2.5V 5.5V Micropower CMOS Amps Input Offset Voltage: (max.) Rail-
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MCP606/7/8/9
2.5V 5.5V Micropower CMOS Amps
Input Offset Voltage: (max.) Rail-to-Rail Output Input Bias Current: (max. 85°C) Quiescent Current: (max.) Power Supply Voltage: 2.5V 5.5V Unity-Gain Stable Chip Select (CS) Capability: MCP608 Industrial Temperature Range: -40°C +85°C Phase Reversal Available Single, Dual Quad Packages
Description
MCP606/7/8/9 family operational amplifiers amps) from Microchip Technology Inc. unity-gain stable with offset voltage (250 max.). Performance characteristics include rail-to-rail output swing capability input bias current +85°C, max.). These features make this family amps well suited single-supply, precision, highimpedance, battery-powered applications. single MCP606 available standard 8-lead PDIP, SOIC TSSOP packages, well SOT-23-5 package. single MCP608 with Chip Select (CS) offered standard 8-lead PDIP, SOIC TSSOP packages. dual MCP607 offered standard 8-lead PDIP, SOIC TSSOP packages. Finally, quad MCP609 offered standard 14-lead PDIP, SOIC TSSOP packages. devices fully specified from -40°C +85°C, with power supplies from 2.5V 5.5V.
Typical Applications
Battery Power Instruments High-Impedance Applications Photodiode Amplifier Probe Buffer Amplifier Infrared Detectors Precision Integrators Charge Amplifier Piezoelectric Transducers Strain Gauges Medical Instruments Test Equipment
Package Types
MCP606 PDIP, SOIC,TSSOP VIN- VIN+ VOUT MCP606 SOT-23-5 VOUT VIN+ VIN-
Available Tools
SPICE Macro Models www.microchip.com) FilterLab® Software www.microchip.com)
MCP607 PDIP, SOIC,TSSOP VOUTA VINA- VINA+
MCP608 PDIP, SOIC,TSSOP VOUT
Typical Application
2.5V 5.5V RSEN MCP606 Load (VLP) VOUT Load (VLM)
VOUTB VIN- VINB- VIN+ VINB+
MCP609 PDIP, SOIC,TSSOP VOUTA VINA- VINA+ VINB+ VINB- VOUTB VOUTD VIND- VIND+ VINC+ VINC- VOUTC
Low-Side Battery Current Sensor
2005 Microchip Technology Inc.
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MCP606/7/8/9
ELECTRICAL CHARACTERISTICS
Notice: Stresses above those listed under "Absolute Maximum Ratings" cause permanent damage device. This stress rating only functional operation device those other conditions above those indicated operational listings this specification implied. Exposure maximum rating conditions extended periods affect device reliability.
Absolute Maximum Ratings
.7.0V Inputs Outputs 0.3V 0.3V Difference Input Voltage |VDD VSS| Output Short Circuit Current .continuous Current Input Pins Current Output Supply Pins .±30 Storage temperature .-65°C +150°C Maximum Junction Temperature (TJ) +150°C protection pins (HBM;MM) 200V
CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, +2.5V +5.5V, GND, +25°C, VDD/2, VOUT VDD/2 VDD/2. Parameters Input Offset Input Offset Voltage Input Offset Drift with Temperature Power Supply Rejection Ratio Input Bias Current Impedance Input Bias Current Temperature Input Offset Bias Current Common Mode Input Impedance Differential Input Impedance Common Mode Common Mode Input Range Common Mode Rejection Ratio Open-Loop Gain Open-Loop Gain (Large-signal) Open-Loop Gain (Large-signal) Output Maximum Output Voltage Swing VOL, VOL, Linear Output Voltage Range VOUT VOUT Output Short Circuit Current Power Supply Supply Voltage Quiescent Current Amplifier 18.7 VDD/2, 0.5V output overdrive VDD/2, 0.5V output overdrive VDD/2, VDD/2, 2.5V 5.5V VDD/2, VOUT VDD/2, VOUT 0.1V 0.1V VCMR CMRR CMRR -0.3V 3.9V ZDIFF 1013||6
Units
Conditions
VOS/TA PSRR
-250
±1.8
+250
µV/°C -40°C +85°C ||pF ||pF +85°C
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MCP606/7/8/9
CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, +2.5V +5.5V, GND, 25°C, VDD/2, VOUT VDD/2, VDD/2 Parameters Response Gain Bandwidth Product Phase Margin Slew Rate Noise Input Noise Voltage Input Noise Voltage Density Input Noise Current Density µVP-P nV/Hz fA/Hz GBWP 0.08 V/µs Units Conditions
MCP608 CHIP SELECT (CS) CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, +2.5V +5.5V, GND, 25°C, VDD/2, VOUT VDD/2, VDD/2 Parameters Specifications Logic Threshold, Input Current, High Specifications Logic Threshold, High Input Current, High Input High, Current Amplifier Output Leakage, High Dynamic Specifications Amplifier Output Turn-on Time High Amplifier Output Hi-Z Hysteresis tOFF VHYST 0.2VDD VOUT 0.9(VDD/2), V/V, 0.8VDD VOUT 0.1(VDD/2), V/V, 5.0V ICSH IO(LEAK) 0.01 -0.05 ICSL -0.1 0.01 0.2VDD Units Conditions
VOUT Hi-Z
tOFF Hi-Z (typ.) (typ.)
