracy large enough eliminate output chattering caused comparator's input noise voltage (200 µVp-p). Figure depicts this behavior.
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5.0V VIN- VOUT Input Voltage mV/div)
Externally Hysteresis
Greater flexibility selecting hysteresis input trip points) achieved using external resistors. Input offset voltage (VOS) center (average) (input-referred) low-high high-low trip points. Input hysteresis voltage (VHYST) difference between same trip points. Hysteresis reduces output chattering when input slowly moving past other thus reduces dynamic supply current. also helps systems where best cycle between states frequently (e.g., conditioner thermostatic control).
Output Voltage
Hysteresis
Time (100 ms/div)
FIGURE 4-3: MCP6541/2/3/4 comparators' internal hysteresis eliminates output chatter caused input noise voltage.
4.4.1
NON-INVERTING CIRCUIT
Push-Pull Output
Figure shows non-inverting circuit singlesupply applications using just resistors. resulting hysteresis diagram shown Figure 4-5. VREF MCP654X VOUT
push-pull output designed compatible with CMOS logic, while output transistors configured give rail-to-rail output performance. They driven with circuitry that minimizes switching current (shoot-through current from supply-to-supply) when output transitioned from high-to-low, from low-to-high (see Figures 2-15, 2-18, 2-32 through 2-36 more information).
MCP6543 Chip Select (CS)
MCP6543 single comparator with Chip Select (CS). When pulled high, total current consumption drops (typ.); (typ.) flows through pin, (typ.) flows through output (typ.) flows through pin, shown Figure 1-1. When this happens, comparator output into high-impedance state. pulling low, comparator enabled. left floating, comparator will operate properly. Figure shows output voltage supply current response pulse. internal circuitry designed minimize glitches when cycling pin. This helps conserve power, which especially important battery-powered applications.
FIGURE 4-4: Non-inverting circuit with hysteresis single-supply.
VOUT High-to-Low Low-to-High VTHL VTLH
FIGURE 4-5: Hysteresis Diagram Non-Inverting Circuit.
trip points Figures are:
EQUATION 4-1:
VTLH trip voltage from high VTHL trip voltage from high
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4.4.2 INVERTING CIRCUIT
Where: VOUT Using this simplified circuit, trip voltage calculated using following equation: Figure shows inverting circuit single-supply using three resistors. resulting hysteresis diagram shown Figure 4-7. MCP654X
EQUATION 4-2:
FIGURE 4-6: Hysteresis.
VOUT Low-to-High
Inverting Circuit With
VTLH trip voltage from high VTHL trip voltage from high Figure 2-20 Figure 2-23 used determine typical values VOL.
High-to-Low
Bypass Capacitors
VTLH VTHL
FIGURE 4-7: Inverting Circuit.
Hysteresis Diagram
With this family comparators, power supply (VDD single supply) should have local bypass capacitor (i.e., 0.01 within good edge rate performance.
Capacitive Loads
order determine trip voltages (VTHL VTLH) circuit shown Figure 4-6, simplified Thevenin equivalent circuit with respect VDD, shown Figure 4-8. MCP654X VOUT
Reasonable capacitive loads (e.g., logic gates) have little impact propagation delay (see Figure 2-31). supply current increases with increasing toggle frequency (Figure 2-19), especially with higher capacitive loads.
Battery Life
order maximize battery life portable applications, large resistors small capacitive loads. Avoid toggling output more than necessary. Chip Select (CS) frequently conserve start-up power. Capacitive loads will draw additional power start-up.
FIGURE 4-8:
Thevenin Equivalent Circuit.
