GaAs High Linearity Package Avago Technologies' AMMP-6222 easy-to

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AMMP-6222
GaAs High Linearity Package
Avago Technologies' AMMP-6222 easy-to-use broadband, high gain, high linearity Noise Amplifier surface mount package. wide band unconditionally stable performance makes this MMIC ideal primary sub-sequential noise block transmitter driver. MMIC gain stages selectable switch between high current, corresponding with high output power linearity. high current, high output power state, requires 120mA supply. current, output power state, supply reduced 95mA. Since this MMIC covers several bands, reduce part inventory increase volume purchase options MMIC fabricated using PHEMT technology. surface mount package eliminates need "chip wire" assembly lower cost. This MMIC fully compatible with backside grounding I/Os.
Features
Surface Mount Package, 1.25 Single Positive Bias Selectable Output Power Linearity Negative Gate Bias
Specifications (Vdd 4.0V, 120mA)
Frequencies: High Output IP3: 29dBm High Small-Signal Gain: 24dB Typical Noise Figure: 2.3dB Input, Output Match: -10dB
Applications
Microwave Radio systems Satellite VSAT, Up/Down Link LMDS Pt-Pt Long Haul Broadband Wireless Access (including 802.16 802.20 WiMax) MMDS loops Commercial grade military
Note: This MMIC uses depletion mode pHEMT devices.
Connections (Top View)
100pF
Function RFout Current
RFin
view Package base:
Attention: Observe precautions handling electrostatic sensitive devices.
Machine Model (60V) Human Body Model (150V) Refer Avago Application Note A004R: Electrostatic Discharge Damage Control
Absolute Maximum Ratings
Parameters/Condition Drain Ground Voltage Drain Current Input Power channel temperature Storage temperature Maximum Assembly Temp Symbol Tstg Tmax Unit Maximum
Operation excess these conditions result permanent damage this device. absolute maximum ratings Vdd, were determined ambient temperature 25°C unless noted otherwise.
Specifications/ Physical Properties
Parameter Test Condition Drain Supply Current under power drive temp. (Vd=4.0 Drain Supply Voltage Thermal Resistance(3) Symbol Unit °C/W Minimum Typical Maximum
Ambient operational temperature TA=25°C unless noted Channel-to-backside Thermal Resistance (Tchannel 34°C) measured using infrared microscopy. Thermal Resistance backside temp. (Tb) 25°C calculated from measured data.
AMMP-6222 Specifications
25°C, Idd=20mA, Zo=50 Parameters Test Conditions Drain Current Small-Signal Gain Noise Figure into Output Power Gain Compression Output Power Gain Compression Output Third Order Intercept Point Isolation Input Return Loss Output Return Loss Symbol Gain P-dB P-3dB OIP3 RLin RLout Units Freq. (GHz) High Output Power Configuration Minimum Typical Maximum Output Power Configuration Minimum Typical Maximum
Refer characteristic plots detailed individual frequency performance. tested parameters guaranteed with measurement accuracy 0.5dB gain ±0.3dB high output power configuration.
AMMP-6222 Typical Performance High Current, High Output Power Configuration [1],
25°C, Vdd=4V, Idd=120mA, Zout unless noted)
(dB) Frequency (GHz)
Noise Figure (dB) Frequency (GHz)
Figure Small-signal Gain
Figure Noise Figure
OP1dB (dBm)
(dB) Frequency (GHz)
Frequency (GHz)
Figure Input Return Loss
(dB) Frequency (GHz)
Figure Output P-1dB
OIP3 (dBm) Frequency (GHz)
Figure Output Return Loss
Figure Output
Note: S-parameters measured with Eval Board shown Figure Board connector effects included data. Noise Figure measured with Eval board shown Figure with 3-dB input. Board connector losses already deembeded from data.
