MHz, Low-Power Available SC-70-5 SOT-23-5 packages Gain Bandwidth
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MCP6001/2/4
MHz, Low-Power
Available SC-70-5 SOT-23-5 packages Gain Bandwidth Product: (typ.) Rail-to-Rail Input/Output Supply Voltage: 1.8V 5.5V Supply Current: (typ.) Phase Margin: (typ.) Temperature Range: Industrial: -40°C +85°C Extended: -40°C +125°C Available Single, Dual Quad Packages
Description
Microchip Technology Inc. MCP6001/2/4 family operational amplifiers amps) specifically designed general-purpose applications. This family Gain Bandwidth Product (GBWP) phase margin (typ.). also maintains phase margin (typ.) with capacitive load. This family operates from single supply voltage 1.8V, while drawing (typ.) quiescent current. Additionally, MCP6001/2/4 supports rail-to-rail input output swing, with common mode input voltage range This family amps designed with Microchip's advanced CMOS process. MCP6001/2/4 family available industrial extended temperature ranges, with power supply range 1.8V 5.5V.
Applications
Automotive Portable Equipment Photodiode Amplifier Analog Filters Notebooks PDAs Battery-Powered Systems
Package Types
MCP6001 SC-70-5, SOT-23-5
VOUT VIN+
MCP6002 PDIP, SOIC, MSOP
VOUTA VINA- VIN- VINA+ VOUTB
Available Tools
SPICE Macro Models www.microchip.com) FilterLab® Software www.microchip.com)
VINB- VINB+
Typical Application
MCP6001 Gain MCP6001U SOT-23-5
VIN+ VIN-
MCP6001R SOT-23-5
VOUT
MCP6004 PDIP, SOIC, TSSOP
VOUTA VOUTD VIND- VIND+ VINC+ VINC- VOUTC VINA- VINA+ VINB+ VINB-
VOUT
VIN+
VIN-
VREF
VOUTB
Non-Inverting Amplifier
VOUT
2005 Microchip Technology Inc.
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MCP6001/2/4
ELECTRICAL CHARACTERISTICS
Notice: Stresses above those listed under "Maximum Ratings" cause permanent damage device. This stress rating only functional operation device those other conditions above those indicated operational listings this specification implied. Exposure maximum rating conditions extended periods affect device reliability.
Absolute Maximum Ratings
.7.0V Inputs Outputs 0.3V 0.3V Difference Input Voltage |VDD VSS| Output Short-Circuit Current .continuous Current Input Pins Current Output Supply Pins .±30 Storage Temperature.-65°C +150°C Maximum Junction Temperature (TJ) +150°C Protection Pins (HBM;MM) 200V
ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, +25°C, +1.8V +5.5V, GND, VDD/2, VDD/2 VOUT VDD/2. Parameters Input Offset Input Offset Voltage Input Offset Drift with Temperature Power Supply Rejection Ratio Input Bias Current Impedance Input Bias Current: Industrial Temperature Extended Temperature Input Offset Current Common Mode Input Impedance Differential Input Impedance Common Mode Common Mode Input Range Common Mode Rejection Ratio Open-Loop Gain Open-Loop Gain (Large Signal) Output Maximum Output Voltage Swing Output Short-Circuit Current Power Supply Supply Voltage Quiescent Current Amplifier Note 5.5V, VOL, 5.5V 1.8V 5.5V VOUT 0.3V 0.3V, VCMR CMRR -0.3V 5.3V, ZDIFF ±1.0 1100 ±1.0 1013||6 1013||3 ||pF ||pF +85°C +125°C VOS/TA PSRR -4.5 ±2.0 +4.5 (Note µV/°C -40°C +125°C, Units Conditions
MCP6001/2/4 parts with date codes prior December 2004 (week code were tested minimum/ maximum limits.
