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M11L416256SA PAGE MODE FEATURES organization (Extended
Top Searches for this datasheetEliteMT M11L416256SA PAGE MODE FEATURES organization (Extended Data-Output) access mode Byte/Word Read/Write operation Single 3.3V 10%) power supply LVTTL-compatible inputs outputs 512-cycle refresh Refresh modes only, BEFORE (CBR) HIDDEN capabilities Self-refresh capability JEDEC standard pinout Parameter tRAC tCAC ORDERING INFORMATION PACKAGE 40-pin 400mil 40-pin 400mil TSOP (Type PRODUCT PACKING TYPE COMMENTS M11L416256SASOJ/TSOPII M11L416256SA35 Pb-free GENERAL DESCRIPTION M11L416256 series randomly accessed solid state memory, organized 262,144 bits device. offers Extended Data-Output 3.3V( 10%) single power supply. Access time (-35) self-refresh package type (SOJ, TSOP optional features this family. these family have before -only refresh Hidden refresh capabilities. access modes supported this device: Byte access Word access. only leave other staying high will result BYTE access. WORD access happens when CASL CASH used. CASL transiting during READ WRITE cycle will output input data into lower byte (IO0~IO7), CASH transiting will output input data into upper byte (IO8~15). ASSIGNMENT View I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 TSOP (TypeII) View I/O1 I/O1 I/O1 I/O1 I/O1 I/O1 I/O9 I/O8 CASL CASH I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 I/O1 I/O1 I/O1 I/O1 I/O1 I/O1 CASL CASH Elite Memory Technology Publication Date: Aug. 2005 Revision 1/16 EliteMT FUNCTIONAL BLOCK DIAGRAM M11L416256SA CASL CASH CONTROL LOGIC DATA-IN BUFFER IO15 CLOCK GENERATOR DATA-OUT BUFFER COLUMN DECODER COLUMN ADDRESS BUFFER REFRESH CONTROLER SENSE AMPLIFIERS GATING ROW. ADDRESS BUFFERS(9) DECODER MEMORY ARRAY REFRESH COUNTER GENERATOR DESCRIPTIONS 16~19,22~26 NAME A0~A8 CASH CASL TYPE Input Input Input Input DESCRIPTION Address Input Address A0~A8 Column Address A0~A8 Address Strobe Column Address Strobe Upper Byte Control Column Address Strobe Lower Byte Control Input Input Input Output Supply Ground Write Enable Output Enable Data Input Output Power, 3.3V Ground Connect 2~5,7~10,31~34,36~39 1,6,20 21,35,40 11,12,15,30 I/O0 I/O15 Elite Memory Technology Publication Date: Aug. 2005 Revision 2/16 EliteMT ABSOLUTE MAXIMUM RATINGS Voltage Relative .-0.5V +4.6V Operating Temperature, (ambient) Storage Temperature (plastic) .-55 +150 Power Dissipation .0.8W Short Circuit Output Current .50mA M11L416256SA Permanent device damage occur "Absolute Maximum Ratings" exceeded. This stress rating only, functional operation device above those conditions indicated operational sections this specification implied. Exposure absolute maximum rating conditions extended periods affect reliability. ELECTRICAL CHARACTERISTICS RECOMMENDED OPERATING CONDITIONS 3.3V unless otherwise noted) PARAMETER CONDITIONS SYMBOL UNITS NOTES Supply Voltage Supply Voltage Input High Voltage Input Voltage Input Leakage Current Output Leakage Current Output High Voltage Output Voltage Note 1.All Voltages referenced VIH(max) VOUT Output(s) disable -0.3 +0.3 PARAMETER CONDITIONS cycling =min SYMBOL UNITS NOTES Operating Current ICC1 Standby Current interface