Turn Around) functionality allows zero wait Read-Write-Read utilizatio

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Turn Around) functionality allows zero wait Read-Write-Read utilizatio

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119, Commercial Temp Industrial Temp Features
Turn Around) functionality allows zero wait Read-Write-Read utilization; fully pin-compatible with both pipelined flow through NtRAMTM, NoBLand ZBTSRAMs +10%/-10% core power supply supply User-configurable Pipeline Flow Through mode mode user-selectable high/low output drive IEEE 1149.1 JTAG-compatible Boundary Scan Linear Interleave Burst mode Pin-compatible with 2Mb, 4Mb, 8Mb, 16Mb devices Byte write operation (9-bit Bytes) chip enable signals easy depth expansion automatic power-down JEDEC-standard 119-, 165- 209-Bump package Pb-Free packages available
36Mb Pipelined Flow Through Synchronous SRAM
MHz-133
Because synchronous device, address, data inputs, read/write control inputs captured rising edge input clock. Burst order control (LBO) must tied power rail proper operation. Asynchronous inputs include Sleep mode enable (ZZ) Output Enable. Output Enable used override synchronous control output drivers turn RAM's output drivers time. Write cycles internally self-timed initiated rising edge clock input. This feature eliminates complex offchip write pulse generation required asynchronous SRAMs simplifies input signal timing. GS8322ZV18/36/72 configured user operate Pipeline Flow Through mode. Operating pipelined synchronous device, addition rising-edgetriggered registers that capture input signals, device incorporates rising edge triggered output register. read cycles, pipelined SRAM output data temporarily stored edge-triggered output register during access cycle then released output drivers next rising edge clock. GS8322ZV18/36/72 implemented with GSI's high performance CMOS technology available JEDECstandard 119-bump, 165-bump 209-bump package.
Functional Description
GS8322ZV18/36/72 36Mbit Synchronous Static SRAM. GSI's SRAMs, like ZBT, NtRAM, NoBL other pipelined read/double late write flow through read/ single late write SRAMs, allow utilization available bandwidth eliminating need insert deselect cycles when device switched from read write cycles.
Parameter Synopsis
tKQ(x18/x36) tKQ(x72) tCycle Curr (x18) Curr (x36) Curr (x72) tCycle Curr (x18) Curr (x36) Curr (x72) -250 -225 -200 -166 -150 -133 Unit
Pipeline 3-1-1-1
Flow Through 2-1-1-1
Rev: 1.03a 2/2006
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GS8322ZV72C Out-209-Bump BGA-Top View (Package
DQPG DQPD DQPC DQPH VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ DQPF DQPA DQPB DQPE
Bump BGA-14 Body-1 Bump Pitch
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GS8322ZV72 209-Bump Description Symbol
BC,BD BG,BH
Type
Description
Address field LSBs Address Counter Preset Inputs Address Inputs
Data Input Output pins
Byte Write Enable DQA, I/Os; active Byte Write Enable DQC, I/Os; active Byte Write Enable DQE, DQF, DQG, I/Os; active Connect Clock Input Signal; active high Chip Enable; active Chip Enable; active Chip Enable; active high Output Enable; active Burst address counter advance enable Sleep Mode control; active high Flow Through Pipeline mode; active Linear Burst Order mode; active Must Connect High Must Connect High Must Connect Write Enable; active FLXDrive Output Impedance Control Impedance [High Drive], High High Impedance [Low Drive] Clock Enable; active
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GS8322ZV72 209-Bump Description Symbol
VDDQ
Type
Description
Scan Test Mode Select Scan Test Data Scan Test Data Scan Test Clock Core power supply Core Ground Output driver power supply
Rev: 1.03a 2/2006
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GS8322ZV36B Out-119-Bump BGA-Top View (Package
VDDQ VDDQ VDDQ VDDQ VDDQ DQPC DQPD DQPB DQPA VDDQ VDDQ VDDQ VDDQ VDDQ
Bump BGA-14 Body-1.27 Bump Pitch
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GS8322ZV18B Out-119-Bump BGA-Top View (Package
VDDQ VDDQ VDDQ VDDQ VDDQ DQPB DQPA VDDQ VDDQ VDDQ VDDQ VDDQ
Bump BGA-14 Body-1.27 Bump Pitch
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GS8322ZV18/36 119-Bump Description Symbol
VDDQ
Type
Description
Address field LSBs Address Counter Preset Inputs Address Inputs Data Input Output pins Byte Write Enable DQA, DQB, DQC, I/Os; active Connect Clock Input Signal; active high Clock Enable; active Write Enable; active Chip Enable; active Chip Enable; active Chip Enable; active high Output Enable; active Burst address counter advance enable Sleep mode control; active high Flow Through Pipeline mode; active Linear Burst Order mode; active FLXDrive Output Impedance Control Impedance [High Drive], High High Impedance [Low Drive]) Scan Test Mode Select Scan Test Data Scan Test Data Scan Test Clock Core power supply Core Ground Output driver power supply
BPR1999.05.18
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Bump BGA-x18 Common I/O-Top View (Package
DQPB VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ DQPA
Bump BGA-15 Body-1.0 Bump Pitch
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Bump BGA-x36 Common I/O-Top View (Package
