High Image Rejection Filter Band splitbandreplacement. Microcap b

The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers.

High Image Rejection Filter Band splitbandreplacement. Microcap b

Datasheet Thumbnail

Top Searches for this datasheet

ACPF-7003
High Image Rejection Filter Band
splitbandreplacement. Microcap bonded-wafer chip scale packaging technology. This process allows ultra small filters assembled into Molded Chip Board (MCOB) Module.
Features
High rejection from single filter with switches required Truesplitbandreplacement Passband:1850-1910MHz 35dBminAttenuation,1930-1990MHz 2.5dBTypicalInsertionLoss 25dBimagerejectionat1830MHz Spacesavingsolution -1.0mm(Max)
Applications USPCSbandhandsets WirelessDataterminals path. Avago Technologies' thin-Film Bulk Acoustic Resonator
Electrical Specifications, Zo=50 +25° Symbol DS21 S11,S22 Pinmax Parameters Passband[1850.6-1909.4] InsertionLoss1850.6-1855 InsertionLoss1855-1905MHz InsertionLoss1905-1909.4 Ripple,1850-1910MHz MinRejection,1930.6-1990 MinRejection10-1715MHz MinRejection1715-1785 MinRejection1785-1830 MinRejection1990-2500 MinRejection2500-3820 MinRejection3820-5730 In-bandreturnloss SafeInputPowerLevel Units -30° +85°
Absolute Maximum Ratings[2] Parameter Operatingtemperature[1] Storagetemperature[1] Unit Value -30to+85 -40to+125
Notes: damagetothedevice.
Typical Performance Ohms)
Figure Attenuation (dB) frequency
Figure Insertion Loss (dB) frequency
Figure Attenuation (dB) frequency (broadband)
Figure Return Loss (dB) frequency
Figure S(1,1)
Figure S(2,2)
Interface Mounting instructions (Pin3)andtwogrounds(Pins2and4.) thefiltermountingpadsontop.
Layer1 (signal) Getek ML00D (=.9) Getek ML00D =.9) Layer (ground) Getek ML00D (=.) Getek ML00D Layer (signal) Getek material ML00D RG00D Figure Board stack description
Demo boards
mils mils mils mils
Figure Footprint
Figure Closer look recommended board footprint soldermask
SIDE VIEW
Shaded Region Grounded
Marking
Figure Detailed Bottom, Side view Package (dimensions
LAYER layer
This region Soldermask covering ground
Dimension
Region exposed ground soldering filter pads
LAYER (GROUND layer)
Metal voided decrease Capacitance Input Port
Metal voided decrease Capacitance output Port
Figure Suggested layers
Alloy type
Sn42Bi58 Sn43Pb43Bi14 Sn63Pb37 Sn60Pb40 Sn91/Zn9 Sn96.2Ag2.5Cu0.8Sb0.5
Temperature,
Melting temperature (oC)
144-163
Recommended working temperature (oC)
160-180 165-185 200-240 200-240 200-240 235-255
Alloy type
Sn95.8Ag3.5Cu0.7 Sn96.5Ag3.5 Sn100 Sn95Sb5 Sn97Cu3
Melting temperature (oC)
Recommended working temperature (oC)
235-255 240-260 260-280 260-280 260-300
Tested profile shown.
Time, seconds Figure Recommended solder profile
0.0± 0.0()
.00± 0.0(1)
.0()
+0.10 -0.00
MIN.
.0(8)
1.90(8)
USER DIRECTION UNREELING
NOTE: MEASURED FROM CENTRELINE SPROCKET HOLE CENTRELINE POCKET HOLE FROM CENTRELINE SPROCKET HOLE CENTERLINE POCKET CUMULATIVE TOLERANCE SPROCKET HOELS THIS THICKNESS APPLICABLE MEASURED EDGE TAPE. MATERIAL: BLACK POLYSTYRENE DIMENSIONS ALLOWABLE CAMBER LENGTH UNLESS OTHERWISE SPECIFIED TOLERANCE 0.10. MEASUREMENT POINT FROM BOTTOM POCKET. SURFACE RESISITIVTY FROM 1.0X10 1.0x10 OHMS/SQ Figure Carrier tape drawing
8.0±
0.0(1)
Figure Reel drawing
REEL
Notes: Cover tape material clear polyester film coated
CARRIER TAPE
USER FEED DIRECTION
COVER TAPE
Figure Tape reel orientation
Position Empty Pocket/Cavity Leader Pocket Trailer Pocket Location WORK WEEK DATE CODE NUMBER
User Feed Direction
View
View Figure Device orientation carrier tape
Ordering Information ACPF-7003-BLK=Bulkoption, 100piecesperantistaticbag 3000piecesper7-inchreel
product information complete list distributors, please site: www.avagotech.com Avago, Avago Technologies, logo trademarks Avago Technologies, Pte. United States other countries. Data subject change. Copyright 2006 Avago Technologies Pte. rights reserved. 5989-3923EN April 2006

High Image Rejection Filter Band splitbandreplacement. Microcap b

Top Searches for this datasheet

Other recent searches