(typ.) -18.7 (typ.) (typ.)
FIGURE 1-1: Timing Diagram MCP608.
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TEMPERATURE CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, +2.5V +5.5V GND. Parameters Temperature Ranges Specified Temperature Range Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 5L-SOT23 Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC Thermal Resistance, 8L-TSSOP Thermal Resistance, 14L-PDIP Thermal Resistance, 14L-SOIC Thermal Resistance, 14L-TSSOP Note °C/W °C/W °C/W °C/W °C/W °C/W °C/W +125 +150 Note Units Conditions
MCP606/7/8/9 operate over this extended temperature range, with reduced performance. case, Junction Temperature (TJ) must exceed Absolute Maximum specification +150°C.
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MCP606/7/8/9
Note:
TYPICAL PERFORMANCE CURVES
graphs tables provided following this note statistical summary based limited number samples provided informational purposes only. performance characteristics listed herein tested guaranteed. some graphs tables, data presented outside specified operating range (e.g., outside specified power supply range) therefore outside warranted range.
Note: Unless otherwise indicated, +2.5V +5.5V, GND, 25°C, VDD/2, VOUT VDD/2, VDD/2
-250 -200 -150 -100 1200 Samples 5.5V Percentage Occurances Input Offset Voltage Drift Magnitude (µV/°C)
Percentage Occurances
1200 Samples 5.5V
Input Offset Voltage (µV)
FIGURE 2-1: 5.5V.
Percentage Occurances -250 -200 -150
Input Offset Voltage
FIGURE 2-4: Input Offset Voltage Drift Magnitude 5.5V.
Percentage Occurances Input Offset Voltage Drift Magnitude (µV/°C)
1200 Samples 2.5V
1200 Samples 2.5V
-100
Input Offset Voltage (µV)
FIGURE 2-2: 2.5V.
Input Offset Voltage
FIGURE 2-5: Input Offset Voltage Drift Magnitude 2.5V.
Quiescent Current Amplifier (µA) 2.5V 5.5V
Quiescent Current Amplifier (µA)
+85°C +25°C -40°C
Power Supply Voltage
Ambient Temperature (°C)
FIGURE 2-3: Quiescent Current Power Supply Voltage.
FIGURE 2-6: Quiescent Current Ambient Temperature.
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Note: Unless otherwise indicated, +2.5V +5.5V, GND, 25°C, VDD/2, VOUT VDD/2, VDD/2
Input Offset Voltage (µV)
Representative Part
=2.5V 5.5V Input Offset Voltage (µV)
+85°C +25°C -40°C
5.5V
Ambient Temperature (°C)
-0.5
Common Mode Input Voltage
FIGURE 2-7: Input Offset Voltage Ambient Temperature.
Open-Loop Gain (dB) Open-Loop Phase 0.01
100k Frequency (Hz)
FIGURE 2-10: Input Offset Voltage Common Mode Input Voltage.
Gain Bandwidth Product (kHz) Ambient Temperature (°C) 5.0V GBWP Phase Margin
Gain Phase -135 -180 -225
FIGURE 2-8: Frequency.
Channel-to-Channel Separation (dB)
Open-Loop Gain Phase
FIGURE 2-11: Gain Bandwidth Product, Phase Margin Ambient Temperature.
1000
Input Noise Voltage Density (nV/
Referred Input 1.E+02 1.E+03 1.E+04 Frequency (Hz)
100k 1.E+05
100k 1.E- 1.E+0 1.E+0 1.E+0 1.E+0 1.E+0 1.E+0 Frequency (Hz)
FIGURE 2-9: Channel-to-Channel Separation (MCP607 MCP609 only).