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Surface Leakage Unused Comparators
applications where input bias current critical, (Printed Circuit Board) surface leakage effects need considered. Surface leakage caused humidity, dust other contamination board. Under humidity conditions, typical resistance between nearby traces 1012. difference would cause current flow. This greater than MCP6541/1R/1U/2/3/4 family's bias current 25°C typ.). easiest reduce surface leakage guard ring around sensitive pins traces). guard ring biased same voltage sensitive pin. example this type layout shown Figure 4-9. VINVIN+ unused amplifier quad package (MCP6544) should configured shown Figure 4-10. This circuit prevents output from toggling causing crosstalk. uses minimum number components draws minimal current (see Figure 2-15 Figure 2-18). MCP6544
FIGURE 4-10:
Guard Ring
Unused Comparators.
FIGURE 4-9: Example Guard Ring Layout Inverting Circuit.
Inverting Configuration (Figures 4-9): Connect guard ring non-inverting input (VIN+). This biases guard ring same reference voltage comparator (e.g., VDD/2 ground). Connect inverting (VIN-) input without touching guard ring. Non-inverting Configuration (Figure 4-4): Connect non-inverting (VIN+) input without touching guard ring. Connect guard ring inverting input (VIN-).
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4.10
4.10.1
Typical Applications
PRECISE COMPARATOR
4.10.3
BISTABLE MULTI-VIBRATOR
Some applications require higher precision. easy solve this problem amplifier (such MCP6041) gain-up input signal before reaches comparator. Figure 4-11 shows example this approach. VREF MCP6041 VREF MCP654X VOUT
simple bistable multi-vibrator design shown Figure 4-13. VREF needs between power supplies (VSS VDD) achieve oscillation. output duty cycle changes with VREF. VREF MCP6541 VOUT
FIGURE 4-13:
Bistable Multi-vibrator.
FIGURE 4-11: Comparator. 4.10.2
Precise Inverting
WINDOWED COMPARATOR
Figure 4-12 shows approach designing windowed comparator. gate produces logic when input voltage between (where VRB). MCP6542
MCP6542
FIGURE 4-12:
Windowed Comparator.
DS21696E-page
2006 Microchip Technology Inc.
MCP6541/1R/1U/2/3/4
PACKAGING INFORMATION
Package Marking Information
5-Lead SC-70 (MCP6541)
Device I-Temp Code ABNN E-Temp Code Note
Example:
XXNN Front) (Back)
MCP6541U Note
AB25 Front) (Back)
I-Temp parts prior March 2005 marked "ABN" SC-70-5 E-Temp parts available this release this data sheet.
5-Lead SOT-23 (MCP6541, MCP6541R, MCP6541U)
Device I-Temp Code ABNN AGNN E-Temp Code GTNN GUNN ATNN
Example:
XXNN
8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW
MCP6541 MCP6541R MCP6541U
AB25
Example:
Note:
Applies 5-Lead SOT-23
MCP6541 I/P256 0636
MCP6541 E/P^^256 0636
8-Lead SOIC (150 mil) XXXXXXXX XXXXYYWW
Example: MCP6542 I/SN0636 MCP6541E SN^^0636
8-Lead MSOP XXXXXX YWWNNN
Example: 6543I 636256
Legend: XX.X
Note:
Customer-specific information Year code (last digit calendar year) Year code (last digits calendar year) Week code (week January week `01') Alphanumeric traceability code Pb-free JEDEC designator Matte (Sn) This package Pb-free. Pb-free JEDEC designator found outer packaging this package.
event full Microchip part number cannot marked line, will carried over next line, thus limiting number available characters customer-specific information.
