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HBC517 EPITAXIAL PLANAR TRANSISTOR Description General
Top Searches for this datasheetSpec. HA200217 Issued Date 2002.09.01 Revised Date 2005.02.04 Page HBC517 EPITAXIAL PLANAR TRANSISTOR Description General Purpose High Darlington Transistor Absolute Maximum Ratings TO-92 Maximum Temperatures Storage Temperature +150 Junction Temperature +150 Maximum Maximum Power Dissipation Total Power Dissipation (TA=25°C) Maximum Voltages Currents (TA=25°C) VCBO Collector Base Voltage VCEO Collector Emitter Voltage VEBO Emitter Base Voltage Collector Current Electrical Characteristics (TA=25°C) Characteristic Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage Emitter-Base Breakdown Voltage Collector Cut-off Current Emitter Cut-off Current Current Gain Collector-Emitter Saturation Voltage Base-Emitter Saturation Voltage Current Gain Bandwidth Product Collector Output Capacitance Symbol V(BR)CBO V(BR)CEO V(BR)EBO ICBO IEBO VCE(sat) VBE(sat) Test Condition IC=0.1mA, IE=0 IC=10mA, IB=0 IE=1mA, IC=0 VCB=40V, IE=0 VEB=10V, IC=0 IC=100mA, VCE=2V IC=100mA, IB=1mA IC=100mA, IB=1mA IC=100mA, VCE=2V, f=100MHz VCB=10V, f=1MHz, IE=0 Min. Typ. Max. Unit *Pulse Test: Pulse Width 380us, Duty Cycle2% HBC517 HSMC Product Specification Characteristics Curve Current Gain Collector Current 100000 VCE=2V Spec. HA200217 Issued Date 2002.09.01 Revised Date 2005.02.04 Page Saturation Voltage Collector Current 1000 VCE(sat) IC=100IB Saturation Voltage (mV) 10000 1000 1000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage Collector Current 10000 VBE(sat) IC=100IB Voltage Collector Current 10000 VBE(on) VCE=2V Saturation Voltage (mV) 1000 Voltage (mV) 1000 1000 Collector Current-IC (mA) Collector Current-IC (mA) PD(W), Power Dissipation Ambient Temperature-Ta HBC517 HSMC Product Specification TO-92 Dimension Spec. HA200217 Issued Date 2002.09.01 Revised Date 2005.02.04 Page Marking: Free Mark Pb-Free: (Note) Normal: None Control Code Date Code Note: Green label used pb-free packing Style: 1.Collector 2.Base 3.Emitter Material: Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu Pure-Tin (Pb-free) Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Min. 4.33 4.33 12.70 0.36 3.36 0.36 Max. 4.83 4.83 0.56 *1.27 3.76 0.56 *2.54 *1.27 Typical, Unit: 3-Lead TO-92 Plastic Package HSMC Package Code: TO-92 Taping Dimension F1,F2 Min. 4.33 3.80 0.36 4.33 2.40 15.50 8.50 2.50 12.50 5.95 50.30 0.36 17.50 5.00 Max. 4.83 4.20 0.53 4.83 2.90 16.50 9.50 12.90 6.75 51.30 0.55 1.42 0.68 19.00 7.00 Unit: F1F2 Important Notice: rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance. Head Office Factory: Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HBC517 HSMC Product Specification Soldering Methods HSMC's Products Storage environment: Temperature=10oC~35oC Humidity=65%±15% Reflow soldering surface-mount devices Figure Temperature profile Ramp-up Tsmax Temperature Spec. HA200217 Issued Date 2002.09.01 Revised Date 2005.02.04 Page Critical Zone Tsmin Preheat Ramp-down 25oC Peak Time Profile Feature Average ramp-up rate Preheat Temperature (Tsmin) Temperature (Tsmax) Time (min max) (ts) Tsmax Ramp-up Rate Time maintained above: Temperature (TL) Time (tL) Peak Temperature (TP) Time within actual Peak Temperature (tP) Ramp-down Rate Time 25oC Peak Temperature Flow (wave) soldering (solder dipping) Products devices. Pb-Free devices. Sn-Pb Eutectic Assembly C/sec 100oC 150oC 60~120 <3oC/sec 183oC 60~150 +0/-5 10~30 <6oC/sec minutes Pb-Free Assembly <3oC/sec 150oC 200oC 60~180 <3oC/sec 217oC 60~150 260oC +0/-5oC 20~40 <6oC/sec minutes Peak temperature Dipping time 5sec ±1sec 5sec ±1sec +0/-5 HBC517 HSMC Product Specification Other recent searchesZM2BBCRBG45S-A - ZM2BBCRBG45S-A ZM2BBCRBG45S-A Datasheet WT-3401 - WT-3401 WT-3401 Datasheet SSM5N15FE - SSM5N15FE SSM5N15FE Datasheet SRF1620 - SRF1620 SRF1620 Datasheet SRF1660 - SRF1660 SRF1660 Datasheet RN4911 - RN4911 RN4911 Datasheet MSM9005-XX - MSM9005-XX MSM9005-XX Datasheet MA114 - MA114 MA114 Datasheet AOD407 - AOD407 AOD407 Datasheet AOD407L - AOD407L AOD407L Datasheet 2SC5661 - 2SC5661 2SC5661 Datasheet 2SC4725 - 2SC4725 2SC4725 Datasheet 2SC4082 - 2SC4082 2SC4082 Datasheet 2SC3837K - 2SC3837K 2SC3837K Datasheet
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