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HLB121D Triple Diffused Planar Type High Voltage Transistor
Top Searches for this datasheetSpec. HD200205 Issued Date 2002.05.01 Revised Date 2005.08.16 Page HLB121D Triple Diffused Planar Type High Voltage Transistor Description HLB121D medium power transistor designed switching applications. TO-126ML Features High breakdown voltage collector saturation voltage Fast switching speed Absolute Maximum Ratings (TA=25°C) Maximum Temperatures Storage Temperature +150 Junction Temperature +150 Maximum Power Dissipation Total Power Dissipation (TC=25°C) Maximum Voltages Currents BVCBO Collector Base Voltage. BVCEO Collector Emitter Voltage. BVEBO Emitter Base Voltage. Collector Current (DC) Collector Current (Pulse). Base Current (DC). Base Current (Pulse). Electrical Characteristics (TA=25°C) Symbol BVCBO BVCEO BVEBO ICBO ICEO IEBO *VCE(sat)1 *VCE(sat)2 *VBE(sat) *hFE1 *hFE2 Min. Typ. Max. Unit IC=100uA IC=10mA IE=10uA VCB=550V VCB=400V VEB=6V IC=50mA, IB=10mA IC=100mA, IB=20mA IC=50mA, IB=10mA VCE=10V, IC=10mA VCE=10V, IC=50mA *Pulse Test: Pulse Width 380us, Duty Cycle2% Test Conditions HLB121D HSMC Product Specification Characteristics Curve Current Gain Collector Current 100000 Spec. HD200205 Issued Date 2002.05.01 Revised Date 2005.08.16 Page Saturation Voltage Collector Current VCE(sat) IC=5IB Saturation Voltage (mV) 10000 1000 VCE=10V 1000 1000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage Collector Current 1000 Saturation Voltage (mV) VBE(sat) IC=5IB 1000 Collector Current-IC (mA) HLB121D HSMC Product Specification TO-126ML Dimension Spec. HD200205 Issued Date 2002.05.01 Revised Date 2005.08.16 Page Marking: Free Mark Pb-Free: (Note) Normal: None Date Code Control Code Note: Green label used pb-free packing Style: 1.Emitter 2.Collector 3.Base Material: Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu Pure-Tin (Pb-free) Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Min. 7.74 10.87 0.88 1.28 3.50 2.61 1.18 2.88 0.68 3.44 1.88 0.50 Max. 8.24 11.37 1.12 1.52 3.75 3.37 1.42 3.12 0.84 2.30 3.70 2.14 0.51 Typical, Unit: 3-Lead TO-126ML Plastic Package HSMC Package Code: Important Notice: rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance. Head Office Factory: Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HLB121D HSMC Product Specification Soldering Methods HSMC's Products Storage environment: Temperature=10oC~35oC Humidity=65%±15% Reflow soldering surface-mount devices Figure Temperature profile Ramp-up Tsmax Temperature Spec. HD200205 Issued Date 2002.05.01 Revised Date 2005.08.16 Page Critical Zone Tsmin Preheat Ramp-down 25oC Peak Time Profile Feature Average ramp-up rate Preheat Temperature (Tsmin) Temperature (Tsmax) Time (min max) (ts) Tsmax Ramp-up Rate Time maintained above: Temperature (TL) Time (tL) Peak Temperature (TP) Time within actual Peak Temperature (tP) Ramp-down Rate Time 25oC Peak Temperature Flow (wave) soldering (solder dipping) Products devices. Pb-Free devices. Sn-Pb Eutectic Assembly C/sec 100oC 150oC 60~120 <3oC/sec 183oC 60~150 +0/-5 10~30 <6oC/sec minutes Pb-Free Assembly <3oC/sec 150oC 200oC 60~180 <3oC/sec 217oC 60~150 260oC +0/-5oC 20~40 <6oC/sec minutes Peak temperature Dipping time 5sec ±1sec 5sec ±1sec +0/-5 HLB121D HSMC Product Specification Other recent searchesuPD750104 - uPD750104 uPD750104 Datasheet TVP5150 - TVP5150 TVP5150 Datasheet TM0RGHP - TM0RGHP TM0RGHP Datasheet NM6403 - NM6403 NM6403 Datasheet MPQF061 - MPQF061 MPQF061 Datasheet LBD1311URFUGHYS-XX - LBD1311URFUGHYS-XX LBD1311URFUGHYS-XX Datasheet RP55 - RP55 RP55 Datasheet
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