Non-Volatile SRAM MODULE 8Mbit (1,024K 8-Bit), 36Pin-DIP, Part HMN1M8D

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Non-Volatile SRAM MODULE 8Mbit (1,024K 8-Bit), 36Pin-DIP, Part HMN1M8D

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HMN1M8D
Non-Volatile SRAM MODULE 8Mbit (1,024K 8-Bit), 36Pin-DIP, Part HMN1M8D
HMN1M8D Nonvolatile SRAM 8,388,608-bit static organized 1,048,576 bytes bits. HMN1M8D self-contained lithium energy source provide reliable non-volatility coupled with unlimited write cycles standard SRAM integral control circuitry which constantly monitors single supply out-oftolerance condition. When such condition occurs, lithium energy source automatically switched sustain memory until after returns valid write protection unconditionally enabled prevent garbled data. addition SRAM unconditionally write-protected prevent inadvertent write operation. this time integral energy source switched sustain memory until after returns valid. HMN1M8D uses extremely standby current CMOS SRAM's, coupled with small lithium coin cells provide nonvolatility without long write-cycle times write-cycle limitations associated with EEPROM.
FEATURES
Access time 120, High-density design 8Mbit Design Battery internally isolated until power applied Industry-standard 36-pin 1,024K pinout Unlimited write cycles Data retention absence 10-years minimum data retention absence power Automatic write-protection during power-up/power-down cycles Data automatically protected during power loss
ASSIGNMENT
OPTIONS
Timing
MARKING
-100 -150
36-pin Encapsulated Package
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FUNCTIONAL DESCRIPTION
HMN1M8D
HMN1M8D executes read cycle whenever inactive(high) active(low). address specified address inputs(A0-A19) defines which 1,048,576 bytes data accessed. Valid data will available eight data output drivers within tACC (access time) after last address input signal stable. When power valid, HMN1M8D operates standard CMOS SRAM. During power-down power-up cycles, HMN1M8D acts nonvolatile memory, automatically protecting preserving memory contents. HMN1M8D write mode whenever signals active (low) state after address inputs stable. later occurring falling edge will determine start write cycle. write cycle terminated earlier rising edge /WE. address inputs must kept valid throughout write cycle. must return high state minimum recovery time (tWR) before another cycle initiated. control signal should kept inactive (high) during write cycles avoid contention. However, output been enabled (/CE active) then will disable outputs tODW from falling edge. HMN1M8D provides full functional capability greater than write protects 4.37 nominal. Powerdown/power-up control circuitry constantly monitors supply power-fail-detect threshold VPFD. When falls below VPFD threshold, SRAM automatically write-protects data. inputs become "don't care" outputs high impedance. falls below approximately power switching circuit connects lithium energy soure retain data. During power-up, when rises above approximately volts, power switching circuit connects external disconnects lithium energy source. Normal operation resume after exceeds volts.
BLOCK DIAGRAM
DESCRIPTION
A0-A19 Address Input
512K SRAM Block Power
A0-A18 DQ0-DQ7
Chip Enable Ground DQ0-DQ7 Data Data
Write Enable Output Enable VCC: Power (+5V) Connection
Power Fail Control Lithium Cell
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TRUTH TABLE
MODE selected Output disable Read Write OPERATION High High DOUT
HMN1M8D
POWER Standby Active Active Active
ABSOLUTE MAXIMUM RATINGS
PARAMETER voltage applied relative Voltage applied excluding relative Operating temperature Storage temperature Temperature under bias Soldering temperature SYMBOL RATING -0.3V 7.0V -0.3V 7.0V 70°C 85°C -40°C 70°C -10°C 70°C 260°C second VCC+0.3 Commercial Temp. Industrial Temp. CONDITIONS
TOPR TSTG TBIAS TSOLDER
NOTE: Permanent device damage occur Absolute Maximum Ratings exceeded. Functional operation should restricted Recommended Operating Conditions detailed this data sheet. Exposure higher than recommended voltage extended periods time could affect device reliability.
RECOMMENDED OPERATING CONDITIONS TOPR
