HBD437D COMPLEMENTARY SILICON POWER TRANSISTORS Description
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Spec. HD200201 Issued Date 2001.04.01 Revised Date 2005.08.16 Page
HBD437D
COMPLEMENTARY SILICON POWER TRANSISTORS
Description
HBD437D silison epitaxial-base power transistor TO-126ML plastic package, intented medium power linear switching applications. complementary type HBD438D.
Absolute Maximum Ratings (TA=25°C)
Symbol VCBO VCES VCEO VEBO Tstg Parametor Collector-Base Voltage (IE=0) Collector-Emitter Voltage (VBE=0) Collector-Emitter Voltage (IB=0) Emitter-Base Voltage (IC=0) Collector Current Collector Peak Current (t10ms) Base Current Total Dissipation Storage Temperature Max. Operating Junction Temperature TC=25°C TA=25°C Value
TO-126ML Unit
Thermal Data
Rthj-case Rthj-amb Thermal Resistance Junction-case Thermal Resistance Junction-ambient Max. Max. °C/W °C/W
Electrical Characteristics (TA=25°C, unless otherwise specified)
Symbol ICBO ICES IEBO *VCEO(sus) *VCE(sat) *VBE Parameter Collector Cut-off Current (IE=0) Collector Cut-off Current (VBE=0) Emitter Cut-off Current (IC=0) Collector-Emitter Sustaining Voltage Collector-Emitter Saturation Voltage Base-Emitter Voltage Test Conditions VCB=45V VCE=45V VEB=5V IC=100mA, IB=0 IC=2A, IB=0.2A IC=10mA,VCE=5V IC=2A, VCE=1V IC=10mA, VCE=5V *hFE *hFE1/hFE2 Current Gain Matched Pair Transition Frequency IC=0.5A, VCE=1V IC=2A, VCE=1V IC=0.5A, VCE=1V IC=0.25A, VCE=1V Min. Typ. 0.58 Max. Unit
*Pulse Test: Pulse Width 380us, Duty Cycle2%
HBD437D HSMC Product Specification
Characteristics Curve
Current Gain Collector Current
1000 1000
Spec. HD200201 Issued Date 2001.04.01 Revised Date 2005.08.16 Page
Current Gain Collector Current
VCE=1V
VCE=5V
1000 10000
1000
10000
Collector Current (mA)
Collector Current (mA)
Saturation Voltage Collector Current
1000 VCE(s IC=10IB
10000
Voltage Collector Current
VBE(on) VCE=1V
Saturation Voltage (mV)
Voltage (mV)
1000
1000 10000
1000 10000
Collector Current (mA)
Collector Current (mA)
Safe Operating Area
Collector Current-IC
0.01
100ms
Forward Voltage-VCE
HBD437D
HSMC Product Specification
TO-126ML Dimension
Spec. HD200201 Issued Date 2001.04.01 Revised Date 2005.08.16 Page
Marking:
Free Mark
Pb-Free: (Note) Normal: None
Date Code Control Code
Note: Green label used pb-free packing Style: 1.Emitter 2.Collector 3.Base Material: Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu Pure-Tin (Pb-free) Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Min. 7.74 10.87 0.88 1.28 3.50 2.61 1.18 2.88 0.68 3.44 1.88 0.50
Max. 8.24 11.37 1.12 1.52 3.75 3.37 1.42 3.12 0.84 2.30 3.70 2.14 0.51
Typical, Unit:
3-Lead TO-126ML Plastic Package HSMC Package Code:
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HBD437D
HSMC Product Specification
Soldering Methods HSMC's Products
Storage environment: Temperature=10oC~35oC Humidity=65%±15% Reflow soldering surface-mount devices Figure Temperature profile
Ramp-up Tsmax Temperature
Spec. HD200201 Issued Date 2001.04.01 Revised Date 2005.08.16 Page
Critical Zone
Tsmin Preheat
Ramp-down
25oC Peak Time
Profile Feature Average ramp-up rate Preheat Temperature (Tsmin) Temperature (Tsmax) Time (min max) (ts) Tsmax Ramp-up Rate Time maintained above: Temperature (TL) Time (tL) Peak Temperature (TP) Time within actual Peak Temperature (tP) Ramp-down Rate Time 25oC Peak Temperature Flow (wave) soldering (solder dipping) Products devices. Pb-Free devices.
Sn-Pb Eutectic Assembly C/sec 100oC 150oC 60~120 <3oC/sec 183oC 60~150 +0/-5 10~30 <6oC/sec minutes
Pb-Free Assembly <3oC/sec 150oC 200oC 60~180 <3oC/sec 217oC 60~150 260oC +0/-5oC 20~40 <6oC/sec minutes
Peak temperature
Dipping time 5sec ±1sec 5sec ±1sec
+0/-5
HBD437D
HSMC Product Specification
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