6-20 General Purpose Amplifier Description Avago's AMMP-5618 high
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AMMP-5618
6-20 General Purpose Amplifier
Description Avago's AMMP-5618 high power, medium gain amplifier that operates from GHz. amplifier designed easy-to-use component surface mount application. communication systems, used buffer, transmit driver amplifier. During typical operation with single supply, each gain stage biased Class-A operation optimal power output with minimal distortion. amplifier integrated match, blocking, self-bias choke eliminate complex tuning assembly processes typically required hybrid (discrete-FET) amplifiers. package fully compatible with backside grounding simplify assembly. Note: These devices sensitive. following precautions strongly recommended. Ensure that approved carrier used when dice transported from destination another. Personal grounding worn times when handling these devices.
Features surface mount package Broad band performance 6-20 High output power Medium typical gain input output match Single (107 supply bias
Applications Microwave radio systems Satellite VSAT, up/down link LMDS Pt-Pt long haul Broadband wireless access (including 802.16 802.20 WiMax) MMDS loops Commercial grade military
Absolute Maximum Ratings
Symbol
Tstg Tmax
Parameters/Conditions
Positive Drain Voltage Drain Current Input Power Operating Channel Temperature Storage Case Temperature
Units
Min.
Max.
+150
RFin
RFout
+150 +300
Max. Assembly Temp max)
Note: Operation excess these conditions result permanent damage this device.
Attention: Observe precautions handling electrostatic sensitive devices.
Machine Model (Class Human Body Model (Class Refer Avago Application Note A004R: Electrostatic Discharge Damage Control.
AMMP-5618 Specifications/Physical Properties[1]
Symbol
ch-b
Parameters Test Conditions
Drain Supply Current (under power drive temperature) (Vd=5.0V) Thermal Resistance[2] (Backside temperature,
25°C)
Units
°C/W
Min.
Typ.
Max.
Notes: Ambient operational temperature 25°C unless otherwise noted. Channel-to-backside Thermal Resistance (Tchannel (Tc) 34°C) measured using infrared microscopy. Thermal Resistance backside temperature (Tb) 25°C calculated from measured data.
Specifications[3,4,6] 25°C, 5.0V, Id(Q)= Symbol
Gain P-1dB OIP3 RLin RLout Isol
Parameters Test Conditions
Small-signal Gain Noise Figure into Output Power Gain Compression Third Order Intercept Point; MHz; Input Return Loss Output Return Loss Reverse Isolation
Units
Typ.
Sigma
Notes: Small/Large -signal data measured fully de-embedded test fixture form 25°C. Pre-assembly into package performance verified 100% on-wafer AMMC-5618 published specifications This final package part performance verified functional test correlated actual performance more frequencies Specifications derived from measurements test environment. Aspects amplifier performance improved over more narrow bandwidth application additional conjugate, linearity, noise (opt) matching.
AMMP-5618 Typical Performance 25°C, unless otherwise stated)
Note: These measurements test environment. Aspects amplifier performance improved over narrower bandwidth application additional conjugate, linearity noise (opt) matching.
(dB) (dB) (dB)
FREQUENCY (GHz) FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Gain.
Figure Isolation.
Figure Input Return Loss.
(dB)
(dB) OP-1dB (dBm)
FREQUENCY (GHz)
FREQUENCY (GHz)
OP1dB OIP3
FREQUENCY (GHz)
Figure Output Return Loss.
Figure Noise Figure.
Figure Typical Power, OP-1dB OIP3.
25°C -40°C +85°C
(dB)
25°C -40°C +85°C
(dB)
(dB)
25°C -40°C +85°C
FREQUENCY (GHz) FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Gain Over Temperature.
Figure Isolation Over Temperature.
Figure Input Over Temperature.
AMMP-5618 Typical Performance 25°C, unless otherwise stated)
Note: These measurements test environment. Aspects amplifier performance improved over narrower bandwidth application additional conjugate, linearity noise (opt) matching.
