High Brightness Chip small size surface mount type Thin package 0

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High Brightness Chip small size surface mount type Thin package 0

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SA1316-H
High Brightness Chip
small size surface mount type Thin package 0.55mm(H) thickness Transparent clear lens optic power consumption type chip
Applications
backlighting Keypad backlighting Symbol backlighting Front panel indicator lamp
Outline Dimensions
unit
KSD-O8G007-001
SA1316-H
Absolute Maximum Ratings
Characteristic
Power dissipation Forward current Peak forward current Reverse voltage Operating temperature range Storage temperature range
(Ta=25oC)
Symbol
Topr Tstg
Rating
-2580 -30100
Unit
Soldering temperature Tsol 240°C seconds Duty ratio 1/16, Pulse width 0.1ms Recommended reflow soldering temperature profile Preheating within seconds soldering within seconds Gradual cooling (Avoid quenching) Temp Peak Temp max. Preheating area 150~185, 90±30sec max. 3/sec max. 4/sec Time from Peak Temperature max. 6min Time (sec) max. -6/sec max. 10sec
Solder area 220, max. 60sec
Electrical Optical Characteristics
Characteristic
Forward voltage
(Ta=25oC)
Symbol
Test Condition
20mA 20mA 20mA 20mA VR=4V
Unit
Luminous intensity
Peak wavelength Spectrum bandwidth Reverse current
*4Half angle
20mA
KSD-O8G007-001
SA1316-H
off-axis angle where luminous intensity peak intensity Luminous intensity maximum tolerance each grade classification limit ±18% Grade Classification (Ta=25)
Test Condition 20mA Luminous Intensity [mcd] 27~43 632~635 43~68 68~100 635~641 100~155 Peak Wavelength [nm]
KSD-O8G007-001
SA1316-H
Electrical Characteristic Curves
Fig. Fig.
Forward Current [mA]
Luminous Intensity [mcd]
Forward Voltage
Forward Current [mA]
Fig.
Fig.4 Spectrum Distribution
Current [mA]
Forward
Relative Intensity
Ambient Temperature
Wavelength [nm]
Fig. Radiation Diagram(X)
Fig. Radiation Diagram(Y)
Relative Luminous Intensity
Relative Luminous Intensity
KSD-O8G007-001
SA1316-H
Corp. products intended components general electronic equipment (Office communication equipment, measuring equipment, home appliance, etc.). Please make sure that consult with before these Corp. products equipments which require high quality reliability, equipments which could have major impact welfare human life(atomic energy control, airplane, spaceship, transportation, combustion control, types safety device, etc.). Corp. cannot accept liability damage which occur case these Corp. products were used mentioned equipments without prior consultation with Corp. Specifications mentioned this publication subject change without notice.
KSD-O8G007-001

High Brightness Chip small size surface mount type Thin package 0

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