2006 Microchip Technology Inc.
DS21696E-page
MCP6541/1R/1U/2/3/4
Package Marking Information (Continued)
14-Lead PDIP (300 mil) (MCP6544) Example:
XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN
MCP6544-I/P XXXXXXXXXXXXXX 0636256
MCP6544E/P 0636256
MCP6544 I/P^^ 0636256
14-Lead SOIC (150 mil) (MCP6544)
Example:
XXXXXXXXXX XXXXXXXXXX YYWWNNN
MCP6544ISL XXXXXXXXXX 0636256
MCP6544 E/SL^^ 0636256
14-Lead TSSOP (MCP6544)
Example:
XXXXXXXX YYWW
MCP6544I 0636
DS21696E-page
2006 Microchip Technology Inc.
MCP6541/1R/1U/2/3/4
5-Lead Plastic Small Outline Transistor (LT) (SC-70)
Note: most current package drawings, please Microchip Packaging Specification located
Units Dimension Limits Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Molded Lead Shoulder Lead Thickness Lead Width Controlling Parameter Notes: INCHES .026 (BSC) .031 .031 .000 .071 .045 .071 .004 .004 .004 .006
MILLIMETERS* 0.65 (BSC) .043 .039 .004 .094 .053 .087 .012 .016 .007 .012 0.80 0.80 0.00 1.80 1.15 1.80 0.10 0.10 0.10 0.15 1.10 1.00 0.10 2.40 1.35 2.20 0.30 0.40 0.18 0.30
Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .005" (0.127mm) side. BSC: Basic Dimension. Theoretically exact value shown without tolerances. ASME Y14.5M JEITA (EIAJ) Standard: SC-70 Drawing C04-061
Revised 07-19-05
2006 Microchip Technology Inc.
DS21696E-page
MCP6541/1R/1U/2/3/4
5-Lead Plastic Small Outline Transistor (OT) (SOT23)
Note: most current package drawings, please Microchip Packaging Specification located
Units Dimension Limits Number Pins Pitch Outside lead pitch (basic) Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom
INCHES* .038 .075 .035 .035 .000 .102 .059 .110 .014 .004 .014 .006 .017 .046 .043 .003 .110 .064 .116 .018 .057 .051 .006 .118 .069 .122 .022 .008 .020 0.35 0.90 0.90 0.00 2.60 1.50 2.80 0.35
MILLIMETERS 0.95 1.90 1.18 1.10 0.08 2.80 1.63 2.95 0.45 0.09 0.15 0.43 1.45 1.30 0.15 3.00 1.75 3.10 0.55 0.20 0.50
Controlling Parameter Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .005" (0.127mm) side. EIAJ Equivalent: SC-74A Revised 09-12-05 Drawing C04-091
DS21696E-page
2006 Microchip Technology Inc.
MCP6541/1R/1U/2/3/4
8-Lead Plastic Dual In-line (PDIP)
Note: most current package drawings, please Microchip Packaging Specification located
Number Pins Pitch Seating Plane .140 .170 4.32 Molded Package Thickness .115 .145 3.68 Base Seating Plane .015 Shoulder Shoulder Width .300 .313 .325 8.26 Molded Package Width .240 .250 .260 6.60 Overall Length .360 .373 .385 9.78 Seating Plane .125 .130 .135 3.43 Lead Thickness .008 .012 .015 0.38 Upper Lead Width .045 .058 .070 1.78 Lower Lead Width .014 .018 .022 0.56 Overall Spacing .310 .370 .430 10.92 Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MS-001 Drawing C04-018
Units Dimension Limits
INCHES* .100 .155 .130
MILLIMETERS 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40
2006 Microchip Technology Inc.
DS21696E-page
MCP6541/1R/1U/2/3/4
8-Lead Plastic Small Outline (SN) Narrow, (SOIC)
Note: most current package drawings, please Microchip Packaging Specification located
Number Pins Pitch Overall Height .053 .069 1.75 Molded Package Thickness .052 .061 1.55 Standoff .004 .010 0.25 Overall Width .228 .244 6.20 Molded Package Width .146 .157 3.99 Overall Length .189 .197 5.00 Chamfer Distance .010 .020 0.51 Foot Length .019 .030 0.76 Foot Angle Lead Thickness .008 .010 0.25 Lead Width .013 .020 0.51 Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MS-012 Drawing C04-057
Units Dimension Limits
INCHES* .050 .061 .056 .007 .237 .154 .193 .015 .025 .009 .017
MILLIMETERS 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0.20 0.23 0.33 0.42