FIGURE 2-12: Frequency.
Input Noise Voltage Density
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Phase Margin
MCP606/7/8/9
Note: Unless otherwise indicated, +2.5V +5.5V, GND, 25°C, VDD/2, VOUT VDD/2, VDD/2
Input Bias Offset Currents (pA) Input Bias Offset Currents (pA) Common Mode Input Voltage
5.5V
+85°C 5.5V
Ambient Temperature (°C)
FIGURE 2-13: Input Bias Current, Input Offset Current Ambient Temperature.
Open-Loop Gain (dB) 1.E+02 2.5V 5.5V
FIGURE 2-16: Input Bias Current, Input Offset Current Common Mode Input Voltage.
Open-Loop Gain (dB)
1.E+03 1.E+04 Load Resistance
100k 1.E+05
Power Supply Voltage
FIGURE 2-14: Load Resistance.
CMRR PSRR (dB)
Open-Loop Gain
FIGURE 2-17: Open-Loop Gain Power Supply Voltage.
CMRR PSRR (dB) PSRR CMRR
PSRRPSRR+
CMRR 1.E-01
1.E+00
1.E+01 1.E+02 Frequency (Hz)
1.E+03
1.E+04
Ambient Temperature (°C)
FIGURE 2-15: Frequency.
CMRR, PSRR
FIGURE 2-18: Temperature.
CMRR, PSRR Ambient
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Note: Unless otherwise indicated, +2.5V +5.5V, GND, 25°C, VDD/2, VOUT VDD/2, VDD/2
1000 Ambient Temperature (°C) VOH, 2.5V VSS, 2.5V VOH, 5.5V VSS, 5.5V
Output Voltage Headroom; (mV)
VOH, 2.5V VSS, 2.5V
VOH, 5.5V VSS, 5.5V
Output Current (mA)
FIGURE 2-19: Output Voltage Headroom Output Current Magnitude.
FIGURE 2-22: Output Voltage Headroom Ambient Temperature
Input Output Voltages
Output Voltage Headroom; (mV)
Maximum Output Voltage Swing
5.5V 2.5V
5.0V
VOUT
1.E+02
1.E+03 1.E+04 Frequency (Hz)
100k 1.E+05
Time (100 µs/div)
FIGURE 2-20: Maximum Output Voltage Swing Frequency.
0.12 0.10 Slew Rate (V/µs) 0.08 0.06 0.04 0.02 0.00 Ambient Temperature (°C) High High
FIGURE 2-23: MCP606/7/8/9 Show Phase Reversal.
Ambient Temperature (°C) +ISC 2.5V -ISC 2.5V +ISC 5.5V -ISC 5.5V
FIGURE 2-21: Temperature.
Slew Rate Ambient
FIGURE 2-24: Output Short Circuit Current Magnitude Ambient Temperature.
Output Short Circuit Current Magnitude (mA)
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MCP606/7/8/9
Note: Unless otherwise indicated, +2.5V +5.5V, GND, 25°C, VDD/2, VOUT VDD/2, VDD/2
Output Voltge Time µs/div) Output Voltage Time µs/div)
5.0V
5.0V
FIGURE 2-25: Pulse Response.
5.0V
Large-signal, Non-inverting
FIGURE 2-28: Pulse Response.
Large-signal, Inverting
Output Voltage mV/div)
Output Voltage mV/div)
Time µs/div)
Time µs/div)
FIGURE 2-26: Pulse Response.
Internal Switch Output -0.5 Hysteresis
Small-signal, Non-inverting
FIGURE 2-29: Response.
Output Voltage
Output Hi-Z
Small-signal, Inverting Pulse
5.0V Amplifier Output Active
Output Enabled
Output Hi-Z
Input High
Input High
VOUT
Amplifier Output Hi-Z Input Voltage
Time µs/div)
FIGURE 2-27: (MCP608 only).
Chip Select (CS) Hysteresis
FIGURE 2-30: Amplifier Output Response Times Chip Select (CS) Pulse (MCP608 only).
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Chip Select Voltage
MCP606/7/8/9
DESCRIPTIONS
FUNCTION TABLE.