DOUT =High-Z CMOS interface, VCC-0.2V ICC2 only refresh Current =VIH, ICC3 ICC4 ICC5 ICC6 Page Mode Current Standby Current Before Refresh Current 0.2V, DOUT High-Z, CMOS interface VIL, Battery Backup Current (S-ver. only) Self Refresh Current (S-ver. only) ICC7 A0~A8 -0.2 0.2V DQ0~DQ15 -0.2, 0.2V open ICC8 Note specified output open condition. Address changed twice less while =VIL Address changed once less while =VIH Elite Memory Technology Publication Date: Aug. 2005 Revision 3/16 EliteMT CAPACITANCE 3.3V 10%) PARAMETER SYMBOL M11L416256SA UNIT Input Capacitance (address) Input Capacitance CASH CASL Output capacitance (I/O0~I/O15) ELECTRICAL CHARACTERISTICS =3.3V 10%, (note Test Conditions Input timing reference levels 0.8V, 2.0V Output reference level VOL= 0.8V, VOH=2.0V Output Load 2TTL gate (50pF) Assumed PARAMETER Read Write Cycle Time Read Write Cycle Time EDO-Page-Mode Read Write Cycle Time EDO-Page-Mode Read-Write Cycle Time Access Time From Access Time From Access Time From Access Time From Column Address Access Time From Precharge SYMBOL UNIT NOTES tRWC tPCM tRAC tCAC tOAC tACP tRAS tRASC tRSH tCAS tCSH tRCD tCRP tASR tRAH tRAD tASC tCAH tRAL tRCS 100K 15,18 5,20 13,20 Pulse Width Pulse Width (EDO Page Mode) Hold Time Precharge Time Pulse Width Hold Time Precharge Time Delay Time Precharge Time Address Setup Time Address Hold Time 6,23 7,18 Column Address Delay Time Column Address Setup Time Column Address Hold Time Column Address Hold Time (Reference Column Address Lead Time Read Command Setup Time Elite Memory Technology Publication Date: Aug. 2005 Revision 4/16 EliteMT (Continued) PARAMETER Read Command Hold Time Reference Read Command Hold Time Reference SYMBOL M11L416256SA 9,15,19 10,17,20 17,26 11,15,18 15,25 15,19 12,20 12,20 UNIT NOTES tRCH tRRH tCLZ tOFF1 tOFF2 tWCS tWCH tWCR tRWL tCWL tDHR tRWD tAWD tCWD tREF tRPC tCSR tCHR tOEH tOES tOEHC tOEP tORD tCLCH tCOH tWHZ tRASS tRPS tCHS Output Low-Z Output Buffer Turn-off Delay From Output Buffer Turn-off Write Command Setup Time Write Command Hold Time Write Command Hold Time(Reference Write Command Pulse Width Write Command Lead Time Write Command Lead Time Data-in Setup Time Data-in Hold Time Data-in Hold Time (Reference Delay Time Column Address Delay Time 11,18 Delay Time Transition Time (rise fall) Refresh Period (512 cycles) Precharge Time Setup Time(CBR REFRESH) Hold Time(CBR REFRESH) Hold Time From During Read-Mode-Write Cycle High Setup Time High Hold Time From High Precharge Time Setup Prior During Hidden Refresh Cycle Last Going First Returning High Data Output Hold After Returning Output Disable Delay From Self Refresh Pulse width Self Refresh High Precharge Time Self Refresh Hold Time 1,18 1,19 27,28 27,28 27,28 Elite Memory Technology Publication Date: Aug. 2005 Revision 5/16 EliteMT Notes M11L416256SA Enables on-chip refresh address counters. VIH(min) VIL(max) reference levels measuring timing input signals. Transition times measured between VIL. addition meet transition rate specification, input signals must transit between monotonic manner. Assume that tRCD tRCD(max). tRCD greater than maximum recommended value shown this table, tRAC will increase amount that tRCD exceeds