DQPC DQPD VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ DQPB DQPA
Bump BGA-15 Body-1.0 Bump Pitch
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GS8322ZV18/36E 165-Bump Description Symbol
VDDQ
Type
Description
Address field LSBs Address Counter Preset Inputs Address Inputs Address Input Data Input Output pins Byte Write Enable DQA, DQB, DQC, I/Os; active Connect Clock Input Signal; active high Clock Enable; active Write Enable; active Chip Enable; active Chip Enable; active Chip Enable; active high Flow Through Pipeline Mode Control Output Enable; active Burst address counter advance enable; active high FLXDrive Output Impedance Control Impedance [High Drive], High High Impedance [Low Drive]) Sleep mode control; active high Linear Burst Order mode; active Scan Test Mode Select Scan Test Data Scan Test Data Scan Test Clock Must Connect High Core power supply Core Ground Output driver power supply
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Functional Details
Clocking Deassertion Clock Enable (CKE) input blocks Clock input from reaching RAM's internal circuits. used suspend operations. Failure observe Clock Enable set-up hold requirements will result erratic operation. Pipeline Mode Read Write Operations inputs (with exception Output Enable, Linear Burst Order Sleep) synchronized rising clock edges. Single cycle read write operations must initiated with Advance/Load (ADV) held low, order load address. Device activation accomplished asserting three Chip Enable inputs (E1, E3). Deassertion Enable inputs will deactivate device. Function Read Write Byte Write Byte Write Byte Write Byte Write Bytes Write Abort/NOP
Read operation initiated when following conditions satisfied rising edge clock: asserted low, three chip enables (E1, active, write enable input signals deasserted high, asserted low. address presented address inputs latched into address register presented memory core control logic. control logic determines that read access progress allows requested data propagate input output register. next rising edge clock read data allowed propagate through output register onto output pins. Write operation occurs when selected, active, Write input sampled rising edge clock. Byte Write Enable inputs (BA, determine which bytes will written. none activated. write cycle with Byte Write inputs active no-op cycle. pipelined SRAM provides double late write functionality, matching write command versus data pipeline length cycles) read command versus data pipeline length cycles). first rising edge clock, Enable, Write, Byte Write(s), Address registered. Data associated with that address required third rising edge clock. Flow Through Mode Read Write Operations Operation Flow Through mode very similar operations Pipeline mode. Activation Read Cycle Burst Address Counter identical. Flow Through mode device begin driving data immediately after address clocked into RAM, rather than holding data until following (second) clock edge. Therefore, Flow Through mode read pipeline cycle shorter than Pipeline mode. Write operations initiated same way, differ that write pipeline cycle shorter well, preserving ability turn from reads writes without inserting dead cycles. While pipelined RAMs implement double late write protocol Flow Through mode single late write protocol mode observed. Therefore, Flow Through mode, address control registered first rising edge clock data required data input pins second rising edge clock.
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Synchronous Truth Table Operation
Read Cycle, Begin Burst Read Cycle, Continue Burst NOP/Read, Begin Burst Dummy Read, Continue Burst Write Cycle, Begin Burst Write Cycle, Continue Burst Write Abort, Continue Burst Deselect Cycle, Power Down Deselect Cycle, Power Down Deselect Cycle, Power Down Deselect Cycle Deselect Cycle, Continue Sleep Mode Clock Edge Ignore, Stall
Type Address
External Next External Next External Next Next None None None None None None Current
High-Z High-Z
Notes
1,10 1,2,10 1,3,10
High-Z 1,2,3,10 High-Z High-Z High-Z High-Z High-Z High-Z
Notes: Continue Burst cycles, whether read write, same control inputs. Deselect continue cycle only entered into Deselect cycle executed first. Dummy Read Write abort considered NOPs because SRAM performs operation. Write abort occurs when sampled Byte Write pins active write operation performed. wired minimize number control signals provided SRAM. Output drivers will automatically turn during write cycles. High occurs during pipelined read cycle, will remain active (Low High occurs during write cycle, will remain High Don't Care; Logic High; Logic Low; High Byte Write signals high; more Byte/Write signals inputs, except must meet setup hold times rising clock edge. Wait states inserted setting high. This device contains circuitry that ensures outputs High during power-up. 2-bit burst counter incorporated. address counter incriminated Burst continue cycles.
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Pipelined Flow Through Read Write Control State Diagram
Deselect
Read
Write
Burst Read
Burst Write
Input Command Code
Notes
Hold command (CKE Low) shown because prevents state change.