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MCP6001/2/4
ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, +25°C, +1.8 5.5V, GND, VDD/2, VOUT VDD/2, VDD/2 Parameters Response Gain Bandwidth Product Phase Margin Slew Rate Noise Input Noise Voltage Input Noise Voltage Density Input Noise Current Density µVp-p nV/Hz fA/Hz GBWP V/µs Units Conditions
TEMPERATURE SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, +1.8V +5.5V GND. Parameters Temperature Ranges Industrial Temperature Range Extended Temperature Range Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 5L-SC70 Thermal Resistance, 5L-SOT-23 Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC (150 mil) Thermal Resistance, 8L-MSOP Thermal Resistance, 14L-PDIP Thermal Resistance, 14L-SOIC Thermal Resistance, 14L-TSSOP Note: °C/W °C/W °C/W °C/W °C/W °C/W °C/W °C/W +125 +125 +150 Note Units Conditions
industrial temperature devices operate over this extended temperature range, with reduced performance. case, internal Junction Temperature (TJ) must exceed Absolute Maximum specification +150°C.
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MCP6001/2/4
Note:
TYPICAL PERFORMANCE CURVES
graphs tables provided following this note statistical summary based limited number samples provided informational purposes only. performance characteristics listed herein tested guaranteed. some graphs tables, data presented outside specified operating range (e.g., outside specified power supply range) therefore outside warranted range.
Note: Unless otherwise indicated, +25°C, +1.8V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2
PSRR, CMRR (dB) 64,695 Samples Input Offset Voltage (mV) Ambient Temperature (°C) CMRR (VCM -0.3V +5.3V) PSRR (VCM VSS)
Percentage Occurrences
FIGURE 2-1:
Input Offset Voltage.
FIGURE 2-4: Temperature.
Open-Loop Gain (dB)
CMRR, PSRR Ambient
PSRR, CMRR (dB) 1.E+01 1.E+02 CMRR PSRR+ PSRR-
Open-Loop Phase Phase Gain -120 -150 -180
1.E+03 1.E+04 Frequency (Hz)
100k 1.E+05
-210 1.E- 100k Frequency+04 (Hz)
FIGURE 2-2: Frequency.
PSRR, CMRR
FIGURE 2-5: Frequency.
Percentage Occurrences
Open-Loop Gain, Phase
Percentage Occurrences
1230 Samples 5.5V +85°C
Samples 5.5V +125°C
1050
1200
1350
Input Bias Current (pA)
Input Bias Current (pA)
FIGURE 2-3:
Input Bias Current +85°C.
FIGURE 2-6:
Input Bias Current +125°C.
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1500
MCP6001/2/4
Note: Unless otherwise indicated, +25°C, +1.8V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2
1,000 Input Noise Voltage Density (nV/
Percentage Occurrences
1225 Samples -40°C +125°C
100k 1.E-01 1.E+0 1.E+0 1.E+0 1.E+0 1.E+0 1.E+0 Frequency (Hz)
Input Offset Voltage Drift (µV/°C)
FIGURE 2-7: Frequency.
Input Offset Voltage (µV)
Input Noise Voltage Density
FIGURE 2-10:
Input Offset Voltage Drift.
Input Offset Voltage (µV)
1.8V
-100 -200 -300 -400 -500 -600 -700
-100 -150 -200 Output Voltage 1.8V 5.5V
-40°C +25°C +85°C +125°C -0.4 -0.2
Common Mode Input Voltage
FIGURE 2-8: Input Offset Voltage Common Mode Input Voltage 1.8V.
Input Offset Voltage (µV) -100 -200 -300 -400 -500 -600 -700 -0.5 -40°C +25°C +85°C +125°C
FIGURE 2-11: Output Voltage.
Input Offset Voltage
5.5V
Short Circuit Current Magnitude (mA)
-40°C +25°C +85°C +125°C
Common Mode Input Voltage
Power Supply Voltage
FIGURE 2-9: Input Offset Voltage Common Mode Input Voltage 5.5V.
FIGURE 2-12: Output Short-Circuit Current Power Supply Voltage.