value shown. Assume that tRCD tRCD (max) falling edge data-out will maintained from previous cycle. initiate cycle clear data-out buffer, must pulsed high. Operation within tRCD limit ensures that tRCD (max) met, tRCD (max) specified reference point only tRCD greater than specified tRCD (max) limit, access time controlled tCAC. Operation within tRAD limit ensures that tRAD(max) met. tRAD(max) specified reference point only tRAD greater than specified tRAD (max) limit, access time controlled tAA. Either tRCH tRRH must satisfied READ cycle. tOFF1(max) defines time which output achieves open circuit condition reference VOL. tWCS, tRWD, tAWD tCWD restrictive operating parameters LATE WRITE READ-MODIFY-WRITE cycle only. tWCS tWCS(min) cycle EARLY WRITE cycle data output will remain open circuit throughout entire cycle. tRWD tRWD(min) tAWD tAWD(min) tCWD tCWD(min) cycle READ-WRITE data output will contain data read from selected cell. neither above conditions met, state access time until back indeterminate. held high taken after goes result LATE WRITE -controlled) cycle. Those parameters referenced leading edge EARLY WRITE cycles leading edge LATE WRITE READ-MODIFY- WRITE cycles. During READ cycle, then taken HIGH before goes high, goes open, tied permanently low, LATE WRITE READ-MODIFY-WRITE operation possible. initial pause required after power-up followed eight refresh cycles only CBR) before proper device operation assured. eight cycle wake-ups should repeated time tREF refresh requirement exceeded. WRITE command defined going low. LATE WRITE READ-MODIFY-WRITE cycles must have both tOFF2 tOEH high during WRITE cycle) order ensure that output buffers will open during WRITE cycles. I/Os open during READ cycles once tOFF1 tOFF2 occur. Referenced earlier falling edge. Referenced latter rising edge. Output parameter (I/O) referenced corresponding input, IO0~7 CASL IO8~15 CASH Last falling edge first rising edge. Last rising edge next cycle's last rising edge. Last rising edge first falling edge. Each must meet minimum pulse width. Referenced latter falling edge. controlled regardless CASL CASH Self refresh mode initiated performing refresh cycle holding specified tRASS. Self refresh mode terminated rising high minimum time tRPS. refresh mode expect distributed refresh mode, rows must refreshed within refresh rate before after self refresh. Elite Memory Technology Publication Date: Aug. 2005 Revision 6/16 EliteMT TRUTH TABLE ADDRESSES M11L416256SA FUNCTION CASL CASH High-Z Data-Out Lower Byte, Data-Out Upper Byte, Data-Out Data-In Lower Byte, Data-In Upper Byte, High-Z Lower Byte, High-Z Upper Byte, Data-In Data-Out, Data-In Data-Out Data-Out Data-Out NOTES Standby Read Word Read Lower Byte Read Upper Byte Write Word (Early Write) Write Lower Byte (Early) Write Upper Byte (Early) Read-Write Cycle EDO-Page-Mode Cycle Read Cycle EDO-Page-Mode Cycle Write Cycle EDO-Page-Mode Cycle Read-Write Cycle Hidden Refresh -Only Refresh Data-In Data-In Data-Out, Data-In Data-Out, Data-In Data-Out High-Z Refresh Self-Refresh High-Z High-Z *Note These WRITE cycles also BYTE WRITE cycles (either CASL CASH active). These READ cycles also BYTE READ cycles (either CASL CASH