Transition
Current State Next State (n+1)
represent input command codes indicated Synchronous Truth Table.
Clock (CK)
Command
Current State
Next State
Current State Next State Definition Pipelined Flow through Read/Write Control State Diagram
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Pipeline Mode Data State Diagram
Intermediate
High (Data
Intermediate Intermediate Intermediate
Data Valid)
Intermediate
High
Intermediate
Input Command Code
Notes
Hold command (CKE Low) shown because prevents state change.
Transition
Current State
Transition Next State (n+2)
Intermediate State (N+1)
represent input command codes indicated Truth Tables.
Clock (CK)
Command
Current State
Intermediate State
Next State
Current State Next State Definition Pipeline Mode Data State Diagram
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Flow Through Mode Data State Diagram
High (Data
Data Valid)
High
Input Command Code
Notes
Hold command (CKE Low) shown because prevents state change.
Transition
Current State Next State (n+1)
represent input command codes indicated Truth Tables.
Clock (CK)
Command
Current State
Next State
Current State Next State Definition for: Pipeline Flow Through Read Write Control State Diagram
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Burst Cycles Although RAMs designed sustain 100% bandwidth eliminating turnaround cycle when there transition from read write, multiple back-to-back reads writes also performed. SRAMs provide on-chip burst address generator that utilized, desired, further simplify burst read write implementations. control pin, when driven high, commands SRAM advance internal address counter counter generated address read write SRAM. starting address first cycle burst cycle series loaded into SRAM driving low, into Load mode. Burst Order burst address counter wraps around initial state after four addresses (the loaded address three more) have been accessed. burst sequence determined state Linear Burst Order (LBO). When this Low, linear burst sequence selected. When installed with tied high, Interleaved burst sequence selected. tables below details. FLXDriveThe allows selection between nominal drive strength low) multi-drop applications drive strength floating high) point-to-point applications. Output Driver Characteristics chart details.
Mode Functions Mode Name
Burst Order Control Output Register Control Power Down Control FLXDrive Output Impedance Control
Name
State
Function
Linear Burst Interleaved Burst Flow Through Pipeline Active Standby, High Drive (Low Impedance) Drive (High Impedance)
Note: There pull-up devices pins pull-down devices pin, those input pins unconnected chip will operate default states specified above tables. Burst Counter Sequences
Linear Burst Sequence Table A[1:0] A[1:0] A[1:0] A[1:0]
address address address address
Interleaved Burst Sequence Table A[1:0] A[1:0] A[1:0] A[1:0]
address address address address
Note: burst counter wraps initial state clock.
Note: burst counter wraps initial state clock.
1999.05.18
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Sleep Mode During normal operation, must pulled low, either user internal pull down resistor. When pulled high, SRAM will enter Power Sleep mode after cycles. this time, internal state SRAM preserved. When returns low, SRAM operates normally after cycles wake time. Sleep mode current, power-down mode which device deselected current reduced ISB2. duration Sleep mode dictated length time High state. After entering Sleep mode, inputs except become disabled outputs High-Z asynchronous, active high input that causes device enter Sleep mode. When driven high, ISB2 guaranteed after time tZZI met. Because asynchronous input, pending operations operations progress properly completed asserted. Therefore, Sleep mode must initiated until valid pending operations completed. Similarly, when exiting Sleep mode during tZZR, only Deselect Read commands applied while SRAM recovering from Sleep mode.
Sleep Mode Timing Diagram
tZZR tZZS tZZH
Designing Compatibility SRAMs offer users configurable selection between Flow Through mode Pipeline mode signal. vendors offer this option, however most mark VDDQ pipelined parts flow through parts. SRAMs fully compatible with these sockets. Other vendors mark Connect (NC). RAMs have internal pull-up device floating will result pipelined operation. part being replaced pipelined mode part, fully compatible with these sockets. unlikely event part being replaced Flow Through device, will need pulled correct operation.
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Absolute Maximum Ratings
(All voltages reference VSS)
Symbol
VDDQ VI/O IOUT TSTG TBIAS
Note:
Description
Voltage Pins Voltage VDDQ Pins Voltage Pins Voltage Other Input Pins Input Current Output Current Package Power Dissipation Storage Temperature Temperature Under Bias
Value
-0.5 -0.5 -0.5 VDDQ +0.5 max.) -0.5 +0.5 max.) +/-20 +/-20
Unit
Permanent damage device occur Absolute Maximum Ratings exceeded. Operation should restricted Recommended Operating Conditions. Exposure conditions exceeding Absolute Maximum Ratings, extended period time, affect reliability this component.
Power Supply Voltage Ranges Parameter
Supply Voltage VDDQ Supply Voltage
Symbol
VDDQ
Min.
Typ.
Max.