MCP606 (SOT-23-5) MCP607 MCP608 MCP609 Symbol VOUT, VOUTA VIN-, VINA- VIN+, VINA+ VINB+ VINB- VOUTB VOUTC VINC- VINC+ VIND+ VIND- VOUTD Description Output Inverting Input Non-inverting Input Positive Power Supply Non-inverting Input Inverting Input Output Output Inverting Input Non-inverting Input Negative Power Supply Non-inverting Input Inverting Input Output Chip Select Internal Connection Descriptions pins listed Table 3-1.
TABLE 3-1:
MCP606 (PDIP, SOIC, TSSOP)
Analog Outputs
Digital Input
output pins low-impedance voltage sources.
Analog Inputs
Chip Select (CS) Schmitt-triggered, CMOS logic input. used place MCP608 Low-power mode, with output(s) Hi-Z state.
non-inverting inverting inputs highimpedance CMOS inputs with bias currents.
Power Supply (VSS VDD)
positive power supply (VDD) 2.5V 5.5V higher than negative power supply (VSS). normal operation, output pins voltages between VDD; while input pins voltages between 0.3V 0.3V. Typically, these parts used single-supply (positive) configuration. this case, connected ground connected supply. will need local bypass capacitor (typically 0.01 within pin. These parts share bulk capacitor with nearby analog parts (typically larger) within pin.
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MCP606/7/8/9
APPLICATIONS INFORMATION
MCP606/7/8/9 family amps manufactured using Microchip's state-of-the-art CMOS process These amps unity-gain stable suitable wide range general purpose applications. linear region. verify linear operation this range, large-signal Open-Loop Gain (AOL) measured points inside supply rails. measurement must meet specified conditions specification table.
Inputs
Capacitive Loads
MCP606/7/8/9 amps designed prevent phase reversal when input pins exceed supply voltages. Figure 2-23 shows input voltage exceeding supply voltage without phase reversal. inputs MCP606/7/8/9 amps connect differential PMOS input stage. Common Mode Input Voltage Range (VCMR) includes ground singlesupply systems (VSS), does include VDD. This means that amplifier input behaves linearly long Common Mode Input Voltage (VCM) kept within specified VCMR limits (VSS 0.3V 1.1V +25°C). Input voltages that exceed Absolute Maximum Voltage Range (VSS 0.3V 0.3V) cause excessive current flow into input pins. Current beyond cause reliability problems. Applications that exceed this rating must externally limited with resistor, shown Figure 4-1.
Driving large capacitive loads cause stability problems voltage-feedback amps. load capacitance increases, feedback loop's phase margin decreases closed-loop bandwidth reduced. This produces gain-peaking frequency response, with overshoot ringing step response. unity-gain buffer most sensitive capacitive loads, though gains show same general behavior. When driving large capacitive loads with these amps (e.g., when +1), small series resistor output (RISO Figure 4-2) improves feedback loop's phase margin (stability) making output load resistive higher frequencies. bandwidth will generally lower than bandwidth with capacitive load.
RISO MCP60X VOUT
MCP60X
VOUT
FIGURE 4-2: Output Resistor, RISO stabilizes large capacitive loads.
Figure gives recommended RISO values different capacitive loads gains. x-axis normalized load capacitance (CL/GN), where circuit's noise gain. non-inverting gains, Signal Gain equal. inverting gains, 1+|Signal Gain| (e.g., gives V/V).
10000
Maximum expected Minimum expected
FIGURE 4-1: Resistor (RIN).
Input Current-Limiting
Recommended RISO
Rail-to-Rail Output
There specifications that describe outputswing capability MCP606/7/8/9 family amps. first specification (Maximum Output Voltage Swing) defines absolute maximum swing that achieved under specified load conditions. instance, output voltage swings within negative rail with load VDD/2. Figure 2-23 shows output voltage limited when input goes beyond linear region operation. second specification that describes outputswing capability these amplifiers (Linear Output Voltage Range) defines maximum output swing that achieved while amplifier still operates
1000
1000 10000
100p Normalized Load Capacitance; CL/GN
FIGURE 4-3: Recommended RISO Values Capacitive Loads.
2005 Microchip Technology Inc.
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After selecting RISO your circuit, double-check resulting frequency response peaking step response overshoot. Modify RISO's value until response reasonable. Bench evaluation simulations with MCP606/7/8/9 SPICE macro model helpful. Non-inverting Gain Unity-gain Buffer: Connect non-inverting (VIN+) input with wire that does touch surface. Connect guard ring inverting input (VIN-). This biases guard ring common mode input voltage. Inverting Gain Transimpedance Gain (convert current voltage, such photo detectors) amplifiers: Connect guard ring non-inverting input (VIN+). This biases guard ring same reference voltage (e.g., VDD/2 ground). Connect inverting (VIN-) input with wire that does touch surface.
