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PowerStore nvSRAM Features Description U635H16 separate modes ope
Top Searches for this datasheetU635H16 PowerStore nvSRAM Features Description U635H16 separate modes operation: SRAM mode nonvolatile mode. SRAM mode, memory operates ordinary static RAM. nonvolatile operation, data transferred parallel from SRAM EEPROM from EEPROM SRAM. this mode SRAM functions disabled. U635H16 fast static (25, ns), with nonvolatile electrically erasable PROM (EEPROM) element incorporated each static memory cell. SRAM read written unlimited number times, while independent nonvolatile data resides EEPROM. Data transfers from SRAM EEPROM (the STORE operation) take place automatically upon power down using charge stored system capacitance. Transfers from EEPROM SRAM (the RECALL operation) take place automatically power U635H16 combines high performance ease fast SRAM with nonvolatile data integrity. STORE cycles also initiated under user control software sequence. Once STORE cycle initiated, further input output disabled until cycle completed. Because sequence addresses used STORE initiation, important that other read write accesses intervene sequence sequence will aborted. RECALL cycles also initiated software sequence. Internally, RECALL step procedure. First, SRAM data cleared second, nonvolatile information transferred into SRAM cells. RECALL operation alters data EEPROM cells. nonvolatile data recalled unlimited number times. High-performance CMOS nonvolatile static 2048 bits Access Times Output Enable Access Times Cycle Time Automatic STORE EEPROM Power Down using system capacitance Software initiated STORE (STORE Cycle Time Automatic STORE Timing STORE cycles EEPROM years data retention EEPROM Automatic RECALL Power Software RECALL Initiation (RECALL Cycle Time Unlimited RECALL cycles from EEPROM Single Operation Operating temperature ranges: 9000 Quality Standard protection 2000 (MIL 883C M3015.7-HBM) RoHS compliance free Packages: PDIP24 (600 mil) SOP24 (300 mil) Configuration Description PDIP Signal Name Signal Description Address Inputs Data In/Out Chip Enable Output Enable Write Enable Power Supply Voltage Ground View March 2006 Control #ML0050 U635H16 Block Diagram EEPROM Array STORE Decoder SRAM Array Rows Columns Store/ Recall Control RECALL Power Control Input Buffers Column Column Decoder Software Detect Truth Table SRAM Operations Operating Mode Standby/not selected Internal Read Read Write High-Z High-Z Data Outputs Low-Z Data Inputs High-Z Characteristics voltages referenced (ground). characteristics valid power supply voltage range operating temperature range specified. Dynamic measurements based rise fall time measured between well input levels timing reference level input output signals with exception tdis-times ten-times, which cases transition measured from steady-state voltage. Absolute Maximum Ratingsa Power Supply Voltage Input Voltage Output Voltage Power Dissipation Operating Temperature Storage Temperature Symbol Min. -0.5 -0.3 -0.3 Max. VCC+0.5 VCC+0.5 Unit C-Type K-Type Tstg Stresses greater than those listed under ,,Absolute Maximum Ratings" cause permanent damage device. This stress rating only, functional operation device condition above those indicated operational sections this specification implied. Exposure absolute maximum rating conditions extended periods affect reliability. Control #ML0050 March 2006 U635H16 Recommended Operating Conditions Power Supply Voltage Input Voltage Input High Voltage Symbol Pulse Width permitted Conditions Min. -0.3 Max. VCC+0.3 Unit C-Type Characteristics Operating Supply Currentb Symbol ICC1 Average Supply Current during STOREc ICC2 Conditions Min. VCC-0.2 VCC-0.2 VCC-0.2 VCC-0.2 VCC-0.2 VCC-0.2 VCC-0.2 Max. K-Type Unit Min. Max. Average Supply Current during PowerStore Cyclec Standby Supply Currentd (Cycling Input Levels) ICC4 ICC(SB)1 Operating Supply Current (Cycling CMOS Input Levels) Standby Supply Curentd (Stable CMOS Input Levels) ICC3 ICC(SB) ICC1 ICC3 depedent output loading cycle rate. specified values obtained with outputs unloaded. current ICC1 measured WRITE/READ ratio 1/2. ICC2 ICC4 average currents required duration respective STORE cycles (STORE Cycle Time). Bringing will produce standby current levels until nonvolatile cycle progress timed out. MODE SELECTION