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IPP065N06L OptiMOS® Power-Transistor Features fast switching
Top Searches for this datasheetIPB065N06L IPP065N06L OptiMOS® Power-Transistor Features fast switching converters sync. rectification N-channel enhancement logic level operating temperature Avalanche rated Pb-free lead plating, RoHS compliant Product Summary DS(on),max Type IPB065N06L IPP065N06L Type IPB063N06L Package IPP063N06L Marking Package PG-TO263-3-2 P-TO263-3-2 065N06L PP-TO220-3-1 Marking PG-TO220-3-1 063N06L 065N06L 063N06L Maximum ratings, j=25 unless otherwise specified Parameter Continuous drain current Symbol Conditions C=25 °C1) C=100 Pulsed drain current Avalanche energy, single pulse Reverse diode Gate source voltage Power dissipation Operating storage temperature climatic category; 68-1 Value Unit D,pulse C=25 °C2) D=80 GS=25 D=80 DS=48 =200 A/µs, j,max=175 kV/µs C=25 55/175/56 Current limited bondwire; with thJC=0.6 chip able carry figure Rev. page 2006-05-05 IPB065N06L Parameter Symbol Conditions min. Thermal characteristics Thermal resistance, junction case version, device thJC thJA minimal footprint cooling area3) Electrical characteristics, j=25 unless otherwise specified Static characteristics Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current (BR)DSS GS=0 GS(th) DS=V D=180 DS=60 GS=0 j=25 DS=60 GS=0 j=125 Gate-source leakage current Drain-source on-state resistance DS(on) GS=20 DS=60 GS=10 D=80 GS=4.5 D=53 GS=10 D=80 version GS=4.5 D=53 version Gate resistance Transconductance DS|>2|I DS(on)max, D=80 0.01 IPP065N06L Unit max. Values typ. Device epoxy with (one layer, thick) copper area drain connection. vertical still air. Rev. page 2006-05-05 IPB065N06L Parameter Symbol Conditions min. Dynamic characteristics Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics4) Gate source charge Gate charge threshold Gate drain charge Switching charge Gate charge total Gate plateau voltage Output charge Reverse Diode Diode continous forward current Diode pulse current Diode forward voltage Reverse recovery time Reverse recovery charge IPP065N06L Unit max. Values typ. d(on) d(off) DD=30 GS=4.5V, D=80 G=1.6 GS=0 DS=30 3800 5100 1200 g(th) plateau DD=30 GS=0 DD=30 D=80 GS=0 S,pulse C=25 GS=0 F=80 j=25 R=30 F/dt =100 A/µs 0.95 figure gate charge parameter definition Rev. page 2006-05-05 IPB065N06L Power dissipation tot=f(T Drain current D=f(T GS10 IPP065N06L [°C] [°C] Safe operating area D=f(V DS); C=25 parameter: limited on-state resistance Max. transient thermal impedance thJC=f(t parameter: thJC [K/W] 0.05 0.02 0.01 single pulse 10-1 10-2 10-5 10-4 10-3 10-2 10-1 Rev. page 2006-05-05 IPB065N06L Typ. output characteristics D=f(V DS); j=25 parameter: IPP065N06L Typ. drain-source resistance DS(on)=f(I j=25 parameter: DS(on) Typ. transfer characteristics D=f(V GS); DS|>2|I DS(on)max parameter: Typ. forward transconductance fs=f(I j=25 Rev. page 2006-05-05 IPB065N06L Drain-source on-state resistance DS(on)=f(T D=80 GS=10 Typ. gate threshold voltage GS(th)=f(T GS=V parameter: IPP065N06L 1800 DS(on) GS(th) [°C] [°C] Typ. capacitances =f(V DS); GS=0 Forward characteristics reverse diode F=f(V parameter: Ciss 175°C [pF] Coss 25°C Crss 10-1 Rev. page 2006-05-05 IPB065N06L Avalanche characteristics AS=f(t AV); GS=25 parameter: j(start) IPP065N06L Typ. gate charge GS=f(Q gate); D=80 pulsed parameter: [µs] gate [nC] Drain-source breakdown voltage BR(DSS)=f(T Gate charge waveforms BR(DSS) s(th) (th) gate [°C] Rev. page 2006-05-05 IPB065N06L PG-TO220-3: Outline IPP065N06L Rev. page 2006-05-05 IPB065N06L PG-TO-263 IPP065N06L Rev. page 2006-05-05 IPB065N06L IPP065N06L Published Infineon Technologies 81726 Germany Infineon Technologies 2006. Rights Reserved. Attention please! information given this data sheet shall event regarded guarantee conditions characteristics ("Beschaffenheitsgarantie"). With respect examples hints given herein, typical values stated herein and/or information regarding application device, Infineon Technologies hereby non-infringement intellectual property rights third party. Information further information technology, delivery terms conditions prices please contact your nearest Infineon Technologies Office www.infineon.com Warnings technical requirements components contain dangerous substances. information types question please contact your nearest Infineon Technologies Office. Infineon Technologies Components only used life-support devices systems with express written approval Infineon Technologies, failure such components reasonably expected cause failure that life-support device system, affect safety effectiveness that device system. Life support devices systems intended implanted human body, support and/or maintain sustain and/or protect human life. they fail, reasonable assume that health user other persons endangered. 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