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FDS6676AS N-Channel PowerTrench® SyncFETGeneral Description
Top Searches for this datasheetFDS6676AS N-Channel PowerTrench SyncFET FDS6676AS N-Channel PowerTrench® SyncFETGeneral Description FDS6676AS designed replace single SO-8 MOSFET Schottky diode synchronous DC:DC power supplies. This MOSFET designed maximize power conversion efficiency, providing gate charge. FDS6676AS RDS(ON) includes integrated Schottky diode using Fairchild's monolithic SyncFET technology. Features 14.5 RDS(ON) max= RDS(ON) max= 7.25 Includes SyncFET Schottky body diode gate charge (45nC typical) High performance trench technology extremely RDS(ON) fast switching High power current handling capability Applications DC/DC converter side notebook SO-8 Absolute Maximum Ratings Symbol VDSS VGSS Drain-Source Voltage Gate-Source Voltage Drain Current Continuous Pulsed TA=25oC unless otherwise noted Parameter Ratings (Note Units 14.5 +150 Power Dissipation Single Operation (Note (Note (Note TSTG Operating Storage Junction Temperature Range Thermal Characteristics Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case (Note (Note °C/W Package Marking Ordering Information Device Marking FDS6676AS FDS6676AS Device FDS6676AS FDS6676AS_NL (Note Reel Size 13'' 13'' Tape width 12mm 12mm Quantity 2500 units 2500 units FDS6676AS ©2004 Fairchild Semiconductor Corporation FDS6676AS N-Channel PowerTrench SyncFET Electrical Characteristics Symbol BVDSS BVDSS IDSS IGSS 25°C unless otherwise noted Parameter Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate-Body Leakage (Note Test Conditions Units Characteristics Referenced 25°C ±100 mV/°C Characteristics VGS(th) VGS(th) RDS(on) Gate Threshold Voltage Gate Threshold Voltage Temperature Coefficient Static Drain-Source On-Resistance On-State Drain Current Forward Transconductance VGS, Referenced 25°C 14.5 13.2 VGS=10 =14.5A, TJ=125°C 14.5 -3.3 mV/°C 7.25 ID(on) Dynamic Characteristics Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance (Note 2510 Switching Characteristics td(on) td(off) td(on) td(off) Qg(TOT) Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time RGEN RGEN Total Gate Charge Vgs=10V Total Gate Charge Vgs=5V Gate-Source Charge Gate-Drain Charge 14.5 FDS6676AS FDS6676AS N-Channel PowerTrench SyncFET Electrical Characteristics Symbol 25°C unless otherwise noted Parameter Drain-Source Diode Forward Voltage Diode Reverse Recovery Time Diode Reverse Recovery Current Diode Reverse Recovery Charge Test Conditions 14.5A, diF/dt A/µs Units Drain-Source Diode Characteristics Maximum Ratings (Note (Note (Note Notes: junction-to-case case-to-ambient thermal resistance where case thermal reference defined solder mounting surface drain pins. guaranteed design while determined user's board design. 50°/W when mounted copper 105°/W when mounted copper 125°/W when mounted minimum pad. "SyncFET Schottky body diode characteristics" below Scale letter size paper Pulse Test: Pulse Width 300µs, Duty Cycle 2.0% FDS6676AS_NL lead free product. FDS6676AS_NL marking will appear reel label. FDS6676AS FDS6676AS N-Channel PowerTrench SyncFET Typical Characteristics 3.5V RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE 3.5V 3.0V DRAIN CURRENT 6.0V 4.5V 3.0V 4.0V 4.5V 6.0V 2.5V 0.25 0.75 VDS, DRAIN-SOURCE VOLTAGE DRAIN CURRENT Figure On-Region Characteristics. Figure On-Resistance Variation with Drain Current Gate Voltage. 0.016 RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE RDS(ON), ON-RESISTANCE (OHM) 14.5A =10V 0.014 0.012 0.01 0.008 0.006 25oC JUNCTION TEMPERATURE 0.004 VGS, GATE SOURCE VOLTAGE Figure On-Resistance Variation with Temperature. REVERSE DRAIN CURRENT Figure On-Resistance Variation with Gate-to-Source Voltage. DRAIN CURRENT 125oC -55oC 25oC -55oC 0.01 VGS, GATE SOURCE VOLTAGE 0.001 VSD, BODY DIODE FORWARD VOLTAGE Figure Transfer Characteristics. Figure Body Diode Forward Voltage Variation with Source Current Temperature. FDS6676AS FDS6676AS N-Channel PowerTrench SyncFET Typical Characteristics (continued) VGS, GATE-SOURCE VOLTAGE 14.5A 3500 3000 1MHz CAPACITANCE (pF) 2500 Ciss 2000 1500 Coss 1000 Crss GATE CHARGE (nC) VDS, DRAIN SOURCE VOLTAGE Figure Gate Charge