DS21696E-page
2006 Microchip Technology Inc.
MCP6541/1R/1U/2/3/4
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
Note: most current package drawings, please Microchip Packaging Specification located
NOTE
Units Dimension Limits Thickness Width
MILLIMETERS 0.65 0.85 4.90 3.00 3.00 0.60 0.95
Number Pins Pitch Overall Height Molded Package Standoff Overall Width Molded Package Overall Length Foot Length Footprint Foot Angle Lead Thickness Lead Width
0.75 0.00
1.10 0.95 0.15
0.40 0.08 0.22
0.80 0.23 0.40
Notes: visual index feature vary, must located within hatched area. Dimensions include mold flash protrusions. Mold flash protrusions shall exceed 0.15 side. Dimensioning tolerancing ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, information purposes only. Microchip Technology Drawing C04-111, Sept. 2006
2006 Microchip Technology Inc.
DS21696E-page
MCP6541/1R/1U/2/3/4
14-Lead Plastic Dual In-line (PDIP)
Note: most current package drawings, please Microchip Packaging Specification located
Number Pins Pitch Seating Plane .140 .170 4.32 Molded Package Thickness .115 .145 3.68 Base Seating Plane .015 Shoulder Shoulder Width .300 .313 .325 8.26 Molded Package Width .240 .250 .260 6.60 Overall Length .740 .750 .760 19.30 Seating Plane .125 .130 .135 3.43 Lead Thickness .008 .012 .015 0.38 Upper Lead Width .045 .058 .070 1.78 Lower Lead Width .014 .018 .022 0.56 Overall Spacing .310 .370 .430 10.92 Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MS-001 Drawing C04-005
Units Dimension Limits
INCHES* .100 .155 .130
MILLIMETERS 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 18.80 19.05 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40
DS21696E-page
2006 Microchip Technology Inc.
MCP6541/1R/1U/2/3/4
14-Lead Plastic Small Outline (SL) Narrow, (SOIC)
Note: most current package drawings, please Microchip Packaging Specification located
Number Pins Pitch Overall Height .053 .069 1.75 Molded Package Thickness .052 .061 1.55 Standoff .004 .010 0.25 Overall Width .228 .244 6.20 Molded Package Width .150 .157 3.99 Overall Length .337 .347 8.81 Chamfer Distance .010 .020 0.51 Foot Length .016 .050 1.27 Foot Angle Lead Thickness .008 .010 0.25 Lead Width .014 .020 0.51 Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MS-012 Drawing C04-065 Revised 7-20-06
Units Dimension Limits
INCHES* .050 .061 .056 .007 .236 .154 .342 .015 .033 .009 .017
MILLIMETERS 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 5.99 3.81 3.90 8.56 8.69 0.25 0.38 0.41 0.84 0.20 0.23 0.36 0.42
2006 Microchip Technology Inc.
DS21696E-page
MCP6541/1R/1U/2/3/4
14-Lead Plastic Thin Shrink Small Outline (ST) (TSSOP)
Note: most current package drawings, please Microchip Packaging Specification located
Units Dimension Limits .039 .033 .002 .246 .169 .193 .020 .004 .007 INCHES .026 .041 .035 .004 .251 .173 .197 .024 .006 .010
MILLIMETERS* 0.65 .043 .037 .006 .256 .177 .201 .028 .008 .012 1.00 0.85 0.05 6.25 4.30 4.90 0.50 0.09 0.19 1.05 0.90 0.10 6.38 4.40 5.00 0.60 0.15 0.25
Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom
1.10 0.95 0.15 6.50 4.50 5.10 0.70 0.20 0.30
Controlling Parameter Notes: Dimensions include mold protrusions. Mold flash protrusions shall exceed .005" (0.127mm) side. BSC: Basic Dimension. Theoretically exact value shown without tolerances. ASME Y14.5M REF: Reference Dimension, usually without tole rance, information purposes only. ASME Y14.5M JEDEC Equivalent: MO-153 AB-1 Drawing C04-087