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Note: Unless otherwise indicated, +25°C, +1.8V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2
0.08
Output Voltage mV/div)
Falling Edge, 5.5V Falling Edge, 1.8V
0.06
Slew Rate (V/µs)
0.04
0.02
0.00
Rising Edge, 5.5V Rising Edge, 1.8V
-0.02
-0.04
-0.06
-0.08 0.E+00 1.E-06 2.E-06 3.E-06 4.E-06 5.E-06 6.E-06 7.E-06 8.E-06 9.E-06 1.E-05
Ambient Temperature (°C)
Time µs/div)
FIGURE 2-13: Temperature.
1,000 Output Voltage Headroom (mV)
Slew Rate Ambient
FIGURE 2-16: Pulse Response.
Small-Signal, Non-Inverting
5.0V
1.E-05
100µ 1.E-04 1.E-03 Output Current Magnitude
1.E-02
Output Voltage
0.E+00
1.E-05
2.E-05
3.E-05
4.E-05
5.E-05
6.E-05
7.E-05
8.E-05
9.E-05
1.E-04
Time µs/div)
FIGURE 2-14: Output Voltage Headroom Output Current Magnitude.
Output Voltage Swing P-P)
FIGURE 2-17: Pulse Response.
Quiescent Current amplifier (µA)
Large-Signal, Non-Inverting
0.5V
5.5V 1.8V
+125°C +85°C +25°C -40°C Power Supply Voltage
1.E+03
100k 1.E+04 1.E+05 Frequency (Hz)
1.E+06
FIGURE 2-15: Frequency.
Output Voltage Swing
FIGURE 2-18: Quiescent Current Power Supply Voltage.
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MCP6001/2/4
DESCRIPTIONS
Descriptions pins listed Table 3-1.
TABLE 3-1:
MCP6001
FUNCTION TABLE
MCP6001R MCP6001U MCP6002 MCP6004 Symbol Description VOUT, VOUTA Analog Output VIN-, VINA- Inverting Input VIN+, VINA+ Non-inverting Input VINB+ VINB- VOUTB VOUTC VINC- VINC+ VIND+ VIND- VOUTD Positive Power Supply Non-inverting Input Inverting Input Analog Output Analog Output Inverting Input Non-inverting Input Negative Power Supply Non-inverting Input Inverting Input Analog Output
Analog Outputs
Power Supply (VSS VDD)
output pins low-impedance voltage sources.
Analog Inputs
non-inverting inverting inputs highimpedance CMOS inputs with bias currents.
positive power supply (VDD) 1.8V 5.5V higher than negative power supply (VSS). normal operation, other pins voltages between VDD. Typically, these parts used single (positive) supply configuration. this case, connected ground connected supply. will need local bypass capacitor (typically 0.01 within pin. These parts share bulk capacitor with analog parts (typically within pin.
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APPLICATION INFORMATION
MCP600X VOUT MCP6001/2/4 family amps manufactured using Microchip's state-of-the-art CMOS process specifically designed low-cost, low-power general-purpose applications. supply voltage, quiescent current wide bandwidth makes MCP6001/2/4 ideal battery-powered applications. This device high phase margin, which makes stable larger capacitive load applications.
Maximum expected Minimum expected
Rail-to-Rail Input
MCP6001/2/4 amps designed prevent phase reversal when input pins exceed supply voltages. Figure shows input voltage exceeding supply voltage without phase reversal.
Input, Output Voltages VOUT
0.E+00 1.E-05 2.E-05 3.E-05 4.E-05 5.E-05 6.E-05 7.E-05 8.E-05 9.E-05 1.E-04
FIGURE 4-2: Resistor (RIN).
Input Current Limiting
5.0V
Rail-to-Rail Output
output voltage range MCP6001/2/4 amps (min.) (max.) when connected VDD/2 5.5V. Refer Figure 2-14 more information.
Capacitive Loads
Time µs/div)
FIGURE 4-1: Phase Reversal.
MCP6001/2/4 Show
input stage MCP6001/2/4 amps differential input stages parallel. operates common mode input voltage (VCM), while other operates high VCM. With this topology, device operates with above below VSS. input offset voltage measured ensure proper operation. Input voltages that exceed input voltage range (VSS 0.3V 0.3V 25°C) cause excessive current flow into input pins, while current beyond cause reliability problems. Applications that exceed this rating must externally limited with resistor, shown Figure 4-2.