MCP608 Chip Select (CS)
MCP608 single with Chip Select (CS). When pulled high, supply current drops (typ.) flows through VSS. When this happens, amplifier output into highimpedance state. pulling low, amplifier enabled. left floating, amplifier operate properly. Figure shows output voltage supply current response pulse.
Supply Bypass
4.7.1
With this family operational amplifiers, power supply (VDD single-supply) should have local bypass capacitor (i.e., 0.01 within good high-frequency performance. also needs bulk capacitor (i.e., larger) within provide large, slow currents. This bulk capacitor shared with other nearby analog parts.
Application Circuits
LOW-SIDE BATTERY CURRENT SENSOR
Surface Leakage
applications where input bias current critical, Printed Circuit Board (PCB) surface-leakage effects need considered. Surface leakage caused humidity, dust other contamination board. Under humidity conditions, typical resistance between nearby traces 1012. difference would cause current flow, which greater than MCP606/7/8/9 family's bias current 25°C typ.). easiest reduce surface leakage guard ring around sensitive pins traces). guard ring biased same voltage sensitive pin. example this type layout shown Figure 4-4.
MCP606/7/8/9 amps used sense load current low-side battery using circuit Figure 4-5. this circuit, current from power supply (minus current required power MCP606) flows through sense resistor (RSEN), which converts voltage. This gained amplifier resistors, Since non-inverting input amplifier load's negative supply (VLM), gain from RSEN VOUT RF/RG 2.5V 5.5V RSEN MCP606 Load (VLP) VOUT Load (VLM)
VIN-
VIN+
FIGURE 4-5: Sensor.
Side Battery Current
Guard Ring
FIGURE 4-4: Inverting Gain.
Example Guard Ring Layout
Since input bias current input offset voltage MCP606 low, input capable swinging below ground, there very little error generated amplifier. quiescent current very low, which helps conserve battery power. rail-to-rail output makes possible read very currents.
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MCP606/7/8/9
4.7.2 PHOTODIODE AMPLIFIERS
Sensors that produce output current have high output impedance connected transimpedance amplifier. transimpedance amplifier converts current into voltage. Photodiodes sensor that produce output current. characteristics that needed these circuits are: input offset voltage, input bias current, high input impedance input common mode range that includes ground. input offset voltage input bias current support very voltage drop across photodiode; this gives best photodiode linearity. Since photodiode biased ground, amp's input needs function well both above below ground. operate much higher speed. This reverse bias also increases dark current current noise, however. Resistor converts current into voltage. Capacitor limits bandwidth helps stabilize circuit when D1's junction capacitance large. Light VOUT MCP606
4.7.2.1
Photo-Voltaic Mode
Figure shows transimpedance amplifier with photodiode (D1) biased Photo-voltaic mode across D1), which used precision photodiode sensing. light impinges charge generated, causing current flow reverse bias direction amp's negative feedback forces voltage across nearly Resistor converts current into voltage. Capacitor limits bandwidth helps stabilize circuit when D1's junction capacitance large. Light VOUT MCP606 VREF
FIGURE 4-7: Photodiode Photoconductive mode) Transimpedance Amplifier. 4.7.3 INSTRUMENTATION AMPLIFIER
instrumentation amplifier shown Figure serves function taking difference input voltages, level-shifting gaining output. This configuration best suited higher gains (i.e., gain V/V). reference voltage (VREF) typically mid-supply (VDD/2) single-supply environment.
VOUT
VOUT
FIGURE 4-6: Photodiode Photo-voltaic mode) Transimpedance Amplifier. 4.7.2.2 Photo-Conductive Mode
MCP607
MCP607
Figure shows transimpedance amplifier with photodiode (D1) biased Photo-conductive mode reverse biased), which used high-speed applications. light impinges charge generated, causing current flow reverse bias direction Placing negative bias significantly reduces junction capacitance, which allows circuit
FIGURE 4-8: Amplifier.
Instrumentation
specifications that make MCP606/7/8/9 family appropriate this application circuit input bias current, offset voltage high commonmode rejection.
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MCP606/7/8/9
4.7.4 THREE INSTRUMENTATION AMPLIFIER 4.7.5 PRECISION GAIN WITH GOOD LOAD ISOLATION
classic, three instrumentation amplifier illustrated Figure 4-9. input amps provide differential signal gain common mode gain output difference amplifier, which converts input signal from differential single ended output; rejects common mode signals input. gain this circuit simply adjusted with resistor (RG). reference voltage (VREF) typically referenced mid-supply (VDD/2) single-supply applications.