25°C -40°C +85°C 25°C -40°C +85°C
(dB)
(dB)
(mA)
25°C -40°C +85°C
FREQUENCY (GHz) FREQUENCY (GHz)
Figure Output Return Loss Over Temperature.
Figure Over Temperature.
Figure Bias Current Over Temperature.
(dB)
(dB)
(dB)
FREQUENCY (GHz)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Gain Over Vdd.
Figure Isolation Over Vdd.
Figure Input Over Vdd.
OP-1dB (dBm)
(dB)
OIP3 (dBm)
FREQUENCY (GHz) FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Output Return Loss Over Vdd.
Figure Output Power Over Vdd.
Figure OIP3 Over Vdd.
AMMP-5618 Typical Scattering Parameters[1] 25°C,
Freq.
10.0 10.5 11.0 11.5 12.0 12.5 13.0 13.5 14.0 14.5 15.0 15.5 16.0 16.5 17.0 17.5 18.0 18.5 19.0 19.5 20.0 20.5 21.0 21.5 22.0 22.5 23.0 23.5 24.0 24.5 25.0
-2.995 -3.432 -4.250 -4.096 -4.325 -4.797 -6.417 -11.055 -18.578 -23.802 -25.186 -27.287 -27.021 -24.540 -23.582 -23.477 -24.304 -22.475 -19.215 -16.258 -14.234 -13.024 -12.514 -12.482 -12.919 -13.636 -13.993 -13.835 -13.000 -12.524 -12.067 -11.963 -12.862 -12.547 -11.062 -10.610 -10.469 -10.018 -9.997 -10.136 -9.631 -7.870 -5.619 -4.449 -4.155 -4.196 -4.530
0.708 0.674 0.613 0.624 0.608 0.576 0.478 0.280 0.118 0.065 0.055 0.043 0.045 0.059 0.066 0.067 0.061 0.075 0.109 0.154 0.194 0.223 0.237 0.238 0.226 0.208 0.200 0.203 0.224 0.236 0.222 0.200 0.181 0.187 0.225 0.272 0.300 0.316 0.316 0.311 0.330 0.404 0.524 0.599 0.620 0.617 0.594
Phase
70.854 7.524 -59.292 -112.628 -174.493 121.652 52.449 -16.473 -62.704 -78.360 -114.355 176.586 89.220 16.508 -43.865 -104.344 -175.038 107.849 44.619 -5.409 -51.554 -95.001 -138.454 177.883 132.024 87.229 38.470 -5.903 -52.805 -103.865 -152.985 153.118 93.198 28.065 -33.067 -88.132 -138.271 173.388 122.816 65.257 -1.277 -59.633 -127.317 171.791 119.140 71.146 23.384
-22.696 -16.093 -4.538 -1.726 0.287 5.870 10.805 13.764 14.224 14.468 14.500 14.416 14.509 14.512 14.512 14.523 14.491 14.473 14.479 14.388 14.419 14.367 14.328 14.202 14.147 13.972 14.029 13.739 13.725 13.966 14.024 14.002 14.148 14.132 14.210 14.091 13.858 13.623 13.398 13.019 12.886 12.504 11.738 10.831 9.293 8.021 6.897
0.073 0.157 0.593 0.461 0.394 1.131 3.164 4.712 5.385 5.475 5.495 5.506 5.501 5.503 5.503 5.510 5.490 5.479 5.482 5.425 5.382 5.350 5.326 5.249 5.216 5.054 4.971 4.920 4.969 5.109 5.143 5.130 5.217 5.207 5.254 5.183 5.046 4.911 4.785 4.797 4.724 4.219 3.863 3.480 2.915 2.518 2.212
Phase
45.614 62.385 -0.007 -157.105 -52.399 -107.307 -175.227 108.456 38.847 -23.228 -75.874 -127.412 -176.352 134.523 87.924 41.684 -3.914 -48.272 -93.057 -137.014 179.443 136.208 92.923 50.240 6.926 -35.308 -77.276 -118.133 -158.923 158.580 115.249 72.656 29.105 -14.187 -58.599 -104.365 -149.000 165.396 122.433 77.749 29.934 -13.003 -63.650 -112.183 -157.885 159.348 116.230