Driving large capacitive loads cause stability problems voltage feedback amps. load capacitance increases, feedback loop's phase margin decreases closed-loop bandwidth reduced. This produces gain peaking frequency response, with overshoot ringing step response. While unity-gain buffer most sensitive capacitive loads, gains show same general behavior. When driving large capacitive loads with these amps (e.g., when +1), small series resistor output (RISO Figure 4-3) improves feedback loop's phase margin (stability) making output load resistive higher frequencies. bandwidth will generally lower than bandwidth with capacitance load.
MCP600X
RISO VOUT
FIGURE 4-3: Output resistor, RISO stabilizes large capacitive loads.
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MCP6001/2/4
Figure gives recommended RISO values different capacitive loads gains. x-axis normalized load capacitance (CL/GN), where circuit's noise gain. non-inverting gains, Signal Gain equal. inverting gains, 1+|Signal Gain| (e.g., gives V/V).
1000 Recommended RISO
Surface Leakage
5.0V
applications where input bias current critical, Printed Circuit Board (PCB) surface leakage effects need considered. Surface leakage caused humidity, dust other contamination board. Under humidity conditions, typical resistance between nearby traces 1012. difference would cause current flow; which greater than MCP6001/2/4 family's bias current 25°C typ.). easiest reduce surface leakage guard ring around sensitive pins traces). guard ring biased same voltage sensitive pin. example this type layout shown Figure 4-5. VINVIN+
100p 1.E-11 1.E-10 1.E-09 1.E-08 Normalized Load Capacitance; CL/GN
FIGURE 4-4: Recommended RISO values Capacitive Loads.
After selecting RISO your circuit, double-check resulting frequency response peaking step response overshoot. Modify RISO's value until response reasonable. Bench evaluation simulations with MCP6001/2/4 SPICE macro model very helpful.
Guard Ring
FIGURE 4-5: Inverting Gain.
Example Guard Ring Layout
Supply Bypass
With this family operational amplifiers, power supply (VDD single-supply) should have local bypass capacitor (i.e., 0.01 within good high-frequency performance. also needs bulk capacitor (i.e., larger) within provide large, slow currents. This bulk capacitor shared with other analog parts.
Non-inverting Gain Unity-Gain Buffer: Connect non-inverting (VIN+) input with wire that does touch surface. Connect guard ring inverting input (VIN-). This biases guard ring common mode input voltage. Inverting Gain Transimpedance Gain Amplifiers (convert current voltage, such photo detectors): Connect guard ring non-inverting input (VIN+). This biases guard ring same reference voltage (e.g., VDD/2 ground). Connect inverting (VIN-) input with wire that does touch surface.
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4.6.1
Application Circuits
UNITY-GAIN BUFFER
14.3 53.6
rail-to-rail input output capability MCP6001/2/4 ideal unity-gain buffer applications. quiescent current wide bandwidth makes device suitable buffer configuration instrumentation amplifier circuit, shown Figure 4-6.
MCP6002 VOUT
MCP6002 VIN1
FIGURE 4-7: Low- Pass Filter. 4.6.3
Active Second-Order
PEAK DETECTOR
MCP6001 MCP6002 VIN2 VREF VOUT
MCP6001/2/4 high input impedance, rail-to-rail input/output input bias current, which makes this device suitable peak detector applications. Figure shows peak detector circuit with clear sample switches. peak-detection cycle uses clock (CLK), shown Figure 4-8. rising edge CLK, Sample Switch closes begin sampling. peak voltage stored sampled sample time defined tSAMP. sample time (falling edge Sample Signal), Clear Signal goes high closes Clear Switch. When Clear Switch closes, discharges through time defined tCLEAR. clear time (falling edge Clear Signal), begins store peak value time defined tDETECT. order define tSAMP tCLEAR, necessary determine capacitor charging discharging period. capacitor charging time limited amplifier source current, while discharging time defined using R1C1). tDETECT time that input signal sampled dependent input voltage change frequency. output current limit, size storage capacitors (both C2), could create slewing limitations input voltage (VIN) increases. Current through capacitor dependent size capacitor rate voltage change. From this relationship, rate voltage change slew rate determined. example, with shortcircuit current load capacitor then:
VIN2 VIN1
FIGURE 4-6: Instrumentation Amplifier with Unity-Gain Buffer Inputs. 4.6.2 ACTIVE LOW-PASS FILTER
MCP6001/2/4 amp's input bias current makes possible designer larger resistors smaller capacitors active low-pass filter applications. However, resistance increases, noise generated also increases. Parasitic capacitances large value resistors could also modify frequency response. These trade-offs need considered when selecting circuit elements. Usually, bandwidth 100X filter cutoff frequency higher) good performance. possible have bandwidth higher than cutoff frequency, thus having design that more sensitive component tolerances. Figure shows second-order Butterworth filter with cutoff frequency gain V/V; bandwidth only higher than cutoff frequency. component values were selected using Microchip's FilterLab® software.