Unit
Notes
Notes: part numbers Industrial Temperature Range versions character "I". Unless otherwise noted, performance specifications quoted evaluated worst case temperature range marked device. Input Under/overshoot voltage must VDDn+2 exceed maximum, with pulse width exceed tKC.
Recommended Operating Temperatures Parameter
Ambient Temperature (Commercial Range Versions) Ambient Temperature (Industrial Range Versions)
Symbol
Min.
Typ.
Max.
Unit
Notes
Notes: part numbers Industrial Temperature Range versions character "I". Unless otherwise noted, performance specifications quoted evaluated worst case temperature range marked device. Input Under/overshoot voltage must VDDn+2 exceed maximum, with pulse width exceed tKC.
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Logic Levels Parameter
Input High Voltage Input Voltage VDDQ Input High Voltage VDDQ Input Voltage
Symbol
VIHQ VILQ
Min.
0.6*VDD -0.3 0.6*VDD -0.3
Typ.
Max.
0.3*VDD VDDQ 0.3*VDD
Unit
Notes
Notes: part numbers Industrial Temperature Range versions character "I". Unless otherwise noted, performance specifications quoted evaluated worst case temperature range marked device. Input Under/overshoot voltage must VDDn+2 exceed maximum, with pulse width exceed tKC. VIHQ (max) voltage VDDQ pins plus
Undershoot Measurement Timing
Overshoot Measurement Timing
Capacitance
25oC, MHZ,
Parameter
Input Capacitance Input/Output Capacitance Note: These parameters sample tested.
Symbol
CI/O
Test conditions
VOUT
Typ.
Max.
Unit
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Test Conditions Parameter
Input high level Input level Input slew rate Input reference level Output reference level Output load
Conditions
V/ns VDD/2 VDDQ/2 Fig.
Notes: Include scope capacitance. Test conditions specified with output loading shown Fig. unless otherwise noted. Device deselected defined Truth Table.
Output Load VDDQ/2 Distributed Test Capacitance 30pF*
Electrical Characteristics Parameter
Input Leakage Current (except mode pins) Input Current SCD, Input Current Output Leakage Current Output High Voltage Output Voltage
Symbol
IIN1 IIN2 VOH1 VOL1
Test Conditions
Output Disable, VOUT VDDQ
-100 VDDQ
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Operating Currents
-250 Mode Symbol 70°C 85°C Unit
-225 70°C 85°C 85°C 85°C 85°C 85°C 70°C 70°C 70°C 70°C
-200
-166
-150
-133
Rev: 1.03a 2/2006 Pipeline (x72) Flow Through Pipeline (x36) Flow Through Pipeline (x18) Flow Through Pipeline Flow Through Pipeline Flow Through IDDQ IDDQ IDDQ IDDQ IDDQ IDDQ
Parameter
Test Conditions
Operating Current
Device Selected; other inputs Output open
21/39
Standby Current
Specifications cited subject change without notice. latest documentation http://www.gsitechnology.com.
Deselect Current
Device Deselected; other inputs
Notes: IDDQ apply combination VDD3, VDD2, VDDQ3, VDDQ2 operation. parameters listed worst case scenario.
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Electrical Characteristics
Parameter Clock Cycle Time Clock Output Valid (x18/x36) Pipeline Clock Output Valid (x72) Clock Output Invalid Clock Output Low-Z Setup time Clock Cycle Time Clock Output Valid Flow Through Clock Output Invalid Clock Output Low-Z Setup time Hold time Clock HIGH Time Clock Time Clock Output High-Z (x18/x36) Clock Output High-Z (x72) Output Valid (x18/x36) Output Valid (x72) output Low-Z output High-Z (x18/x36) output High-Z (x72) setup time hold time recovery Symbol tKQX tLZ1 tKQX tLZ1 tHZ1 -250 -225 -200 -166 -150 -133 Unit
tHZ1 tOLZ1 tOHZ1 tOHZ1 tZZS2 tZZH2 tZZR
Notes: These parameters sampled 100% tested. asynchronous signal. However, order recognized given clock cycle, must meet specified setup hold times specified above.
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Pipeline Mode Timing (NBT)
Write Read Suspend Read Write writeno-op Read Deselect
Q(B) Q(C) D(D) Q(E) tKQX
D(A)
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Flow Through Mode Timing (NBT)
Write Write Write
Read
Cont
Read
Write
Read
Write
A0-An
D(A) D(B)
D(B+1) Q(C)
tKQX
Q(D)
D(E) Q(F)
tKQX
D(G)
tOLZ tOHZ
*Note: High(False)
JTAG Port Operation
Overview JTAG Port this operates manner that compliant with IEEE Standard 1149.1-1990, serial boundary scan interface standard (commonly referred JTAG). JTAG Port input interface levels scale with VDD. JTAG output drivers powered VDDQ. Disabling JTAG Port possible this device without utilizing JTAG port. port reset power-up will remain inactive unless clocked. TCK, TDI, designed with internal pull-up circuits.To assure normal operation with JTAG Port unused, TCK, TDI, left floating tied either VSS. should left unconnected.