Revised: 08-17-05
DS21696E-page
2006 Microchip Technology Inc.
MCP6541/1R/1U/2/3/4
APPENDIX REVISION HISTORY
Revision (September 2006)
following list modifications: Added MCP6541U pinout SOT-23-5 package. Clarified Absolute Maximum Analog Input Voltage Current Specifications. Added applications writeups unused comparators. Added disclaimer package outline drawings.
Revision (May 2006)
following list modifications: Added E-temp parts. Changed VHYST temperature specification linear quadratic temperature coefficients. Changed specifications plots E-Temp. Added Section Descriptions Corrected package marking (See Section "Package Marking Information") Added Appendix Revision History.
Revision (September 2003) Revision (November 2002) Revision (March 2002)
Original Release this Document.
2006 Microchip Technology Inc.
DS21696E-page
MCP6541/1R/1U/2/3/4
NOTES:
DS21696E-page
2006 Microchip Technology Inc.
MCP6541/1R/1U/2/3/4
PRODUCT IDENTIFICATION SYSTEM
order obtain information, e.g., pricing delivery, refer factory listed sales office. PART Device Temperature Range Package Examples:
MCP6541T-I/LT: Tape Reel, Industrial Temperature, SC-70. MCP6541T-I/OT: Tape Reel, Industrial Temperature, SOT-23. MCP6541-E/P: Extended Temperature, PDIP. MCP6541RT-I/OT: Tape Reel, Industrial Temperature, SOT23. MCP6541-E/SN: Extended Temperature, SOIC. MCP6541UT-E/OT:Tape Reel, Extended Temperature, SOT23. MCP6542-I/MS: Industrial Temperature, MSOP. MCP6542T-I/MS: Tape Reel, Industrial Temperature, MSOP. MCP6542-I/P: Industrial Temperature, PDIP. MCP6542-E/SN: Extended Temperature, SOIC. Industrial Temperature, SOIC. MCP6543T-I/SN: Tape Reel, Industrial Temperature, SOIC. MCP6543-I/P: Industrial Temperature, PDIP. MCP6543-E/SN: Extended Temperature, SOIC.
Device: MCP6541: MCP6541T: MCP6541RT: MCP6541UT: MCP6542: MCP6542T: MCP6543: MCP6543T: MCP6544: MCP6544T: Single Comparator Single Comparator (Tape Reel) (SC-70, SOT-23, SOIC, MSOP) Single Comparator (Rotated Tape Reel) (SOT-23 only) Single Comparator (Tape Reel) (SOT-23-5 E-Temp only) Dual Comparator Dual Comparator (Tape Reel SOIC MSOP) Single Comparator with Single Comparator with (Tape Reel SOIC MSOP) Quad Comparator Quad Comparator (Tape Reel SOIC TSSOP)
Temperature Range:
-40°C +85°C -40°C +125°C SC-70-5 E-Temp parts available this release data sheet.
Package:
Plastic Package (SC-70), 5-lead Plastic Small Outline Transistor (SOT-23), 5-lead Plastic MSOP, 8-lead Plastic (300 Body), 8-lead, 14-lead Plastic SOIC (150 Body), 8-lead Plastic SOIC (150 Body), 14-lead (MCP6544) Plastic TSSOP (4.4mm Body), 14-lead (MCP6544)
MCP6543-I/SN:
MCP6544T-I/SL:
Tape Reel, Industrial Temperature, 14LD SOIC. MCP6544T-E/SL: Tape Reel, Extended Temperature, 14LD SOIC. MCP6544-I/P: Industrial Temperature, 14LD PDIP. MCP6544T-E/ST: Tape Reel, Extended Temperature, 14LD TSSOP.