Characteristics. RDS(ON) LIMIT 100us 10ms 100ms P(pk), PEAK TRANSIENT POWER Figure Capacitance Characteristics. DRAIN CURRENT SINGLE PULSE 125°C/W 25°C SINGLE PULSE 0.01 0.01 VDS, DRAIN-SOURCE VOLTAGE 0.001 0.01 TIME (sec) 1000 Figure Maximum Safe Operating Area. Figure Single Pulse Maximum Power Dissipation. r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE RJC(t) r(t) °C/W 0.05 0.02 P(pk 0.01 0.01 RJC(t) Duty Cycle, SINGLE PULSE 0.001 0.0001 0.001 0.01 TIME (sec) 1000 Figure Transient Thermal Response Curve. Thermal characterization performed using conditions described Note Transient thermal response will change depending circuit board design. FDS6676AS FDS6676AS N-Channel PowerTrench SyncFET Typical Characteristics (continued) SyncFET Schottky Body Diode Characteristics Fairchild's SyncFET process embeds Schottky diode parallel with PowerTrench MOSFET. This diode exhibits similar characteristics discrete external Schottky diode parallel with MOSFET. Figure shows reverse recovery characteristic FDS6676AS. Schottky barrier diodes exhibit significant leakage high temperature high reverse voltage. This will increase power device. IDSS, REVERSE LEAKAGE CURRENT 125oC 0.01 0.8A/DIV 0.001 100oC 0.0001 25oC 0.00001 VDS, REVERSE VOLTAGE 10nS/DIV Figure SyncFET body diode reverse leakage versus drain-source voltage temperature. Figure FDS6676AS SyncFET body diode reverse recovery characteristic. comparison purposes, Figure shows reverse recovery characteristics body diode equivalent size MOSFET produced without SyncFET (FDS6676). 0.8A/DIV 10nS/DIV Figure Non-SyncFET (FDS6676) body diode reverse recovery characteristic. FDS6676AS FDS6676AS N-Channel PowerTrench SyncFET Typical Characteristics 0.01 BVDSS vary obtain required peak Figure Unclamped Inductive Load Test Circuit Drain Current Same type Figure Unclamped Inductive Waveforms 10µF QG(TOT) Ig(REF Charge, (nC) Figure Gate Charge Test Circuit Figure Gate Charge Waveform RGEN VGSPulse Width td(ON) tOFF td(OFF Duty Cycle 0.1% Pulse Width Figure Switching Time Test Circuit Figure Switching Time Waveforms FDS6676AS TRADEMARKS following registered unregistered trademarks Fairchild Semiconductor owns authorized intended exhaustive list such trademarks. ACExFAST Quiet Series Across board. Around world.OPTOPLANARPACMANThe Power Franchise POPProgrammable Active Droop QFET QSQT OptoelectronicsQuiet SWITCHER SMART STARTSPM StealthSuperFETSuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTinyLogic VCX DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES RIGHT MAKE CHANGES WITHOUT FURTHER NOTICE PRODUCTS HEREIN IMPROVE RELIABILITY, FUNCTION DESIGN. FAIRCHILD DOES ASSUME LIABILITY ARISING APPLICATION PRODUCT CIRCUIT DESCRIBED HEREIN; NEITHER DOES CONVEY LICENSE UNDER PATENT RIGHTS, RIGHTS OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS AUTHORIZED CRITICAL COMPONENTS LIFE SUPPORT DEVICES SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL FAIRCHILD SEMICONDUCTOR CORPORATION. used herein: critical component component life Life support devices systems devices support device system whose failure perform systems which, intended surgical implant into reasonably expected cause failure life body, support sustain life, whose support device system, affect safety failure perform when properly used accordance with instructions provided labeling, effectiveness. reasonably expected result significant injury user. PRODUCT STATUS DEFINITIONS Definition Terms Datasheet Identification Advance Information Product Status Formative Design Definition This datasheet contains design specifications product development. Specifications change manner without notice. This datasheet contains preliminary data, supplementary data will published later date. Fairchild Semiconductor reserves right make changes time without notice order improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves right make changes time without notice order improve design. Preliminary First Production Identification Needed Full Production Obsolete Production This datasheet contains specifications product that been discontinued Fairchild semiconductor. datasheet printed reference information only. Rev. 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