Figure 4-10, MCP606 amps, provide high gain input signal (VIN). MCP606's offset voltage makes this accurate circuit. MCP601 configured unity-gain buffer. isolates MCP606's output from load, increasing high-gain stage's precision. Since MCP601 higher output current, with amplifiers being housed separate packages, there minimal change MCP606's offset voltage loading effect.
MCP607 MCP606 VREF VOUT
MCP606 MCP601 VOUT
FIGURE 4-10: Load Isolation.
Precision Gain with Good
MCP607
FIGURE 4-9: Three Instrumentation Amplifier.
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MCP606/7/8/9
DESIGN TOOLS
Microchip provides basic design tools needed MCP606/7/8/9 family amps.
SPICE Macro Model
latest SPICE macro model MCP606/7/8/9 amps available site www.microchip.com. This model intended initial design tool that works well amp's linear region operation room temperature. model file information capabilities. Bench testing very important part design cannot replaced with simulations. Also, simulation results using this macro model need validated comparing them data sheet specifications characteristic curves.
FilterLab® Software
FilterLab software innovative tool that simplifies analog active-filter (using amps) design. available free charge from site www.microchip.com. FilterLab software tool provides full schematic diagrams filter circuit with component values. also outputs filter circuit SPICE format, which used with macro model simulate actual filter performance.
2005 Microchip Technology Inc.
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MCP606/7/8/9
PACKAGING INFORMATION
Package Marking Information
5-Lead SOT-23-5 Example:
XXNN
SB25
8-Lead PDIP (300 mil)
XXXXXXXX XXXXXNNN YYWW
Example:
MCP606 I/P^^256 0545
8-Lead SOIC (150 mil) XXXXXXXX XXXXYYWW
Example: MCP606 SN^^0545
8-Lead TSSOP XXXX YYWW
Example: I545
Legend: XX.X
Customer-specific information Year code (last digit calendar year) Year code (last digits calendar year) Week code (week January week `01') Alphanumeric traceability code Pb-free JEDEC designator Matte (Sn) This package Pb-free. Pb-free JEDEC designator found outer packaging this package.
Note:
event full Microchip part number cannot marked line, will carried over next line, thus limiting number available characters customer-specific information.
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MCP606/7/8/9
Package Marking Information (Continued)
14-Lead PDIP (300 mil) (MCP609) XXXXXXXXXXXXXX XXXXXXXXXXXNNN YYWW Example: MCP609 I/P^^256 0545
14-Lead SOIC (150 mil) (MCP609) XXXXXXXXXX XXXXXXXXXX YYWWNNN
Example: MCP609 I/SL^^ 0545256
14-Lead TSSOP (MCP609) XXXXXXXX YYWW
Example: 609IST 0545
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5-Lead Plastic Small Outline Transistor (OT) (SOT23)
Units Dimension Limits Number Pins Pitch Outside lead pitch (basic) Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic
INCHES* .038 .075 .046 .043 .003 .110 .064 .116 .018 .006 .017
.035 .035 .000 .102 .059 .110 .014 .004 .014
.057 .051 .006 .118 .069 .122 .022 .008 .020
MILLIMETERS 0.95 1.90 0.90 1.18 0.90 1.10 0.00 0.08 2.60 2.80 1.50 1.63 2.80 2.95 0.35 0.45 0.09 0.15 0.35 0.43
1.45 1.30 0.15 3.00 1.75 3.10 0.55 0.20 0.50
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MO-178 Drawing C04-091
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MCP606/7/8/9
8-Lead Plastic Dual In-line (PDIP)
Number Pins Pitch Seating Plane Molded Package Thickness Base Seating Plane Shoulder Shoulder Width Molded Package Width Overall Length Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Spacing Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic
Units Dimension Limits
INCHES* .100 .155 .130 .313 .250 .373 .130 .012 .058 .018 .370
.140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310
.170 .145 .325 .260 .385 .135 .015 .070 .022 .430
MILLIMETERS 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40
4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MS-001 Drawing C04-018
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8-Lead Plastic Small Outline (SN) Narrow, (SOIC)
Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic
Units Dimension Limits
.053 .052 .004 .228 .146 .189 .010 .019 .008 .013
INCHES* .050 .061 .056 .007 .237 .154 .193 .015 .025 .009 .017
.069 .061 .010 .244 .157 .197 .020 .030 .010 .020
MILLIMETERS 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0.20 0.23 0.33 0.42
1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 0.25 0.51
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MS-012 Drawing C04-057
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MCP606/7/8/9
8-Lead Plastic Thin Shrink Small Outline (ST) (TSSOP)
Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic
Units Dimension Limits
INCHES .026
.033 .002 .246 .169 .114 .020 .004 .007
.035 .004 .251 .173 .118 .024 .006 .010
.043 .037 .006 .256 .177 .122 .028 .008 .012
MILLIMETERS* 0.65 1.10 0.85 0.90 0.95 0.05 0.10 0.15 6.25 6.38 6.50 4.30 4.40 4.50 2.90 3.00 3.10 0.50 0.60 0.70 0.09 0.15 0.20 0.19 0.25 0.30
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .005" (0.127mm) side. JEDEC Equivalent: MO-153 Drawing C04-086