2006 Microchip Technology Inc.
DS21696E-page
MCP6541/1R/1U/2/3/4
NOTES:
DS21696E-page
2006 Microchip Technology Inc.
Note following details code protection feature Microchip devices: Microchip products meet specification contained their particular Microchip Data Sheet. Microchip believes that family products most secure families kind market today, when used intended manner under normal conditions. There dishonest possibly illegal methods used breach code protection feature. these methods, knowledge, require using Microchip products manner outside operating specifications contained Microchip's Data Sheets. Most likely, person doing engaged theft intellectual property. Microchip willing work with customer concerned about integrity their code. Neither Microchip other semiconductor manufacturer guarantee security their code. Code protection does mean that guaranteeing product "unbreakable."
Code protection constantly evolving. Microchip committed continuously improving code protection features products. Attempts break Microchip's code protection feature violation Digital Millennium Copyright Act. such acts allow unauthorized access your software other copyrighted work, have right relief under that Act.
Information contained this publication regarding device applications like provided only your convenience superseded updates. your responsibility ensure that your application meets with your specifications. MICROCHIP MAKES REPRESENTATIONS WARRANTIES KIND WHETHER EXPRESS IMPLIED, WRITTEN ORAL, STATUTORY OTHERWISE, RELATED INFORMATION, INCLUDING LIMITED CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY FITNESS PURPOSE. Microchip disclaims liability arising from this information use. Microchip devices life support and/or safety applications entirely buyer's risk, buyer agrees defend, indemnify hold harmless Microchip from damages, claims, suits, expenses resulting from such use. licenses conveyed, implicitly otherwise, under Microchip intellectual property rights.
Trademarks Microchip name logo, Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, MATE, PowerSmart, rfPIC, SmartShunt registered trademarks Microchip Technology Incorporated U.S.A. other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor Embedded Control Solutions Company registered trademarks Microchip Technology Incorporated U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock ZENA trademarks Microchip Technology Incorporated U.S.A. other countries. SQTP service mark Microchip Technology Incorporated U.S.A. other trademarks mentioned herein property their respective companies. 2006, Microchip Technology Incorporated, Printed U.S.A., Rights Reserved. Printed recycled paper.
Microchip received ISO/TS-16949:2002 certification worldwide headquarters, design wafer fabrication facilities Chandler Tempe, Arizona, Gresham, Oregon Mountain View, California. Company's quality system processes procedures PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory analog products. addition, Microchip's quality system design manufacture development systems 9001:2000 certified.
2006 Microchip Technology Inc.
DS21696E-page
WORLDWIDE SALES SERVICE
AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Address: www.microchip.com Atlanta Alpharetta, Tel: 770-640-0034 Fax: 770-640-0307 Boston Westborough, Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, Tel: 765-864-8360 Fax: 765-864-8387 Angeles Mission Viejo, Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office Suites 3707-14, 37th Floor Tower Gateway Habour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China Fuzhou Tel: 86-591-8750-3506 Fax: 86-591-8750-3521 China Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 China Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 China Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China Xian Tel: 86-29-8833-7250 Fax: 86-29-8833-7256
ASIA/PACIFIC
India Bangalore Tel: 91-80-4182-8400 Fax: 91-80-4182-8422 India Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea Gumi Tel: 82-54-473-4301 Fax: 82-54-473-4302 Korea Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 82-2-558-5934 Malaysia Penang Tel: 60-4-646-8870 Fax: 60-4-646-5086 Philippines Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan Hsin Tel: 886-3-572-9526 Fax: 886-3-572-6459 Taiwan Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350
EUROPE
Austria Wels Tel: 43-7242-2244-3910 Fax: 43-7242-2244-393 Denmark Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820
08/29/06
DS21696E-page
2006 Microchip Technology Inc.

Push-Pull Output Sub-Microamp Comparators Quiescent Current: nA/c

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