PARAMETER Supply Voltage Ground Input high voltage Input voltage SYMBOL 4.5V -0.3 TYPICAL 5.0V 5.5V VCC+0.3V 0.8V
NOTE: Typical values indicate operation
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ELECTRICAL CHARACTERISTICS (TA= TOPR, VCCmin VCCmax
PARAMETER Input Leakage Current Output Leakage Current Output high voltage Output voltage Standby supply current Standby supply current CONDITIONS VIN=VSS /CE=VIH /OE=VIH /WE=VIL IOH=-1.0mA IOL= 2.1mA /CE=VIH VCC-0.2V, 0.2V, VCC-0.2V Min.cycle,duty=100%, Operating supply current Power-fail-detect voltage Supply switch-over voltage /CE=VIL, II/O=0 A19<VIL A19>VIH VPFD 4.30 4.37 ISB1 SYMBOL TYP.
HMN1M8D
UNIT
4.50
CAPACITANCE (TA=25 f=1MHz, VCC=5.0V)
DESCRIPTION Input Capacitance Input/Output Capacitance CONDITIONS Input voltage Output voltage SYMBOL CI/O UNIT
CHARACTERISTICS (Test Conditions)
PARAMETER Input pulse levels Input rise fall times Input output timing reference levels Output load (including scope jig) VALUE 1.5V unless otherwise specified) Figures 1and
Figure Output Load Figure Output Load DOUT 1.9K DOUT 1.9K
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READ CYCLE (TA= TOPR, VCCmin VCCmax
PARAMETER Read Cycle Time Address Access Time Chip enable access time Output enable Output valid Chip enable output Output enable output Chip disable output high Output disable output high Output hold from address change SYMBOL tACC tACE tCLZ tOLZ tCHZ tOHZ Output load Output load Output load Output load Output load Output load Output load Output load CONDITIONS -120
HMN1M8D
-150
UNIT
WRITE CYCLE (TA= TOPR, Vccmin Vccmax
PARAMETER Write Cycle Time Chip enable write Address setup time Address valid write Write pulse width Write recovery time (write cycle Write recovery time (write cycle Data valid write Data hold time (write cycle Data hold time (write cycle Write enabled output high Output active from write SYMBOL tWR1 tWR2 tDH1 tDH2 Note Note Note Note Note Note Note Note Note Note CONDITIONS -120 -150
NOTE: write ends earlier transition going high going high. write occurs during overlap allow /WE. write begins later transition going going low. Either tWR1 tWR2 must met. Either tDH1 tDH2 must met. goes simultaneously with going after going low, outputs remain highimpedance state.
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POWER-DOWN/POWER-UP CYCLE (TA= TOPR, VCC=5V)
PARAMETER slew, 4.75 4.25V slew, 4.75 slew, VPFD (max) SYMBOL Time during which SRAM Chip enable recovery time Data-retention time Absence Write-protect time tCER write-protected after passes VPFD power-up. Delay after slews down tWPT past VPFD before SRAM Write-protected. CONDITIONS TYP.
HMN1M8D
UNIT
years
TIMING WAVEFORM READ CYCLE NO.1 (Address Access)*1,2
Address tACC DOUT Previous Data Valid Data Valid
READ CYCLE NO.2 (/CE Access)*1,3,4
tACE tCLZ DOUT High-Z
tCHZ
High-Z
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READ CYCLE NO.3 (/OE Access)*1,5
Address tACC DOUT tOLZ High-Z tOHZ Data Valid
HMN1M8D
High-Z
NOTES: held high read cycle. Device continuously selected: =VIL. Address valid prior coincident with transition low. VIL. Device continuously selected:
WRITE CYCLE NO.1 (/WE-Controlled)*1,2,3
Address DOUT Data Undefined Data-in Valid High-Z tDH1 tWR1
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WRITE CYCLE NO.2 (/CE-Controlled)*1,2,3,4,5
HMN1M8D
Address DOUT Data
NOTE:
tWR2
tDH2 Data-in
Undefined
High-Z
must high during address transition. Because active (/OE low) during this period, data input signals opposite polarity outputs must applied. high, pins remain state high impedance. Either tWR1 tWR2 must met. Either tDH1 tDH2 must met.
POWER-DOWN/POWER-UP TIMING
4.75 VPFD
VPFD 4.25 tWPT tCER
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PACKAGE DIMENSION
Dimension 2.070 0.710 0.365 0.015 0.008 0.590 0.017 0.090 0.080 0.120 2.100 0.740 0.375 0.013 0.630 0.023 0.110 0.110 0.150
HMN1M8D
dimensions inches.
ODERING INFORMATION
Operating Temperature Industrial Temp. (-40~85 Blank Commercial Temp. (0~70°C) Speed options 85ns 120ns 150ns
type package Device 1,024K Nonvolatile SRAM
HANBit Memory Module
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Non-Volatile SRAM MODULE 8Mbit (1,024K 8-Bit), 36Pin-DIP, Part HMN1M8D

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