EQUATION 4-1:
25mA -0.1F dVC1 250mV
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MCP6001/2/4
This voltage rate change less than MCP6001/2/4 slew rate V/µs. When input voltage swings below voltage across becomes reversebiased. This opens feedback loop rails amplifier. When input voltage increases, amplifier recovers slew rate. Based rate voltage change shown above equation, takes extended period time charge capacitor. capacitors need selected that circuit limited amplifier slew rate. Therefore, capacitors should less than stabilizing resistor (RISO) needs properly selected. (Refer Section "Capacitive Loads").
MCP6002 RISO MCP6002 RISO MCP6001 Sample Switch Clear Switch
tSAMP
VOUT
Sample Signal
tCLEAR
Clear Signal
tDETECT
FIGURE 4-8:
Peak Detector with Clear Sample CMOS Analog Switches.
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MCP6001/2/4
DESIGN TOOLS
Microchip provides basic design tools needed MCP6001/2/4 family amps.
SPICE Macro Model
latest SPICE macro model MCP6001/2/4 amps available site www.microchip.com. This model intended initial design tool that works well amp's linear region operation room temperature. model file information capabilities. Bench testing very important part design cannot replaced with simulations. Also, simulation results using this macro model need validated comparing them data sheet specifications characteristic curves.
FilterLab® Software
Microchip's FilterLab® software innovative software tool that simplifies analog active filter (using amps) design. Available cost from site www.microchip.com, FilterLab design tool provides full schematic diagrams filter circuit with component values. also outputs filter circuit SPICE format, which used with macro model simulate actual filter performance.
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MCP6001/2/4
PACKAGING INFORMATION
Package Marking Information
5-Lead SC-70 (MCP6001)
Example: (I-Temp)
(Front) (Back)
Device MCP6001
I-Temp Code
E-Temp Code
(Front) (Back)
Note: Applies 5-Lead SC-70.
XXNN
Device MCP6001
I-Temp Code AANN
E-Temp Code CDNN
AA74
Note: Applies 5-Lead SC-70.
5-Lead SOT-23 (MCP6001/1R/1U)
Example: (E-Temp)
I-Temp Code AANN ADNN AFNN E-Temp Code CDNN CENN CFNN
Device MCP6001 MCP6001R MCP6001U
XXNN
CD25
Note: Applies 5-Lead SOT-23.
8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW
Example: MCP6002 I/P256 0432
Legend:
XX.X
Customer specific information* Year code (last digits calendar year) Week code (week January week `01') Alphanumeric traceability code
Note:
event full Microchip part number cannot marked line, will carried over next line thus limiting number available characters customer specific information.
Standard marking consists Microchip part number, year code, week code, traceability code (facility code, mask rev#, assembly code). marking beyond this, certain price adders apply. Please check with your Microchip Sales Office.