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JTAG Descriptions
Name
Test Clock Test Mode Select
Description
Clocks events. inputs captured rising edge outputs propagate from falling edge TCK. input sampled rising edge TCK. This command input controller state machine. undriven input will produce same result logic input level. input sampled rising edge TCK. This input side serial registers placed between TDO. register placed between determined state Controller state machine instruction that currently loaded Instruction Register (refer Controller State Diagram). undriven will produce same result logic input level.
Test Data
Test Data
Output that active depending state state machine. Output changes response falling edge TCK. This output side serial registers placed between TDO.
Note: This device does have TRST (TAP Reset) pin. TRST optional IEEE 1149.1. Test-Logic-Reset state entered while held high five rising edges TCK. Controller also reset automaticly power-up.
JTAG Port Registers
Overview various JTAG registers, refered Test Access Port orTAP Registers, selected (one time) sequences applied strobed. Each Registers serial shift register that captures serial input data rising edge pushes serial data next falling edge TCK. When register selected, placed between pins. Instruction Register Instruction Register holds instructions that executed controller when moved into Run, Test/Idle, various data register states. Instructions bits long. Instruction Register loaded when placed between pins. Instruction Register automatically preloaded with IDCODE instruction power-up whenever controller placed Test-Logic-Reset state. Bypass Register Bypass Register single register that placed between TDO. allows serial test data passed through RAM's JTAG Port another device scan chain with little delay possible. Boundary Scan Register Boundary Scan Register collection flip flops that preset logic level found RAM's input pins. flip flops then daisy chained together levels found shifted serially JTAG Port's pin. Boundary Scan Register also includes number place holder flip flops (always logic relationship between device pins bits Boundary Scan Register described Scan Order Table following. Boundary Scan Register, under control Controller, loaded with contents RAMs ring when controller Capture-DR state then placed between pins when controller moved Shift-DR state. SAMPLE-Z, SAMPLE/PRELOAD EXTEST instructions used activate Boundary Scan Register.
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JTAG Block Diagram
Boundary Scan Register
Bypass Register
Instruction Register Code Register
Control Signals Test Access Port (TAP) Controller
Identification (ID) Register Register 32-bit register that loaded with device vendor specific 32-bit code when controller Capture-DR state with IDCODE command loaded Instruction Register. code loaded from 32-bit on-chip ROM. describes various attributes indicated below. register then placed between pins when controller moved into Shift-DR state. register first reach when shifting begins.
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Register Contents
Revision Code Technology JEDEC Vendor Code Presence Register
Used
Configuration
Controller Instruction
Overview There classes instructions defined Standard 1149.1-1990; standard (Public) instructions, device specific (Private) instructions. Some Public instructions mandatory 1149.1 compliance. Optional Public instructions must implemented prescribed ways. this device used monitor input pads, used load address, data control signals into preload buffers. When controller placed Capture-IR state least significant bits instruction register loaded with When controller moved Shift-IR state Instruction Register placed between TDO. this state desired instruction serially loaded through input (while previous contents shifted TDO). instructions, executes newly loaded instructions only when controller moved Update-IR state. instruction this device listed following table.
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JTAG Controller State Diagram
Test Logic Reset
Test Idle
Select
Select
Capture
Capture
Shift
Shift
Exit1
Exit1
Pause
Pause
Exit2
Exit2
Update
Update
Instruction Descriptions BYPASS When BYPASS instruction loaded Instruction Register Bypass Register placed between TDO. This occurs when controller moved Shift-DR state. This allows board level scan path shortened facilitate testing other devices scan path. SAMPLE/PRELOAD SAMPLE/PRELOAD Standard 1149.1 mandatory public instruction. When SAMPLE PRELOAD instruction loaded Instruction Register, moving controller into Capture-DR state loads data RAMs input buffers into Boundary Scan Register. Boundary Scan Register locations associated with input pin, loaded with default state identified Boundary Scan Chain table this section datasheet. Because clock independent from Clock (TCK) possible attempt capture ring contents while input buffers transition (i.e. metastable state). Although allowing sample metastable inputs will harm device, repeatable results cannot expected. input signals must stabilized long enough meet TAPs input data capture set-up plus hold time (tTS plus tTH). RAMs clock inputs need paused other operation except capturing ring contents into Boundary Scan Register. Moving controller Shift-DR state then places boundary scan register between pins. EXTEST EXTEST IEEE 1149.1 mandatory public instruction. executed whenever instruction register loaded with logic EXTEST command does block override RAM's input pins; therefore, RAM's internal state still determined input pins.