-58.670 -49.826 -43.091 -36.349 -39.160 -42.543 -50.015 -46.815 -42.183 -40.719 -39.954 -39.602 -39.264 -39.039 -38.938 -38.808 -38.711 -38.711 -38.700 -38.773 -38.489 -38.221 -38.071 -37.739 -37.252 -37.903 -37.680 -38.692 -39.424 -38.107 -37.443 -37.604 -37.848 -38.170 -38.384 -39.112 -39.698 -40.748 -42.165 -43.928 -45.145 -49.217 -47.596 -53.021 -51.322 -46.344 -45.149
0.001 0.003 0.007 0.015 0.011 0.007 0.003 0.005 0.008 0.009 0.010 0.010 0.011 0.011 0.011 0.011 0.012 0.012 0.012 0.012 0.012 0.012 0.012 0.013 0.014 0.013 0.013 0.012 0.011 0.012 0.013 0.013 0.013 0.012 0.012 0.011 0.010 0.009 0.008 0.006 0.006 0.003 0.004 0.002 0.003 0.005 0.006
Phase
91.028 -30.565 172.431 -48.599 -129.213 166.320 130.192 155.918 114.699 69.159 27.235 -12.197 -50.735 -88.381 -124.530 -160.536 163.632 128.550 92.021 61.222 26.022 -8.975 -43.893 -78.798 -114.505 -153.055 172.112 133.007 104.224 82.267 37.833 0.928 -35.629 -72.292 -109.537 -147.597 176.777 139.612 102.558 74.095 49.307 -1.915 -40.229 -136.023 114.374 21.965 -35.249
-0.537 -0.694 -1.503 -3.848 -4.217 -5.052 -6.475 -8.555 -10.393 -12.156 -14.372 -17.196 -18.937 -17.986 -16.383 -15.281 -14.875 -15.430 -16.520 -18.494 -20.529 -22.659 -24.039 -24.607 -24.958 -26.020 -25.949 -25.799 -23.027 -21.872 -21.936 -22.039 -22.843 -24.452 -24.014 -20.632 -16.990 -13.793 -11.540 -9.819 -8.659 -7.188 -7.034 -7.133 -7.517 -8.346 -9.765
0.940 0.923 0.841 0.642 0.615 0.559 0.475 0.373 0.302 0.247 0.191 0.138 0.113 0.126 0.152 0.172 0.180 0.169 0.149 0.119 0.094 0.074 0.063 0.059 0.057 0.050 0.050 0.051 0.071 0.081 0.080 0.079 0.072 0.060 0.063 0.093 0.141 0.204 0.265 0.323 0.369 0.437 0.445 0.440 0.421 0.383 0.325
Phase
118.786 56.844 -77.196 -20.982 -101.456 -168.104 130.723 79.201 36.021 -7.111 -54.746 -111.340 -179.767 115.789 65.272 25.081 -11.906 -47.630 -83.772 -122.670 -163.935 150.698 107.199 69.051 37.568 10.165 -2.864 -10.215 -27.632 -63.932 -90.189 -122.785 -163.441 144.595 83.275 30.364 -10.504 -47.217 -83.538 -119.330 -153.160 166.236 131.591 97.415 61.706 22.766 -21.448
Note: Data obtained from fixture de-embedded package edge.
Input Reference Plane Input Reference Plane s-parameters s-parameters
Output Reference OutputReference Plane Plane s-parameters s-parameters. (View from package bottom)
Biasing Operation AMMC-5618 normally biased with single positive drain supply connected both pins through bypass capacitors shown Figure recommended supply voltage important have bypass capacitor, capacitor should placed close component possible.
AMMC-5618 does require negative gate voltage bias stages. ground wires needed because ground connections made with plated through-holes backside package. Refer Absolute Maximum Ratings table allowed thermal conditions.
Figure Demonstration Board (available upon request).