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MCP6001/2/4
Package Marking Information (Continued)
8-Lead SOIC (150 mil) XXXXXXXX XXXXYYWW Example: MCP6002 I/SN0432
8-Lead MSOP XXXXXX YWWNNN
Example: 6002I 432256
14-Lead PDIP (300 mil) (MCP6004)
Example:
XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN
MCP6004-I/P 0432256
14-Lead SOIC (150 mil) (MCP6004)
Example:
XXXXXXXXXX XXXXXXXXXX YYWWNNN
MCP6004ISL 0432256
14-Lead TSSOP (MCP6004)
Example:
XXXXXX YYWW
6004ST 0432
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2005 Microchip Technology Inc.
MCP6001/2/4
5-Lead Plastic Package (SC-70)
Units Dimension Limits INCHES .026 (BSC) MILLIMETERS* 0.65 (BSC) 0.80 0.80 0.00 1.80 1.15 1.80 0.10 0.10 0.10 0.15
Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Molded Lead Shoulder Lead Thickness Lead Width
.031 .031 .000 .071 .045 .071 .004 .004 .004 .006
.043 .039 .004 .094 .053 .087 .012 .016 .007 .012
1.10 1.00 0.10 2.40 1.35 2.20 0.30 0.40 0.18 0.30
*Controlling Parameter Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .005" (0.127mm) side. JEITA (EIAJ) Standard: SC-70
Drawing C04-061
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MCP6001/2/4
5-Lead Plastic Small Outline Transistor (OT) (SOT23)
Units Dimension Limits Number Pins Pitch Outside lead pitch (basic) Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic
INCHES* .038 .075 .046 .043 .003 .110 .064 .116 .018 .006 .017
.035 .035 .000 .102 .059 .110 .014 .004 .014
.057 .051 .006 .118 .069 .122 .022 .008 .020
MILLIMETERS 0.95 1.90 0.90 1.18 0.90 1.10 0.00 0.08 2.60 2.80 1.50 1.63 2.80 2.95 0.35 0.45 0.09 0.15 0.35 0.43
1.45 1.30 0.15 3.00 1.75 3.10 0.55 0.20 0.50
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MO-178 Drawing C04-091
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MCP6001/2/4
8-Lead Plastic Dual In-line (PDIP)
Number Pins Pitch Seating Plane Molded Package Thickness Base Seating Plane Shoulder Shoulder Width Molded Package Width Overall Length Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Spacing Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic
Units Dimension Limits
INCHES* .100 .155 .130 .313 .250 .373 .130 .012 .058 .018 .370
.140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310
.170 .145 .325 .260 .385 .135 .015 .070 .022 .430
MILLIMETERS 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40
4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MS-001 Drawing C04-018
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MCP6001/2/4
8-Lead Plastic Small Outline (SN) Narrow, (SOIC)
Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic
Units Dimension Limits
.053 .052 .004 .228 .146 .189 .010 .019 .008 .013
INCHES* .050 .061 .056 .007 .237 .154 .193 .015 .025 .009 .017
.069 .061 .010 .244 .157 .197 .020 .030 .010 .020
MILLIMETERS 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0.20 0.23 0.33 0.42
1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 0.25 0.51
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MS-012 Drawing C04-057
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MCP6001/2/4
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
Number Pins Pitch .043 Overall Height .030 .037 Molded Package Thickness .000 .006 Standoff Overall Width Molded Package Width Overall Length .016 .031 Foot Length Footprint (Reference) Foot Angle Lead Thickness .003 .009 Lead Width .009 .016 Mold Draft Angle Mold Draft Angle Bottom *Controlling Parameter Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MO-187
Drawing C04-111
Units Dimension Limits
INCHES .026 .033 .193 TYP. .118 .118 .024 .037 .006 .012
MILLIMETERS* 0.65 0.75 0.85 0.00 4.90 3.00 3.00 0.40 0.60 0.95 0.08 0.22
1.10 0.95 0.15
0.80 0.23 0.40
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MCP6001/2/4
14-Lead Plastic Dual In-line (PDIP)
Number Pins Pitch Seating Plane .140 .170 Molded Package Thickness .115 .145 Base Seating Plane .015 Shoulder Shoulder Width .300 .313 .325 Molded Package Width .240 .250 .260 Overall Length .740 .750 .760 Seating Plane .125 .130 .135 Lead Thickness .008 .012 .015 Upper Lead Width .045 .058 .070 Lower Lead Width .014 .018 .022 Overall Spacing .310 .370 .430 Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MS-001 Drawing C04-005
Units Dimension Limits
INCHES* .100 .155 .130
MILLIMETERS 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 18.80 19.05 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40
4.32 3.68 8.26 6.60 19.30 3.43 0.38 1.78 0.56 10.92
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2005 Microchip Technology Inc.