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Typically, Boundary Scan Register loaded with desired pattern data with SAMPLE/PRELOAD command. Then EXTEST command used output Boundary Scan Register's contents, parallel, RAM's data output drivers falling edge when controller Update-IR state. Alternately, Boundary Scan Register loaded parallel using EXTEST command. When EXTEST instruction selected, sate RAM's input pins, well default values Scan Register locations associated with pin, transferred parallel into Boundary Scan Register rising edge Capture-DR state, RAM's output pins drive value Boundary Scan Register location with which each output associated. IDCODE IDCODE instruction causes loaded into register when controller Capture-DR mode places register between pins Shift-DR mode. IDCODE instruction default instruction loaded power time controller placed Test-Logic-Reset state. SAMPLE-Z SAMPLE-Z instruction loaded instruction register, outputs forced inactive drive state (highZ) Boundary Scan Register connected between when controller moved Shift-DR state. These instructions Reserved Future Use. this device they replicate BYPASS instruction.
JTAG Instruction Summary Instruction
EXTEST IDCODE SAMPLE-Z SAMPLE/ PRELOAD BYPASS
Code
Description
Places Boundary Scan Register between TDO. Preloads Register places between TDO. Captures ring contents. Places Boundary Scan Register between TDO. Forces output drivers High-Z. this instruction; Reserved Future Use. Replicates BYPASS instruction. Places Bypass Register between TDO. Captures ring contents. Places Boundary Scan Register between TDO. private instruction. this instruction; Reserved Future Use. Replicates BYPASS instruction. Places Bypass Register between TDO. Places Bypass Register between TDO.
Notes
Notes: Instruction codes expressed binary, left, right. Default instruction automatically loaded power-up test-logic-reset state.
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JTAG Port Recommended Operating Conditions Characteristics Parameter
Test Port Input High Voltage Test Port Input Voltage TMS, Input Leakage Current TMS, Input Leakage Current Output Leakage Current Test Port Output High Voltage Test Port Output Voltage Test Port Output CMOS High Test Port Output CMOS
Symbol
VIHJ VILJ IINHJ IINLJ IOLJ VOHJ VOLJ VOHJC VOLJC
Min.
-0.3 -300 VDDQ
Max.
+0.3
Unit Notes
Notes: Input Under/overshoot voltage must VDDn exceed maximum, with pulse width exceed tTKC. VILJ VDDn VILJn Output Disable, VOUT VDDn output driver served VDDQ supply. IOHJ IOLJ IOHJC -100 IOHJC +100
JTAG Port Test Conditions Parameter
Input high level Input level Input slew rate Input reference level Output reference level
Conditions
V/ns VDDQ/2 VDDQ/2
JTAG Port Test Load
VDDQ/2
Distributed Test Capacitance
30pF*
Notes: Include scope capacitance. Test conditions shown unless otherwise noted.
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JTAG Port Timing Diagram
tTKC tTKQ Parallel SRAM input
tTKH
tTKL
JTAG Port Electrical Characteristics
Parameter Cycle Time Valid High Pulse Width Pulse Width Time Hold Time Symbol tTKC tTKQ tTKH tTKL Unit
Boundary Scan (BSDL Files) information regarding Boundary Scan Chain, obtain BSDL files this part, please contact Applications Engineering Department apps@gsitechnology.com.
Rev: 1.03a 2/2006
31/39
2002, Technology
Specifications cited subject change without notice. latest documentation http://www.gsitechnology.com.
Package Drawing (Package
Body, Bump Pitch, Bump Array
Side View
Bottom View
Symbol 13.9 0.40 0.50 0.31 21.9 0.50 0.60 0.36 22.0 18.0 (BSC) 14.0 10.0 (BSC) 1.00 (BSC) 0.15 14.1 1.70 0.60 0.70 0.38 22.1 Units Rev: 1.03a 2/2006 32/39
2002, Technology
Specifications cited subject change without notice. latest documentation http://www.gsitechnology.com.
Package Dimensions-165-Bump FPBGA (Package Variation
VIEW
BOTTOM
VIEW
17±0.05
14.0
10.0
0.53 0.35
0.20
0.20(4x)
15±0.05
0.36
Rev: 1.03a 2/2006
0.36~0.46 1.40 MAX.
SEATING PLANE
33/39
2002, Technology
Specifications cited subject change without notice. latest documentation http://www.gsitechnology.com.
Package Dimensions-119-Bump FPBGA (Package Variation
VIEW
BOTTOM VIEW (119x)
22±0.10
1.27 7.62 0.15 0.20(4x) 14±0.10
0.50~0.70 1.86.±0.13
SEATING PLANE
20.32
1.27
1999.05.18
Rev: 1.03a 2/2006
34/39
2002, Technology
Specifications cited subject change without notice. latest documentation http://www.gsitechnology.com.
