REJ03G0478-0200 Rev.2.00 Nov.19.2004 on-resistance leakage curren

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REJ03G0478-0200 Rev.2.00 Nov.19.2004 on-resistance leakage curren

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H5N2519P
REJ03G0478-0200 Rev.2.00 Nov.19.2004
on-resistance leakage current High speed switching
Outline
TO-3P
Gate Drain (Flange) Source
Absolute Maximum Ratings
25°C)
Item Drain Source voltage Gate Source voltage Drain current Drain peak current Body-Drain diode reverse Drain current Avalanche current Avalanche energy Channel dissipation Channel case thermal impedance Channel temperature Storage temperature Notes: duty cycle Value 25°C STch 25°C, 150°C Symbol VDSS VGSS (pulse) Note3 EARNote3 Note2 ch-c Tstg
Note1
Ratings 30.2 0.833 +150
Unit °C/W
Rev.2.00 Nov. 2004 page
H5N2519P
Electrical Characteristics
25°C)
Item Drain Source breakdown voltage Zero Gate voltage drain current Gate Source leak current Gate Source cutoff voltage Forward transfer admittance Static Drain Source state resistance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total Gate charge Gate Source charge Gate Drain charge Body-Drain diode forward voltage Body-Drain diode reverse recovery time Body-Drain diode reverse recovery charge Notes: Pulse test Symbol V(BR)DSS IDSS IGSS VGS(off) |yfs| RDS(on) Ciss Coss Crss td(on) td(off) 0.029 4900 1.10 ±0.1 0.035 1.65 Unit Test conditions 32.5 Note4 32.5 VNote4 32.5 Note4 diF/dt A/µs
Rev.2.00 Nov. 2004 page
H5N2519P
Main Characteristics
Power Temperature Derating
1000
Maximum Safe Operation Area
Channel Dissipation
Drain Current
Operation this area limited RDS(on)
(°C) Case Temperature 25°C 1000 Drain Source Voltage Typical Transfer Characteristics
Typical Output Characteristics Pulse Test
Pulse Test
Drain Source Voltage
Drain Current
Drain Current
75°C
25°C -25°C
Gate Source Voltage
Drain Source Saturation Voltage Gate Source Voltage
Drain Source Saturation Voltage VDS(on)
Pulse Test
32.5
Drain Source State Resistance RDS(on)
Static Drain Source State Resistance Drain Current Pulse Test
0.05
0.02
0.01 Gate Source Voltage Drain Current
Rev.2.00 Nov. 2004 page
H5N2519P
Static Drain Source State Resistance Temperature 0.100 Pulse Test 0.080 Forward Transfer Admittance Drain Current
Forward Transfer Admittance |yfs|
Static Drain Source State Resistance RDS(on)
75°C Pulse Test 25°C -25°C
0.060 32.5 0.040
0.020
Case Temperature (°C) Body-Drain Diode Reverse Recovery Time
Drain Current
Typical Capacitance Drain Source Voltage
10000 5000
1000
Reverse Recovery Time (ns)
Ciss
Capacitance (pF)
2000 1000
Coss
Crss
25°C Reverse Drain Current Dynamic Input Characteristics
Drain Source Voltage
10000
Switching Characteristics duty d(off)
Gate Source Voltage
Switching Time (ns)
Drain Source Voltage
1000
d(on)
Gate Charge (nC)
Drain Current
Rev.2.00 Nov. 2004 page
H5N2519P
Reverse Drain Current Source Drain Voltage Gate Source Cutoff Voltage Case Temperature
Gate Source Cutoff Voltage GS(off)
Reverse Drain Current
Pulse Test
Source Drain Voltage
Case Temperature (°C)
Normalized Transient Thermal Impedance Pulse Width
Normalized Transient Thermal Impedance
25°C
0.05
c(t) 0.833°C/W, 25°C
0.03
0.02
0.01
Pulse Width
Switching Time Test Circuit Monitor D.U.T. Vout Vout Monitor
Waveform
td(off)
td(on)
Rev.2.00 Nov. 2004 page
H5N2519P
Package Dimensions
January, 2003
15.6
Unit:
14.9
19.9
18.0
5.45
5.45
Package Code JEDEC JEITA Mass (reference value) TO-3P Conforms
Ordering Information
Part Name H5N2519P-E Quantity Plastic magazine Shipping Container
Note: some grades, production terminated. Please contact Renesas sales office check state production before ordering product.
Rev.2.00 Nov. 2004 page
Sales Strategic Planning Div.
Keep safety first your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Renesas Technology Corp. puts maximum effort into making semiconductor products better more reliable, there always possibility that trouble occur with them. Trouble with semiconductors lead personal injury, fire property damage. Remember give consideration safety when making your circuit designs, with appropriate measures such placement substitutive, auxiliary circuits, (ii) nonflammable material (iii) prevention against malfunction mishap. Notes regarding these materials These materials intended reference assist customers selection Renesas Technology Corp. product best suited customer's application; they convey license under intellectual property rights, other rights, belonging Renesas Technology Corp. third party. Renesas Technology Corp. assumes responsibility damage, infringement third-party's rights, originating product data, diagrams, charts, programs, algorithms, circuit application examples contained these materials. information contained these materials, including product data, diagrams, charts, programs algorithms represents information products time publication these materials, subject change Renesas Technology Corp. without notice product improvements other reasons. therefore recommended that customers contact Renesas Technology Corp. authorized Renesas Technology Corp. product distributor latest product information before purchasing product listed herein. information described here contain technical inaccuracies typographical errors. Renesas Technology Corp. assumes responsibility damage, liability, other loss rising from these inaccuracies errors. Please also attention information published Renesas Technology Corp. various means, including Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). When using information contained these materials, including product data, diagrams, charts, programs, algorithms, please sure evaluate information total system before making final decision applicability information products. Renesas Technology Corp. assumes responsibility damage, liability other loss resulting from information contained herein. Renesas Technology Corp. semiconductors designed manufactured device system that used under circumstances which human life potentially stake. Please contact Renesas Technology Corp. authorized Renesas Technology Corp. product distributor when considering product contained herein specific purposes, such apparatus systems transportation, vehicular, medical, aerospace, nuclear, undersea repeater use. prior written approval Renesas Technology Corp. necessary reprint reproduce whole part these materials. these products technologies subject Japanese export control restrictions, they must exported under license from Japanese government cannot imported into country other than approved destination. diversion reexport contrary export control laws regulations Japan and/or country destination prohibited. Please contact Renesas Technology Corp. further details these materials products contained therein.
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REJ03G0478-0200 Rev.2.00 Nov.19.2004 on-resistance leakage curren

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