table. current ICC(SB)1 measured WRITE/READ ratio 1/2. March 2006 Control #ML0050 U635H16 C-Type Characteristics Symbol High Output Leakage Current High Three-State- Output Three-State- Output IOHZ IOLZ Conditions Min. Output High Voltage Output Voltage Output High Current Output Current Input Leakage Current Max. Min. Max. K-Type Unit SRAM Memory Operations Symbol Alt. tAVAV tAVQV tELQV tGLQV tEHQZ tGHQZ tELQX tGLQX tAXQX tELICCH tEHICCL ta(A) ta(E) ta(G) tdis(E) tdis(G) ten(E) ten(G) tv(A) Unit Min. Max. Min. Max. Min. Max. Switching Characteristics Read Cycle Read Cycle Timef Address Access Time Data Validg Chip Enable Access Time Data Valid Output Enable Access Time Data Valid HIGH Output High-Zh HIGH Output High-Zh Output Low-Z Output Low-Z Output Hold Time after Address Change Chip Enable Power Activee Chip Disable Power Standbyd, Parameter guaranteed tested. Device continuously selected with both LOW. Address valid prior coincident with transition LOW. Measured from steady state output voltage. Control #ML0050 March 2006 U635H16 Read Cycle Ai-controlled (during Read cycle: VIL, VIH)f Output Previous Data Valid tv(A) Address Valid ta(A) Output Data Valid Read Cycle E-controlled (during Read cycle: VIH)g Output High Impedance (10) ACTIVE STANDBY Address Valid ta(A) ta(E) ten(E) ta(G) ten(G) (11) tdis(E) tdis(G) Output Data Valid Switching Characteristics Write Cycle Symbol Alt. Alt. tAVAV tWLWH tWLEH tAVWL tAVWH tELWH tELEH tDVWH tWHDX tWHAX tWLQZ tWHQX tDVEH tEHDX tEHAX tAVEL tAVEH tAVAV tw(W) tsu(W) tsu(A) tsu(A-WH) tsu(E) tw(E) tsu(D) th(D) th(A) tdis(W) ten(W) Unit Min. Max. Min. Max. Min. Max. Write Cycle Time Write Pulse Width Write Pulse Width Setup Time Address Setup Time Address Valid Write Chip Enable Setup Time Chip Enable Write Data Setup Time Write Data Hold Time after Write Address Hold after Write Output High-Zh, HIGH Output Low-Z March 2006 Control #ML0050 U635H16 Write Cycle W-controlledj (12) tsu(A) Address Valid tsu(E) (17) tsu(A-WH) (16) tw(W) (13) tsu(D) (19) tdis(W) (22) Previous Data th(A) (21) Input (15) th(D) (20) Input Data Valid ten(W) (23) High Impedance Output Write Cycle E-controlledj (12) Input tsu(A) (15) Address Valid tw(E) (18) th(A) (21) tsu(W) (14) tsu(D) (19) th(D) (20) Input Data Valid High Impedance Output undefined H-level L-level when goes LOW, outputs remain high impedance state. must during address transition. Control #ML0050 March 2006 U635H16 Nonvolatile Memory Operations Mode Selection (hex) Mode Selected Read SRAM Write SRAM Read SRAM Read SRAM Read SRAM Read SRAM Read SRAM Nonvolatile STORE Read SRAM Read SRAM Read SRAM Read SRAM Read SRAM Nonvolatile RECALL Output High Output Data Input Data Output Data Output Data Output Data Output Data Output Data Output High Output Data Output Data Output Data Output Data Output Data Output High Power Standby Active Active Active Notes Active consecutive addresses must order listed (000, 555, 2AA, 7FF, 0F0, 70F) Store cycle (000, 555, 2AA, 7FF,0F0, 70E) RECALL cycle. must high during consecutive cycles. STORE cycle RECALL cycle tables diagrams further details. following six-address sequence used testing purposes should used: 000, 555, 2AA, 7FF, 0F0, 39C. Activation nonvolatile cycles does depend state state assumes that VIL. PowerStore Power RECALL Power RECALL Durationn, Symbol Conditions Alt. tRESTORE power supply voltage must stay above least after start STORE operation Min. Max. Unit STORE Cycle Durationf tPDSTORE time allowed Complete SRAM Cyclef, Voltage Trigger Level tDELAY VSWITCH tRESTORE starts from time rises above VSWITCH. March 2006 Control #ML0050 U635H16 PowerStore automatic Power RECALL VSWITCH PowerStore tPDSTOREp Power RECALL (25) (24) (24) tRESTORE (26) tRESTORE tDELAY POWER RECALL BROWN STORE SRAM WRITES) BROWN PowerStore Software Controlled STORE/ RECALL Cyclek, Symbol Alt. tAVAV tELQZ tELQXS tELQXR tAVELN tELEHN tEHAXN tdis(E)SR td(E)S td(E)R tsu(A)SR tw(E)SR th(A)SR Unit Min. Max. Min. Max. Min. Max. STORE/RECALL Initiation Time Chip Enable Output Inactivep STORE Cycle Timeq RECALL Cycle Timer Address Setup Chip Enables Chip Enable Pulse Widths, Chip Disable Address Changes software sequence clocked with controlled READs. Once software controlled STORE RECALL cycle initiated, completes automatically, ignoring inputs. Note that STORE cycles (but RECALL) aborted VSWITCH (STORE