Ordering Information Synchronous Burst RAMs
512K 512K 512K 512K 512K
Part Number1
GS8322ZV18B-250 GS8322ZV18B-225 GS8322ZV18B-200 GS8322ZV18B-166 GS8322ZV18B-150 GS8322ZV18B-133 GS8322ZV18E-250 GS8322ZV18E-225 GS8322ZV18E-200 GS8322ZV18E-166 GS8322ZV18E-150 GS8322ZV18E-133 GS8322ZV36B-250 GS8322ZV36B-225 GS8322ZV36B-200 GS8322ZV36B-166 GS8322ZV36B-150 GS8322ZV36B-133 GS8322ZV36E-250 GS8322ZV36E-225 GS8322ZV36E-200 GS8322ZV36E-166 GS8322ZV36E-150 GS8322ZV36E-133 GS8322ZV72C-250 GS8322ZV72C-225 GS8322ZV72C-200 GS8322ZV72C-166 GS8322ZV72C-150
Type
Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through
Package
(var. (var. (var. (var. (var. (var. (var. (var. (var. (var. (var. (var. (var. (var. (var. (var. (var. (var. (var. (var. (var. (var. (var. (var.
Speed2 (MHz/ns)
250/6.5 225/7 200/7.5 166/8 150/8.5 133/8.5 250/6.5 225/7 200/7.5 166/8 150/8.5 133/8.5 250/6.5 225/7 200/7.5 166/8 150/8.5 133/8.5 250/6.5 225/7 200/7.5 166/8 150/8.5 133/8.5 250/6.5 225/7 200/7.5 166/8 150/8.5
512K GS8322ZV72C-133 Pipeline/Flow Through 133/8.5 Notes: Customers requiring delivery Tape Reel should character part number. Example: GS8322ZV18B-150IB. speed column indicates cycle frequency (MHz) device Pipeline mode latency (ns) Flow Through mode. Each device Pipeline/Flow Through mode-selectable user. Commercial Temperature Range. Industrial Temperature Range. offers other versions this type device many different configurations with variety different features, only some which covered this data sheet. Technology site (www.gsitechnology.com) complete listing current offerings.
Rev: 1.03a 2/2006
35/39
2002, Technology
Specifications cited subject change without notice. latest documentation http://www.gsitechnology.com.
Ordering Information Synchronous Burst RAMs (Cont.)
512K 512K 512K 512K 512K 512K
Part Number1
GS8322ZV18B-250I GS8322ZV18B-225I GS8322ZV18B-200I GS8322ZV18B-166I GS8322ZV18B-150I GS8322ZV18B-133I GS8322ZV18E-250I GS8322ZV18E-225I GS8322ZV18E-200I GS8322ZV18E-166I GS8322ZV18E-150I GS8322ZV18E-133I GS8322ZV36B-250I GS8322ZV36B-225I GS8322ZV36B-200I GS8322ZV36B-166I GS8322ZV36B-150I GS8322ZV36B-133I GS8322ZV36E-250I GS8322ZV36E-225I GS8322ZV36E-200I GS8322ZV36E-166I GS8322ZV36E-150I GS8322ZV36E-133I GS8322ZV72C-250I GS8322ZV72C-225I GS8322ZV72C-200I GS8322ZV72C-166I GS8322ZV72C-150I GS8322ZV72C-133I
Type
Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through
Package
(var. (var. (var. (var. (var. (var. (var. (var. (var. (var. (var. (var. (var. (var. (var. (var. (var. (var. (var. (var. (var. (var. (var. (var.
Speed2 (MHz/ns)
250/6.5 225/7 200/7.5 166/8 150/8.5 133/8.5 250/6.5 225/7 200/7.5 166/8 150/8.5 133/8.5 250/6.5 225/7 200/7.5 166/8 150/8.5 133/8.5 250/6.5 225/7 200/7.5 166/8 150/8.5 133/8.5 250/6.5 225/7 200/7.5 166/8 150/8.5 133/8.5
GS8322ZV18GB-250 Pipeline/Flow Through Pb-free (var. 250/6.5 Notes: Customers requiring delivery Tape Reel should character part number. Example: GS8322ZV18B-150IB. speed column indicates cycle frequency (MHz) device Pipeline mode latency (ns) Flow Through mode. Each device Pipeline/Flow Through mode-selectable user. Commercial Temperature Range. Industrial Temperature Range. offers other versions this type device many different configurations with variety different features, only some which covered this data sheet. Technology site (www.gsitechnology.com) complete listing current offerings.
Rev: 1.03a 2/2006
36/39
2002, Technology
Specifications cited subject change without notice. latest documentation http://www.gsitechnology.com.
Ordering Information Synchronous Burst RAMs (Cont.)