2005 Microchip Technology Inc.
DS11177D-page
MCP606/7/8/9
14-Lead Plastic Dual In-line (PDIP)
Number Pins Pitch Seating Plane .140 .170 Molded Package Thickness .115 .145 Base Seating Plane .015 Shoulder Shoulder Width .300 .313 .325 Molded Package Width .240 .250 .260 Overall Length .740 .750 .760 Seating Plane .125 .130 .135 Lead Thickness .008 .012 .015 Upper Lead Width .045 .058 .070 Lower Lead Width .014 .018 .022 Overall Spacing .310 .370 .430 Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MS-001 Drawing C04-005
Units Dimension Limits
INCHES* .100 .155 .130
MILLIMETERS 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 18.80 19.05 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40
4.32 3.68 8.26 6.60 19.30 3.43 0.38 1.78 0.56 10.92
DS11177D-page
2005 Microchip Technology Inc.
MCP606/7/8/9
14-Lead Plastic Small Outline (SL) Narrow, (SOIC)
Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic
Units Dimension Limits
.053 .052 .004 .228 .150 .337 .010 .016 .008 .014
INCHES* .050 .061 .056 .007 .236 .154 .342 .015 .033 .009 .017
.069 .061 .010 .244 .157 .347 .020 .050 .010 .020
MILLIMETERS 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 5.99 3.81 3.90 8.56 8.69 0.25 0.38 0.41 0.84 0.20 0.23 0.36 0.42
1.75 1.55 0.25 6.20 3.99 8.81 0.51 1.27 0.25 0.51
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MS-012 Drawing C04-065
2005 Microchip Technology Inc.
DS11177D-page
MCP606/7/8/9
14-Lead Plastic Thin Shrink Small Outline (ST) (TSSOP)
Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic
Units Dimension Limits
INCHES .026 .035 .004 .251 .173 .197 .024 .006 .010
.033 .002 .246 .169 .193 .020 .004 .007
.043 .037 .006 .256 .177 .201 .028 .008 .012
MILLIMETERS* 0.65 1.10 0.85 0.90 0.95 0.05 0.10 0.15 6.25 6.38 6.50 4.30 4.40 4.50 4.90 5.00 5.10 0.50 0.60 0.70 0.09 0.15 0.20 0.19 0.25 0.30
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .005" (0.127mm) side. JEDEC Equivalent: MO-153 Drawing C04-087
DS11177D-page
2005 Microchip Technology Inc.
MCP606/7/8/9
APPENDIX REVISION HISTORY
Revision (February 2005)
following list modifications: Added Section "Pin Descriptions". Updated Section "Applications Information". Added Section "Capacitive Loads" Updated Section "Design Tools" include FilterLab® point latest SPICE macro model. Corrected updated Section "Packaging Information". Added Section Appendix "Revision History".
Revision (January 2001) Revision (May 2000) Revision (January 2000)
Original Release this Document.