MCP6001/2/4
14-Lead Plastic Small Outline (SL) Narrow, (SOIC)
Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic
Units Dimension Limits
.053 .052 .004 .228 .150 .337 .010 .016 .008 .014
INCHES* .050 .061 .056 .007 .236 .154 .342 .015 .033 .009 .017
.069 .061 .010 .244 .157 .347 .020 .050 .010 .020
MILLIMETERS 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 5.99 3.81 3.90 8.56 8.69 0.25 0.38 0.41 0.84 0.20 0.23 0.36 0.42
1.75 1.55 0.25 6.20 3.99 8.81 0.51 1.27 0.25 0.51
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MS-012 Drawing C04-065
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MCP6001/2/4
14-Lead Plastic Thin Shrink Small Outline (ST) (TSSOP)
Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic
Units Dimension Limits
INCHES .026 .035 .004 .251 .173 .197 .024 .006 .010
.033 .002 .246 .169 .193 .020 .004 .007
.043 .037 .006 .256 .177 .201 .028 .008 .012
MILLIMETERS* 0.65 1.10 0.85 0.90 0.95 0.05 0.10 0.15 6.25 6.38 6.50 4.30 4.40 4.50 4.90 5.00 5.10 0.50 0.60 0.70 0.09 0.15 0.20 0.19 0.25 0.30
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .005" (0.127mm) side. JEDEC Equivalent: MO-153 Drawing C04-087
DS21733F-page
2005 Microchip Technology Inc.
MCP6001/2/4
APPENDIX REVISION HISTORY
Revision (March 2005)
Updated "Packaging Information" include packaging examples.
Revision (December 2004)
following list modifications: specification reduced ±4.5 from ±7.0 parts starting with date code YYWW 0449 Corrected package markings Section "Packaging Information" Added Appendix Revision History.
Revision (May 2003) Revision (December 2002) Revision (October 2002) Revision (June 2002)
Original data sheet release.
2005 Microchip Technology Inc.
DS21733E-page
MCP6001/2/4
NOTES:
DS21733E-page
2005 Microchip Technology Inc.
MCP6001/2/4
PRODUCT IDENTIFICATION SYSTEM
order obtain information, e.g., pricing delivery, refer factory listed sales office. PART Device Temperature Range Package Examples:
MCP6001T-I/LT: Tape Reel, Industrial Temperature, SC-70 package MCP6001T-I/OT: Tape Reel, Industrial Temperature, SOT-23 package. MCP6001RT-I/OT: Tape Reel, Industrial Temperature, SOT-23 package. MCP6001UT-E/OT: Tape Reel, Extended Temperature, SOT-23 package. MCP6002-I/MS: MCP6002-I/P: MCP6002-E/P: MCP6002-I/SN: MCP6002T-I/MS: Industrial Temperature, MSOP package. Industrial Temperature, PDIP package. Extended Temperature, PDIP package. Industrial Temperature, SOIC package. Tape Reel, Industrial Temperature, MSOP package. Industrial Temperature, 14LD PDIP package. Industrial Temperature,, 14LD SOIC package. Extended Temperature,, 14LD SOIC package. Industrial Temperature, 14LD TSSOP package. Tape Reel, Industrial Temperature, 14LD SOIC package. Tape Reel, Industrial Temperature, 14LD TSSOP package.