512K 512K 512K 512K 512K 512K
Part Number1
GS8322ZV18GB-225 GS8322ZV18GB-200 GS8322ZV18GB-166 GS8322ZV18GB-150 GS8322ZV18GB-133 GS8322ZV18GE-250 GS8322ZV18GE-225 GS8322ZV18GE-200 GS8322ZV18GE-166 GS8322ZV18GE-150 GS8322ZV18GE-133 GS8322ZV36GB-250 GS8322ZV36GB-225 GS8322ZV36GB-200 GS8322ZV36GB-166 GS8322ZV36GB-150 GS8322ZV36GB-133 GS8322ZV36GE-250 GS8322ZV36GE-225 GS8322ZV36GE-200 GS8322ZV36GE-166 GS8322ZV36GE-150 GS8322ZV36GE-133 GS8322ZV72GC-250 GS8322ZV72GC-225 GS8322ZV72GC-200 GS8322ZV72GC-166 GS8322ZV72GC-150 GS8322ZV72GC-133 GS8322ZV18GB-250I
Type
Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through
Package
Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free Pb-free Pb-free Pb-free Pb-free Pb-free Pb-free (var.
Speed2 (MHz/ns)
225/7 200/7.5 166/8 150/8.5 133/8.5 250/6.5 225/7 200/7.5 166/8 150/8.5 133/8.5 250/6.5 225/7 200/7.5 166/8 150/8.5 133/8.5 250/6.5 225/7 200/7.5 166/8 150/8.5 133/8.5 250/6.5 225/7 200/7.5 166/8 150/8.5 133/8.5 250/6.5
GS8322ZV18GB-225I Pipeline/Flow Through Pb-free (var. 225/7 Notes: Customers requiring delivery Tape Reel should character part number. Example: GS8322ZV18B-150IB. speed column indicates cycle frequency (MHz) device Pipeline mode latency (ns) Flow Through mode. Each device Pipeline/Flow Through mode-selectable user. Commercial Temperature Range. Industrial Temperature Range. offers other versions this type device many different configurations with variety different features, only some which covered this data sheet. Technology site (www.gsitechnology.com) complete listing current offerings.
Rev: 1.03a 2/2006
37/39
2002, Technology
Specifications cited subject change without notice. latest documentation http://www.gsitechnology.com.
Ordering Information Synchronous Burst RAMs (Cont.)
512K 512K 512K 512K 512K
Part Number1
GS8322ZV18GB-200I GS8322ZV18GB-166I GS8322ZV18GB-150I GS8322ZV18GB-133I GS8322ZV18GE-250I GS8322ZV18GE-225I GS8322ZV18GE-200I GS8322ZV18GE-166I GS8322ZV18GE-150I GS8322ZV18GE-133I GS8322ZV36GB-250I GS8322ZV36GB-225I GS8322ZV36GB-200I GS8322ZV36GB-166I GS8322ZV36GB-150I GS8322ZV36GB-133I GS8322ZV36GE-250I GS8322ZV36GE-225I GS8322ZV36GE-200I GS8322ZV36GE-166I GS8322ZV36GE-150I GS8322ZV36GE-133I GS8322ZV72GC-250I GS8322ZV72GC-225I GS8322ZV72GC-200I GS8322ZV72GC-166I GS8322ZV72GC-150I
Type
Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through
Package
Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free (var. Pb-free Pb-free Pb-free Pb-free Pb-free
Speed2 (MHz/ns)
200/7.5 166/8 150/8.5 133/8.5 250/6.5 225/7 200/7.5 166/8 150/8.5 133/8.5 250/6.5 225/7 200/7.5 166/8 150/8.5 133/8.5 250/6.5 225/7 200/7.5 166/8 150/8.5 133/8.5 250/6.5 225/7 200/7.5 166/8 150/8.5
512K GS8322ZV72GC-133I Pipeline/Flow Through Pb-free 133/8.5 Notes: Customers requiring delivery Tape Reel should character part number. Example: GS8322ZV18B-150IB. speed column indicates cycle frequency (MHz) device Pipeline mode latency (ns) Flow Through mode. Each device Pipeline/Flow Through mode-selectable user. Commercial Temperature Range. Industrial Temperature Range. offers other versions this type device many different configurations with variety different features, only some which covered this data sheet. Technology site (www.gsitechnology.com) complete listing current offerings.
Rev: 1.03a 2/2006
38/39
2002, Technology
Specifications cited subject change without notice. latest documentation http://www.gsitechnology.com.
36Mb Sync SRAM Datasheet Revision History DS/DateRev. Code: Old;
8322ZV18_r1 8322ZVxx_r1; 8322ZVxx_r1_01 8322ZVxx_r1_01; 8322ZVxx_r1_02 8322ZVxx_r1_02; 8322ZVxx_r1_03 Content Content/Format Content
Types Changes Page;Revisions;Reason Format Content
Creation datasheet Removed erroneous overbars from address pins pinout Corrected thickness package Updated format Updated mechanicals Pb-free information added (r1.03a) Corrected incorrect voltage title
Rev: 1.03a 2/2006
39/39
2002, Technology
Specifications cited subject change without notice. latest documentation http://www.gsitechnology.com.

Turn Around) functionality allows zero wait Read-Write-Read utilizatio

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