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Spec. No. : C204A3 Issued Date : 2003.04.01 Revised Date : 2005.01.03 Page No. : 1 / 5

BTC945A3

CYStech Electronics Corp.
General Purpose NPN Epitaxial Planar Transistor
Spec. No. : C204A3 Issued Date : 2003.04.01 Revised Date : 2005.01.03 Page No. : 1 / 5
BTC945A3
Description
· The BTC945A3 is designed for use in driver stage of AF amplifier and low speed switching. · Complementary to BTA733A3. · Pb-free package
Symbol
BTC945A3
Outline
TO-92
BBase CCollector EEmitter ECB
BTC945A3
CYStek Product Specification
CYStech Electronics Corp.
Symbol BVCBO BVCEO BVEBO ICBO IEBO VCE(sat) VBE(sat) VBE hFE1 hFE2 fT Cob Min. 60 50 5 0.55 50 135 150 Typ. 0.2 0.85 Max. 100 100 0.3 1.0 0.65 600 4 Unit V V V nA nA V V V MHz pF
Spec. No. : C204A3 Issued Date : 2003.04.01 Revised Date : 2005.01.03 Page No. : 2 / 5
Classification of hFE 2
Rank Range Q 135-270 P 200-400 K 300-600
BTC945A3
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves
Current Gain vs Collector Current 1000
Saturation Voltage-(mV) 1000
Spec. No. : C204A3 Issued Date : 2003.04.01 Revised Date : 2005.01.03 Page No. : 3 / 5
Saturation Voltage vs Collector Current
100 0.1 1 10 100 1000 Collector Current-- IC(mA)
10 0.1 1 10 100 1000 Collector Current-- IC(mA)
Saturation Voltage vs Collector Current 1000 Cutoff Frequency--FT(GHZ) Saturation Voltage--(mV)
Cutoff Frequency vs Collector Current
100 0.1 1 10 100 1000 Collector Current --IC(mA)
0.1 1 10 Collector Current--IC(mA) 100
Power Derating Curve
Power Dissipation-- PD(mW)
Ambient Temperature--Ta()
BTC945A3 CYStek Product Specification
CYStech Electronics Corp.
TO-92 Taping Outline
Spec. No. : C204A3 Issued Date : 2003.04.01 Revised Date : 2005.01.03 Page No. : 4 / 5
H2A H2A A
H4 H L1 H1 F1F2 D1
DIM A D D1 D2 F1, F2 F1, F2 H H1 H2 H2A H3 H4 L L1 P P1 P2 T T1 T2 W W1 BTC945A3
Item Component body height Tape Feed Diameter Lead Diameter Component Body Diameter Component Lead Pitch F1-F2 Height Of Seating Plane Feed Hole Location Front To Rear Deflection Deflection Left Or Right Component Height Feed Hole To Bottom Of Component Lead Length After Component Removal Lead Wire Enclosure Feed Hole Pitch Center Of Seating Plane Location 4 Feed Hole Pitch Over All Tape Thickness Total Taped Package Thickness Carrier Tape Thickness Tape Width Adhesive Tape Width 20 pcs Pitch
CYStek Product Specification
CYStech Electronics Corp.
TO-92 Dimension
Spec. No. : C204A3 Issued Date : 2003.04.01 Revised Date : 2005.01.03 Page No. : 5 / 5
Marking:
Style: Pin 1.Emitter 2.Collector 3.Base 3-Lead TO-92 Plastic Package CYStek Package Code: A3
: Typical
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 1.27 3.36 3.76
Inches Min. Max. 0.0142 0.0220 0.1000 0.0500 5° 2° 2°
Millimeters Min. Max. 0.36 0.56 2.54 1.27 5° 2° 2°
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
· Lead: 42 Alloy solder plating · Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
· All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. · CYStek reserves the right to make changes to its products without notice. · CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. · CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTC945A3
CYStek Product Specification