active). Only must active CASL CASH Elite Memory Technology Publication Date: Aug. 2005 Revision 7/16 EliteMT READ CYCLE tRAS M11L416256SA tCSH tCRP tRCD tRSH tCAS tRRH tCLCH tASR ADDR tRAD tRAH tASC tRAL tCAH COLUMN tRCS tRCH tRAC tCAC tCLZ OPEN tOFF1 DATA tOFF2 EARLY WRITE CYCLE tRAS tCRP CASL tRCD tCSH tRSH tCAS tCLCH tASR ADDR tRAD tRAH tASC COLUMN tRAL tCAH tWCS tCWL tRWL tWCR tWCH tDHR DATA DON'T CARE UNDEFINED Note: tOFF1 referenced from rising edge whichever occurs last. Elite Memory Technology Publication Date: Aug. 2005 Revision 8/16 EliteMT READ WRITE CYCLE (LATE WRITE READ-MODIFY-WRITE CYCLES) tRWC M11L416256SA tCRP CASL,CASH tRCD tCSH tCAS,tCLCH tASR ADDR tRAD tRAH tASC COLUMN tRCS tRWD tCWD tAWD tCWL tRWL tRAC tCAC tCLZ VI/O VI/O OPEN VALI tOFF tOEH EDO-PAGE-MODE READ CYCLE tRASC tCRP CASL tCSH tRCD tCAS tCLCH (NOTE2) tCAS,tCLCH tRSH tCAS, CLCH tASR tRAH ADDR tRAL tASC tCAH tASC tASC tCAH COLUMN COLUMN COLUMN tRCS tRCH tRRH tRAC tCAC tCLZ OPEN tCAC tCOH VALID DATA tACP tCAC tCLZ tOEHC tOFF tOES tOEP tOFF OPEN tOES tOFF DON'T CARE UNDEFINED *NOTE tOFF1 referenced from rising edge whichever occurs last. measured from falling edge falling edge from rising edge rising edge Both measurements must meet specification. Elite Memory Technology Publication Date: Aug. 2005 Revision 9/16 EliteMT EDO-PAGE-MODE EARLY-WRITE CYCLE tRASC M11L416256SA tCSH tCRP CASL ,CASH tRCD tCAS,tCLCH (NOTE1) tCAS, tCLCH tRSH tCAS,tCLCH tRAD tASR ADDR tRAH tASC tCAH tASC tCAH tASC tRAL tCAH COLUMN COLUMN COLUMN tCWL tWCS tWCH tWCS tCWL tWCH tWCS tCWL tWCH tWCR tDHR tRWL DATA DATA DATA EDO-PAGE-MODE READ-WRITE CYCLE (LATE WRITE READ-MODIFY-WRITE CYCLES) tRASC tCSH tCRP CASL ,CASH tRCD tCAS,tCLCH tPCM tCAS, tCLCH tRSH tCAS,tCLCH tRAD tASR ADDR tRAH tASC tCAH tASC tCAH COLUMN tASC tRAL tCAH COLUMN COLUMN tRWD tRCS tCWL tCWL tAWD tCWD tAWD tCWD tRWL tCWL tAWD tCWD tRAC tCAC tCLZ VI/O VI/O VALI VALI DOUT tACP tCAC tCLZ VALI VALI DOUT tACP tCAC tCLZ VALID VALI DOUT tOFF2 tOFF tOFF2 tOEH DON'T CARE UNDEFINED Note measured from falling edge falling edge from rising edge rising edge Both measurements must meet specification. Elite Memory Technology Publication Date: Aug. 2005 Revision 10/16 EliteMT EDO-PAGE-MODE READ-EARLY-WRITE CYCLE (Psuedo READ-MODIFY-WRITE) tRASC M11L416256SA tCSH tCRP CASL tRCD tCAS tCAS tRSH tCAS tRAD tASR tRAH ADDR tRAL tCAH tCAH tASC tCAH tASC COLUMN(A) COLUMN(B) COLUMN(N) tRCS tRCH tWCS tWCH tRAC tCAC tACP tWHZ tCAC tCOH DATA( VALID DATA(B VI/OH VI/OL OPEN VALID DATA ONLY REFRESH CYCLE (ADDR A0~A8 DON'T CARE) tRAS tCRP CASL,CASH tRPC tASR ADDR tRAH DON'T CARE UNDEFINED Elite Memory Technology Publication Date: Aug. 2005 Revision 11/16 EliteMT REFRESH CYCLE (A0~A8 DON'T CARE) M11L416256SA tRAS tRAS tRPC CASL tCSR tCHR tRPC tCSR tCHR OPEN tRCH HIDDEN REFRESH CYCLE HIGH LOW) (READ) (REF RESH) tRAS tRAS tCRP CASL tRCD tRSH tCHR tRAD tASR ADDR tRAH tASC tRAL tCAH COLUMN tRAC tCAC tCLZ OPEN VALID DATA tOFF1 OPEN tORD tOFF2 DON'T CARE UNDEFINED Note tOFF1 reference from rising edge whichever occurs last. Elite Memory Technology Publication Date: Aug. 2005 Revision 12/16 EliteMT SELF REFRESH CYCLE DON'T CARE) M11L416256SA tRASS tRPS tRPC CASL ,CASH tCSR tRPC tCHS tCRP