IPP085N06L OptiMOS® Power-Transistor Features fast switching
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IPB085N06L
IPP085N06L
OptiMOS® Power-Transistor
Features fast switching converters sync. rectification N-channel enhancement logic level operating temperature Avalanche rated Pb-free lead plating, RoHS compliant
Product Summary DS(on),max
version
Type
IPB085N06L
IPP085N06L
Type IPB085N06L Package IPP085N06L Marking
Package P-TO263-3-2 P-TO263-3-2 085N06L P-TO220-3-1
Marking P-TO220-3-1 085N06L 085N06L 085N06L
Maximum ratings, j=25 unless otherwise specified Parameter Continuous drain current Symbol Conditions C=25 °C1) C=100 Pulsed drain current Avalanche energy, single pulse Reverse diode Gate source voltage Power dissipation Operating storage temperature climatic category; 68-1
Value
Unit
D,pulse
C=25 °C2) D=80 GS=25 D=80 DS=48 =200 A/µs, j,max=175
kV/µs
C=25
55/175/56
Current limited bondwire; with thJC=0.8 chip able carry figure
Rev. 1.01
page
2006-06-13
IPB085N06L
Parameter Symbol Conditions min. Thermal characteristics Thermal resistance, junction case version, device thJC thJA minimal footprint cooling area3) Electrical characteristics, j=25 unless otherwise specified Static characteristics Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current (BR)DSS GS=0 GS(th) DS=V D=125 DS=60 GS=0 j=25 DS=60 GS=0 j=125 Gate-source leakage current Drain-source on-state resistance DS(on) GS=20 DS=60 GS=10 D=80 GS=4.5 D=53 GS=10 D=80 version GS=4.5 D=53 version Gate resistance Transconductance DS|>2|I DS(on)max, D=80 0.01 Values typ.
IPP085N06L
Unit max.
11.7
Device epoxy with (one layer, thick) copper area drain connection. vertical still air.
Rev. 1.01
page
2006-06-13
IPB085N06L
Parameter Symbol Conditions min. Dynamic characteristics Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics4) Gate source charge Gate charge threshold Gate drain charge Switching charge Gate charge total Gate plateau voltage Output charge Reverse Diode Diode continous forward current Diode pulse current Diode forward voltage Reverse recovery time Reverse recovery charge
IPP085N06L
Unit max.
Values typ.
d(on) d(off) DD=30 GS=10 D=80 G=2.3 GS=0 DS=30
2600
3500
g(th) plateau DD=30 GS=0 DD=30 D=80 GS=0
S,pulse
C=25 GS=0 F=80 j=25 R=30 F/dt =100 A/µs
0.97
figure gate charge parameter definition
Rev. 1.01
page
2006-06-13
IPB085N06L
Power dissipation tot=f(T Drain current D=f(T GS10
IPP085N06L
[°C]
[°C]
Safe operating area D=f(V DS); C=25 parameter:
limited on-state resistance
Max. transient thermal impedance thJC=f(t parameter:
thJC [K/W]
10-1
0.05 0.02
0.01
single pulse
10-1
10-2
10-5
10-4
10-3
10-2
10-1
Rev. 1.01
page
2006-06-13
IPB085N06L
Typ. output characteristics D=f(V DS); j=25 parameter:
IPP085N06L
Typ. drain-source resistance DS(on)=f(I j=25 parameter:
DS(on)
Typ. transfer characteristics D=f(V GS); DS|>2|I DS(on)max parameter:
Typ. forward transconductance fs=f(I j=25
Rev. 1.01
page
2006-06-13
IPB085N06L
Drain-source on-state resistance DS(on)=f(T D=80 GS=10 Typ. gate threshold voltage GS(th)=f(T GS=V parameter:
IPP085N06L
DS(on)
GS(th)
1250
[°C]
[°C]
Typ. capacitances =f(V DS); GS=0
Forward characteristics reverse diode F=f(V parameter:
Ciss
Coss
175°C
[pF]
25°C
Crss
10-1
Rev. 1.01
page
2006-06-13
IPB085N06L
Avalanche characteristics AS=f(t AV); GS=25 parameter: j(start)
IPP085N06L
Typ. gate charge GS=f(Q gate); D=80 pulsed parameter:
[µs]
gate [nC]
Drain-source breakdown voltage BR(DSS)=f(T
Gate charge waveforms
BR(DSS)
s(th)
(th)
gate
[°C]
Rev. 1.01
page
2006-06-13
IPB085N06L
IPP085N06L
PG-TO-263
Rev. 1.01
page
2006-06-13
IPB085N06L
PG-TO220-3: Outline
IPP085N06L
Rev. 1.01
page
2006-06-13
IPB085N06L
IPP085N06L
Published Infineon Technologies 81726 Germany Infineon Technologies 2006. Rights Reserved. Attention please! information given this data sheet shall event regarded guarantee conditions characteristics ("Beschaffenheitsgarantie"). With respect examples hints given herein, typical values stated herein and/or information regarding application device, Infineon Technologies hereby disclaims warranties liabilities kind, including without limitation warranties Information further information technology, delivery terms conditions prices please contact your nearest Infineon Technologies Office www.infineon.com Warnings technical requirements components contain dangerous substances. information types question please contact your nearest Infineon Technologies Office. Infineon Technologies Components only used life-support devices systems with express written approval Infineon Technologies, failure such components reasonably expected cause failure that life-support device system, affect safety effectiveness that device system. Life support devices systems intended implanted human body, support and/or maintain sustain and/or protect human life. they fail, reasonable assume that health user other persons endangered.
Rev. 1.01
page
2006-06-13
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