2005 Microchip Technology Inc.
DS11177D-page
MCP606/7/8/9
NOTES:
DS11177D-page
2005 Microchip Technology Inc.
MCP606/7/8/9
PRODUCT IDENTIFICATION SYSTEM
order obtain information, e.g., pricing delivery, refer factory listed sales office. PART Device Temperature Range Package Examples:
Device MCP606 Single MCP606T Single Tape Reel (SOIC, TSSOP) MCP607 Dual MCP607T Dual Tape Reel (SOIC, TSSOP) MCP608 Single with MCP608T Single with Tape Reel (SOIC, TSSOP) MCP609 Quad MCP609T Quad Tape Reel (SOIC, TSSOP) Industrial Temperature, PDIP package. MCP606-I/SN: Industrial Temperature, SOIC package. MCP606T-I/SN: Tape Reel, Industrial Temperature, SOIC package. MCP606-I/ST: Industrial Temperature, TSSOP package. MCP606-I/OT: Industrial Temperature, SOT-23 package. MCP606T-I/OT: Tape Reel, Industrial Temperature, SOT-23 package. MCP607-I/P: MCP607T-I/P: MCP608-I/SN: Industrial Temperature, PDIP package. Industrial Temperature, PDIP package. MCP606-I/P:
Temperature Range
-40°C +85°C Industrial Temperature, SOIC package. MCP608T-I/SN: Tape Reel, Industrial Temperature, SOIC package. MCP609-I/P: MCP609T-I/P: Industrial Temperature, 14LD PDIP package. Industrial Temperature, 14LD PDIP package.
Package
Plastic SOT-23, 5-lead Plastic (300 Body), 8-lead 14-lead Plastic SOIC (150 Body), 8-lead Plastic SOIC (150 Body), 14-lead Plastic TSSOP, 8-lead 14-lead
2005 Microchip Technology Inc.
DS11177D-page
MCP606/7/8/9
NOTES:
DS11177D-page
2005 Microchip Technology Inc.
Note following details code protection feature Microchip devices: Microchip products meet specification contained their particular Microchip Data Sheet. Microchip believes that family products most secure families kind market today, when used intended manner under normal conditions. There dishonest possibly illegal methods used breach code protection feature. these methods, knowledge, require using Microchip products manner outside operating specifications contained Microchip's Data Sheets. Most likely, person doing engaged theft intellectual property. Microchip willing work with customer concerned about integrity their code. Neither Microchip other semiconductor manufacturer guarantee security their code. Code protection does mean that guaranteeing product "unbreakable."
Code protection constantly evolving. Microchip committed continuously improving code protection features products. Attempts break Microchip's code protection feature violation Digital Millennium Copyright Act. such acts allow unauthorized access your software other copyrighted work, have right relief under that Act.
Information contained this publication regarding device applications like provided only your convenience superseded updates. your responsibility ensure that your application meets with your specifications. MICROCHIP MAKES REPRESENTATIONS WARRANTIES KIND WHETHER EXPRESS IMPLIED, WRITTEN ORAL, STATUTORY OTHERWISE, RELATED INFORMATION, INCLUDING LIMITED CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY FITNESS PURPOSE. Microchip disclaims liability arising from this information use. Microchip's products critical components life support systems authorized except with express written approval Microchip. licenses conveyed, implicitly otherwise, under Microchip intellectual property rights.
Trademarks Microchip name logo, Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, MATE, PowerSmart, rfPIC, SmartShunt registered trademarks Microchip Technology Incorporated U.S.A. other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor Embedded Control Solutions Company registered trademarks Microchip Technology Incorporated U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance WiperLock trademarks Microchip Technology Incorporated U.S.A. other countries. SQTP service mark Microchip Technology Incorporated U.S.A. other trademarks mentioned herein property their respective companies. 2005, Microchip Technology Incorporated, Printed U.S.A., Rights Reserved. Printed recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification worldwide headquarters, design wafer fabrication facilities Chandler Tempe, Arizona Mountain View, California October 2003. Company's quality system processes procedures PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory analog products. addition, Microchip's quality system design manufacture development systems 9001:2000 certified.
2005 Microchip Technology Inc.
DS11177D-page
WORLDWIDE SALES SERVICE
AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Address: www.microchip.com Atlanta Alpharetta, Tel: 770-640-0034 Fax: 770-640-0307 Boston Westford, Tel: 978-692-3848 Fax: 978-692-3821 Chicago Itasca, Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, Tel: 765-864-8360 Fax: 765-864-8387 Angeles Mission Viejo, Tel: 949-462-9523 Fax: 949-462-9608 Jose Mountain View, Tel: 650-215-1444 Fax: 650-961-0286 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
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ASIA/PACIFIC
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EUROPE
Austria Weis Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark Ballerup Tel: 45-4450-2828 Fax: 45-4485-2829 France Massy Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany Ismaning Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands Drunen Tel: 31-416-690399 Fax: 31-416-690340 England Berkshire Tel: 44-118-921-5869 Fax: 44-118-921-5820
10/20/04
DS11177D-page
2005 Microchip Technology Inc.
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