tASR ADDR OPEN tRCH DON'T CARE UNDEFINED Elite Memory Technology Publication Date: Aug. 2005 Revision 13/16 EliteMT PACKING 40-LEAD SECTION M11L416256SA DIMENSIONS SOJ(400mil) 0.050" Max. Detail Seating Plain Detail 0.024" Min. SECTION 0.050" Max. Detail Seating Plain Detail 0.024" Min. Symbol Dimension Norm 3.250 3.510 3.760 2.080 2.790 0.380 0.460 0.560 0.635 0.180 0.250 0.360 1.270 Dimension inch Symbol Dimension Norm Norm 0.128 0.138 0.148 10.920 11.176 11.430 0.082 10.030 10.160 10.290 0.110 9.40 0.015 0.018 0.022 0.760 0.890 1.020 0.025 0.007 0.010 0.014 0.050 25.91 26.040 26.290 Dimension inch Norm 0.430 0.440 0.450 0.395 0.400 0.405 0.370 0.030 0.035 0.040 1.02 1.025 1.035 Elite Memory Technology Publication Date: Aug. 2005 Revision 14/16 EliteMT PACKING 44-LEAD DIMENSIONS TSOP(II) DRAM(400mil) M11L416256SA Symbol Dimension 0.05 0.95 0.30 0.30 0.12 0.10 18.28 11.56 10.03 0.40 18.41 0.805 11.96 10.29 0.69 11.76 10.16 0.59 0.80 0.80 0.35 1.00 Norm 1.20 0.15 1.05 0.45 0.40 0.21 0.16 18.54 Dimension inch 0.002 0.037 0.012 0.012 0.005 0.004 0.720 0.455 0.395 0.016 0.725 0.0317 0.463 0.400 0.023 0.031 0.0315 0.471 0.027 0.014 0.039 Norm 0.047 0.006 0.042 0.018 0.016 0.008 0.006 0.730 Elite Memory Technology Publication Date: Aug. 2005 Revision 15/16 EliteMT Important Notice rights reserved. M11L416256SA part this document reproduced duplicated form means without prior permission EliteMT. contents contained this document believed accurate time publication. EliteMT assumes responsibility error this document, reserves right change products specification this document without notice. information contained herein presented only guide examples application products. responsibility assumed EliteMT infringement patents, copyrights, other intellectual property rights third parties which result from use. license, either express implied otherwise, granted under patents, copyrights other intellectual property rights EliteMT others. semiconductor devices have inherently certain rate failure. minimize risks associated with customer's application, adequate design operating safeguards against injury, damage, loss from such failure, should provided customer when making application designs. EliteMT's products authorized critical applications such limited life support devices system, where failure abnormal operation directly affect human lives cause physical injury property damage. products described here used such kinds application, purchaser must quality assurance testing appropriate such applications. Elite Memory Technology Publication Date: Aug. 2005 Revision 16/16 Other recent searchesPV36W200C01B00 - PV36W200C01B00 PV36W200C01B00 Datasheet M62500P - M62500P M62500P Datasheet M62292FP - M62292FP M62292FP Datasheet M62293FP - M62293FP M62293FP Datasheet HY5DU12422B - HY5DU12422B HY5DU12422B Datasheet HY5DU12822B - HY5DU12822B HY5DU12822B Datasheet HY5DU121622B - HY5DU121622B HY5DU121622B Datasheet GS881Z18C - GS881Z18C GS881Z18C Datasheet DAML6273 - DAML6273 DAML6273 Datasheet ACT31 - ACT31 ACT31 Datasheet AAT3123 - AAT3123 AAT3123 Datasheet AAT3124 - AAT3124 AAT3124 Datasheet AAT3123 - AAT3123 AAT3123 Datasheet
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