(Typ
RFin
RFout
BASE
Figure Typical Application.
Feedback Network
Feedback Network
Matching
Input
Matching
Matching
Output
Figure Simplified MMIC Schematic.
AMMP XXXX YWWDNN
Recommended Attachment AMMP Packaged Devices compatible with high volume surface mount assembly processes. material mounting pattern, defined data sheet, optimizes performance strongly recommended. electronic drawing land pattern available upon request from Avago Sales Application Engineering. Manual Assembly Follow precautions while handling packages. Handling should along edges with tweezers. Recommended attachment conductive solder paste. Please recommended solder reflow profile. Conductive epoxy recommended. Hand soldering recommended. Apply solder paste using stencil printer placement. volume solder paste will dependent component layout should controlled ensure consistent mechanical electrical performance. Follow solder paste vendor's recommendations when developing solder reflow profile. standard profile will have steady ramp from room temperature pre-heat temperature avoid damage thermal shock. Packages have been qualified withstand peak temperature 260° seconds. Verify that profile will expose device beyond these limits.
Front View
Symbol 0.198 (5.03) 0.0685 (1.74)
Side View
0.213 (5.4) 0.088 (2.25)
0.011 [0.28] 0.018 [0.46]
0.114 [2.9] 0.014 [0.365] 0.016 [0.40]
0.126 [3.2]
0.059 [1.5] 0.100 [2.54]
0.012 [0.30] 0.028 [0.70]
0.029 [0.75] 0.100 [2.54] 0.016 [0.40] 0.093 [2.36]
Back View
Dimensional tolerance back view: 0.002" [0.05 Notes: Indicates Dimensions inches [millimeters] Grounds must soldered Ground
Figure Outline Drawing.
.093 [2.36] .010 [0.25] .011 [0.28] .016 [0.40] .0095 [0.24]
.016 [0.40] .126 [3.20] .059 [1.50] .020 [0.50] .012 [0.3]
.018 [0.46] .018 [0.46] .114 [2.90]
.0095 [0.24]
Figure Suggested Material Land Pattern.
Solder Reflow Profile most commonly used solder reflow method accomplished belt furnace using convection heat transfer. suggested reflow profile automated reflow processes shown Figure This profile designed ensure reliable finished joints. However, profile indicated Figure will vary among different solder pastes from different manufacturers shown here reference only.
Stencil Design Guidelines properly designed solder screen stencil required ensure optimum amount solder paste deposited onto pads. recommended stencil layout shown Figure stencil solder paste deposition opening approximately pad. Reducing stencil opening potentially generate more voids underneath. other hand, stencil openings larger than 100% will
lead excessive solder paste smear bridging across pads. Considering fact that solder paste thickness will directly affect quality solder joint, good choice laser stencil composed 0.127 mils) thick stainless steel which capable producing required fine stencil outline. combined stencil layout shown Figure
Peak Melting point 218°C
Temp (°C)
Ramp Preheat Ramp Reflow Cooling
Seconds
Figure Suggested Lead-Free Reflow Profile SnAgCu Solder Paste.
0.40
0.70
0.60 0.67
0.46
0.60 1.60 0.9550
3.20 1.80 0.40 0.36 0.30 0.36 0.40
0.95 0.36 1.80
0.36 0.27
0.27
0.36 0.40 R0.14
1.60 2.90 Stencil Opening
Figure Stencil Outline Drawing (mm).
Figure Combined Stencil Layouts (mm).
Part Number Ordering Information
Part Number AMMP-5618-BLK AMMP-5618-TR1 AMMP-5618-TR2 Devices Container Container antistatic Reel Reel
Device Orientation (Top View)
Carrier Tape Pocket Dimensions
product information complete list distributors, please site:
www.avagotech.com
Avago, Avago Technologies, logo trademarks Avago Technologies, Limited United States other countries. Data subject change. Copyright 2006 Avago Technologies, Limited. rights reserved. Obsoletes 5989-3210EN 5989-3545EN April 2006
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