inhibit). automatic RECALL also takes place power starting when exceeds VSWITCH takes tRESTORE. must drop below VSWITCH once been exceeded RECALL function properly. Noise trigger multiple READ cycles from same address abort address sequence. Chip Enable Pulse Width less than ta(E) (see Read Cycle) greater than equal tw(E)SR, than data valid pulse, however STORE RECALL will still initiated. Control #ML0050 March 2006 U635H16 Software Controlled STORE/RECALL Cycles, HIGH after STORE initiation) (27) (27) ADDRESS (33) ADDRESS tw(E)SR (31) (32) (33) th(A)SR th(A)SR tw(E)SR (31) (32) tdis(E) td(E)S(30) Output tsu(A)SR High Impedance VALID tsu(A)SR td(E)R (29) VALID tdis(E)SR (28) Software Controlled STORE/RECALL Cycles, after STORE initiation) (27) ADDRESS tw(E)SR (32) ADDRESS (33) th(A)SR tsu(A)SR (31) (33) th(A)SR (31) Output tsu(A)SR td(E)S (29) td(E)R (30) High Impedance VALID VALID tdis(E)SR (28) must HIGH when during address sequence order initiate nonvolatile cycle. either HIGH throughout. Addresses through found mode selection table. Address determines whether U635H16 performs STORE RECALL. must used clock address sequence software controlled STORE RECALL cycles. March 2006 Control #ML0050 U635H16 Test Configuration Functional Check VCCx relevant test measurement Input level according ment output pins Simultaneous measure- measurement tdis-times ten-times capacitance Between must connected high frequency bypass capacitor avoid disturbances. Capacitancee Input Capacitance Output Capacitance Conditions Symbol Min. Max. Unit pins under test must connected with ground capacitors. Ordering Code Example Type Package PDIP24 (600 mil) SOP24 (300 mil) U635H16 Leadfree Option blank Standard Package Leadfree Green Package Access Time Operating Temperature Range special request Device Marking (example) Product specification U635H16SC 0425 Date manufacture (The first digits indicating year, last digits calendar week.) Leadfree Green Package March 2006 Internal Code Control #ML0050 U635H16 Device Operation U635H16 separate modes operation: SRAM mode nonvolatile mode. SRAM mode, memory operates standard fast static RAM. nonvolatile mode, data transferred from SRAM EEPROM (the STORE operation) from EEPROM SRAM (the RECALL operation). this mode SRAM functions disabled. STORE cycles initiated under user control software sequence also automatically initiated when power supply voltage level chip falls below VSWITCH. RECALL operations automatically initiated upon power also occur when rises above VSWITCH, after power condition. RECALL cycles also initiated software sequence. SRAM READ U635H16 performs READ cycle whenever HIGH. address specified pins determines which 2048 data bytes will accessed. When READ initiated address transition, outputs will valid after delay tcR. READ initiated outputs will valid ta(E) ta(G), whichever later. data outputs will repeatedly respond address changes within access time without need transition control input pins, will remain valid until another address change until brought HIGH brought LOW. SRAM WRITE WRITE cycle performed whenever LOW. address inputs must stable prior entering WRITE cycle must remain stable until either goes HIGH cycle. data pins will written into memory valid tsu(D) before controlled WRITE tsu(D) before controlled WRITE. recommended that kept HIGH during entire WRITE cycle avoid data contention common lines. left LOW, internal circuitry will turn output buffers tdis(W) after goes LOW. Automatic STORE U635H16 uses intrinsic system capacitance perform automatic STORE power down. long system power supply take least tPDSTORE decay from VSWITCH down U635H16 will safely automatically STORE SRAM data EEPROM power down. order prevent unneeded STORE operations, automatic STORE will ignored unless least March 2006 Control #ML0050 WRITE operation taken place since most recent STORE RECALL cycle. Software initiated STORE cycles performed regardless whether WRITE operation taken place. Automatic RECALL During power automatic RECALL takes place. After power condition (VCC VSWITCH) internal RECALL request latched. When once again exceeds sense voltage VSWITCH, requested RECALL cycle will automatically initiated will take tRESTORE complete. U635H16 WRITE state power RECALL, SRAM data will corrupted. help avoid this situation, resistor should connected between system