Device: MCP6001T: MCP6001RT: MCP6001UT: MCP6002: MCP6002T: MCP6004: MCP6004T: Single (Tape Reel) (SC-70, SOT-23) Single (Tape Reel) (SOT-23) Single (Tape Reel) (SOT-23) Dual Dual (Tape Reel) (SOIC, MSOP) Quad Quad (Tape Reel) (SOIC, MSOP)
Temperature Range:
-40°C +85°C -40°C +125°C
Package:
Plastic Package (SC-70), 5-lead (MCP6001 only) Plastic Small Outline Transistor (SOT-23), 5-lead (MCP6001, MCP6001R, MCP6001U) Plastic MSOP, 8-lead Plastic (300 Body), 8-lead, 14-lead Plastic SOIC, (150 Body), 8-lead Plastic SOIC (150 Body), 14-lead Plastic TSSOP (4.4mm Body), 14-lead
MCP6004-I/P: MCP6004-I/SL: MCP6004-E/SL: MCP6004-I/ST: MCP6004T-I/SL:
MCP6004T-I/ST:
Sales Support
Data Sheets Products supported preliminary Data Sheet have errata sheet describing minor operational differences recommended workarounds. determine errata sheet exists particular device, please contact following: Your local Microchip sales office Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision silicon Data Sheet (include Literature using. Customer Notification System Register site (www.microchip.com) receive most current information products.
2005 Microchip Technology Inc.
DS21733E-page
MCP6001/2/4
NOTES:
DS21733E-page
2005 Microchip Technology Inc.
Note following details code protection feature Microchip devices: Microchip products meet specification contained their particular Microchip Data Sheet. Microchip believes that family products most secure families kind market today, when used intended manner under normal conditions. There dishonest possibly illegal methods used breach code protection feature. these methods, knowledge, require using Microchip products manner outside operating specifications contained Microchip's Data Sheets. Most likely, person doing engaged theft intellectual property. Microchip willing work with customer concerned about integrity their code. Neither Microchip other semiconductor manufacturer guarantee security their code. Code protection does mean that guaranteeing product "unbreakable."
Code protection constantly evolving. Microchip committed continuously improving code protection features products. Attempts break Microchip's code protection feature violation Digital Millennium Copyright Act. such acts allow unauthorized access your software other copyrighted work, have right relief under that Act.
Information contained this publication regarding device applications like provided only your convenience superseded updates. your responsibility ensure that your application meets with your specifications. MICROCHIP MAKES REPRESENTATIONS WARRANTIES KIND WHETHER EXPRESS IMPLIED, WRITTEN ORAL, STATUTORY OTHERWISE, RELATED INFORMATION, INCLUDING LIMITED CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY FITNESS PURPOSE. Microchip disclaims liability arising from this information use. Microchip's products critical components life support systems authorized except with express written approval Microchip. licenses conveyed, implicitly otherwise, under Microchip intellectual property rights.
Trademarks Microchip name logo, Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, MATE, PowerSmart, rfPIC, SmartShunt registered trademarks Microchip Technology Incorporated U.S.A. other countries. AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor Embedded Control Solutions Company registered trademarks Microchip Technology Incorporated U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel Total Endurance trademarks Microchip Technology Incorporated U.S.A. other countries. SQTP service mark Microchip Technology Incorporated U.S.A. other trademarks mentioned herein property their respective companies. 2005, Microchip Technology Incorporated, Printed U.S.A., Rights Reserved. Printed recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification worldwide headquarters, design wafer fabrication facilities Chandler Tempe, Arizona Mountain View, California October 2003. Company's quality system processes procedures PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory analog products. addition, Microchip's quality system design manufacture development systems 9001:2000 certified.
2005 Microchip Technology Inc.
DS21733E-page
WORLDWIDE SALES SERVICE
AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Address: www.microchip.com Atlanta Alpharetta, Tel: 770-640-0034 Fax: 770-640-0307 Boston Westford, Tel: 978-692-3848 Fax: 978-692-3821 Chicago Itasca, Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, Tel: 765-864-8360 Fax: 765-864-8387 Angeles Mission Viejo, Tel: 949-462-9523 Fax: 949-462-9608 Jose Mountain View, Tel: 650-215-1444 Fax: 650-961-0286 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
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10/20/04
DS21733E-page
2005 Microchip Technology Inc.
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