VCC. Software Nonvolatile STORE U635H16 software controlled STORE cycle initiated executing sequential READ cycles from specific address locations. relying READ cycles only, U635H16 implements nonvolatile operation while remaining compatible with standard SRAMs. During STORE cycle, erase previous nonvolatile data performed first, followed parallel programming nonvolatile elements. Once STORE cycle initiated, further inputs outputs disabled until cycle completed. Because sequence addresses used STORE initiation, important that other READ WRITE accesses intervene sequence sequence will aborted. initiate STORE cycle following READ sequence must performed: Read address Read address Read address Read address Read address Read address (hex) (hex) (hex) (hex) (hex) (hex) Valid READ Valid READ Valid READ Valid READ Valid READ Initiate STORE Once sixth address sequence been entered, STORE cycle will commence chip will disabled. important that READ cycles WRITE cycles used sequence, although necessary that sequence valid. After tSTORE cycle time been fulfilled, SRAM will again activated READ WRITE operation. U635H16 Software Nonvolatile RECALL RECALL cycle EEPROM data into SRAM initiated with sequence READ operations manner similar STORE initiation. initiate RECALL cycle following sequence READ operations must performed: Read address Read address Read address Read address Read address Read address (hex) (hex) (hex) (hex) (hex) (hex) Valid READ Valid READ Valid READ Valid READ Valid READ Initiate RECALL Hardware Protection U635H16 offers hardware protection against inadvertent STORE operation through Sense. When VSWITCH software controllod STORE operations will inhibited. Average Active Power U635H16 been designed draw significantly less power when (chip enabled) access cycle time longer than When HIGH chip consumes only standby current. overall average current drawn part depends following items: CMOS input levels time during which chip disabled HIGH) cycle time accesses LOW) ratio READs WRITEs operating temperature level Internally, RECALL step procedure. First, SRAM data cleared second, nonvolatile information transferred into SRAM cells. RECALL operation alters data EEPROM cells. nonvolatile data recalled unlimited number times. information describes type component shall considered assured characteristics. Terms delivery rights change design reserved. Control #ML0050 March 2006 U635H16 LIFE SUPPORT POLICY Simtek products designed, intended, authorized components systems intended surgical implant into body, other applications intended support sustain life, other application which failure Simtek product could create situation where personal injury death occur. Components used life-support devices systems must expressly authorized Simtek such purpose. LIMITED WARRANTY information this document been carefully checked believed reliable. However, Simtek makes guarantee warranty concerning accuracy said information shall responsible loss damage whatever nature resulting from reliance upon information this document describes type component shall considered assured characteristics. Simtek does guarantee that information contained herein will infringe upon patent, trademark, copyright, mask work right other rights third parties, patent licence implied hereby. This document does extent Simtek's warranty product beyond that forth standard terms conditions sale. Simtek reserves terms delivery reserves right make changes products specifications, both, presented this publication time without notice. March 2006 Change record Date/Rev 01.11.2001 20.04.2004 7.4.2005 31.3.2006 Name Ivonne Steffens Matthias Schniebel Stefan Troy Meester Simtek Change format revision release ,,Memory 2002" adding ,,Leadfree Green Package" ordering information adding ,,Device Marking" edding RoHS compliance free, endurance cycle 100a data retention, restrictions deleted, changed obsolete status Assigned Simtek Document Control Number Other recent searchesXTR105 - XTR105 XTR105 Datasheet XRT73L03A - XRT73L03A XRT73L03A Datasheet QS6J11 - QS6J11 QS6J11 Datasheet PRO488 - PRO488 PRO488 Datasheet FSS234D - FSS234D FSS234D Datasheet FSS234R - FSS234R FSS234R Datasheet FSN-12A-17 - FSN-12A-17 FSN-12A-17 Datasheet DRC2144G - DRC2144G DRC2144G Datasheet BUL39D - BUL39D BUL39D Datasheet
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