AMMP-6222 Typical Performance High Current, High Output Power Configuration (Cont)
25°C, Vdd=4V, Idd=120mA, Zout unless noted)
(dB) Frequency (GHz)
(mA)
Figure Isolation
Figure over
Noise Figure (dB)
(dB) Frequency (GHz)
Frequency (GHz)
Figure Small-signal Gain Over
Figure 10a. Noise Figure Over
(dB)
(dB)
Frequency (GHz)
Frequency (GHz)
Figure 11a. Input Return Loss Over
Figure 12a. Output Return Loss Over
AMMP-6222 Typical Performance High Current, High Output Power Configuration (Cont)
25°C, Vdd=4V, Idd=120mA, Zout unless noted)
OP1dB (dBm)
Frequency (GHz)
OIP3 (dBm)
Frequency (GHz)
Figure 13a. Output P1dB over
(dB)
-40C
Figure 14a. Output over
Noise Figure (dB)
-40C
Frequency (GHz)
Frequency (GHz)
Figure 15a. Small-signal Gain Over Temp
(dB)
Figure 16a. Noise Figure Over Temp
(dB)
-40C
-40C
Frequency (GHz)
Frequency (GHz)
Figure 17a. Input Return Loss Over Temp
Figure 18a. Output Return Loss Over Temp
AMMP-6222 Typical Performance Current, Output Power Configuration [1],
25°C, Vdd=4V, Idd=95mA, Zout unless noted)
(dB) Frequency (GHz)
Noise Figure (dB) Frequency (GHz)
Figure Small-signal Gain
Figure Noise Figure
OP1dB (dBm)
(dB) Frequency (GHz)
Frequency (GHz)
Figure Output P-1dB
Figure Input Return Loss
OIP3 (dBm)
Frequency (GHz)
(dB)
Frequency (GHz)
Figure Output Return Loss
Figure Output
Note: S-parameters measured with Eval Board shown Figure Board connector effects included data. Noise Figure measured with Eval board shown Figure with 3-dB input. Board connector losses already deembeded from data
AMMP-6222 Typical Performance Current, Output Power Configuration (Cont)
25°C, Vdd=4V, Idd=95mA, Zout unless noted)
(dB) Frequency (GHz)
(mA)
Figure Isolation
Figure over
Noise Figure (dB)
(dB) Frequency (GHz)
Frequency (GHz)
Figure Small-signal Gain Over
(dB) Frequency (GHz)
Figure 10b. Noise Figure Over
(dB) Frequency (GHz)
Figure 11b. Input Return Loss Over
Figure 12b. Output Return Loss Over
AMMP-6222 Typical Performance Current, Output Power Configuration (Cont)
25°C, Vdd=4V, Idd=95mA, Zout unless noted)
OP1dB (dBm)
OIP3 (dBm)
Frequency (GHz)
Frequency (GHz)
Figure 13b. Output P1dB over
(dB)
-40C
Figure 14b. Output over
Noise Figure (dB)
-40C
Frequency (GHz)
Frequency (GHz)
Figure 15b. Small-signal Gain Over Temp
(dB)
Figure 16b. Noise Figure Over Temp
(dB)
-40C
-40C
Frequency (GHz)
Frequency (GHz)
Figure 17b. Input Return Loss Over Temp
Figure 18b. Output Return Loss Over Temp
AMMP-6222 Application Usage
0.1uF
Biasing Operation
AMMP-6222 normally biased with positive drain supply connected through bypass capacitor shown Figures recommended drain supply voltage general usage corresponding drain current approximately 120mA. important have 0.1uF bypass capacitor capacitor should placed close component possible. Aspects amplifier performance improved over narrower bandwidth application additional conjugate, linearity, noise (Topt) matching. receiver front noise applications where high power linearity often required, AMMP6222 current state when open shown Figure this configuration, bias current approximately 90mA, 95mA 100mA respectively. applications where high output power linearity often required such transmitter drivers, AMMP-6222 selected operate highest output power grounding shown Figure amplifier provide Psat 20dBm. bias current this configuration 115mA, 120mA 125mA respectively. Refer Absolute Maximum Ratings table allowed thermal conditions.
100pF
Open
Figure Current, Output Power State
0.1uF
100pF
Figure High Current, High Output Power State
Figure Evaluation/Test Board (available qualified customer request)
Matching Network
Matching Network
SELECT
Figure Simplified High Linearity Schematic
Recommended Attachment Package
Figure 23a. Suggested Land Pattern Stencil Layout
Figure 23b. Stencil Outline Drawing (mm)
Figure 23c. Combined Stencil Layouts
AMMP Packaged Devices compatible with high volume surface mount assembly processes. material mounting pattern, defined data sheet, optimizes performance strongly recommended. electronic drawing land pattern available upon request from Avago Sales Application Engineering.
Manual Assembly
Follow precautions while handling packages. Handling should along edges with tweezers. Recommended attachment conductive solder paste. Please recommended solder reflow profile. Neither Conductive epoxy hand soldering recommended. Apply solder paste using stencil printer placement. volume solder paste will dependent component layout should controlled ensure consistent mechanical electrical performance. Follow solder paste vendor's recommendations when developing solder reflow profile. standard profile will have steady ramp from room temperature pre-heat temp. avoid damage thermal shock. Packages have been qualified withstand peak temperature 260°C seconds. Verify that profile will expose device beyond these limits.
Temp (°C) Ramp Preheat Ramp Reflow Cooling Seconds
properly designed solder screen stencil required ensure optimum amount solder paste deposited onto pads. recommended stencil layout shown Figure stencil solder paste deposition opening approximately pad. Reducing stencil opening potentially generate more voids underneath. other hand, stencil openings larger than 100% will lead excessive solder paste smear bridging across pads. Considering fact that solder paste thickness will directly affect quality solder joint, good choice laser stencil composed 0.127mm mils) thick stainless steel which capable producing required fine stencil outline. most commonly used solder reflow method accomplished belt furnace using convection heat transfer. suggested reflow profile automated reflow processes shown Figure This profile designed ensure reliable finished joints. However, profile indicated Figure will vary among different solder pastes from different manufacturers shown here reference only.
Peak Melting point 218°C
Figure Suggested Lead-Free Reflow Profile SnAgCu Solder Paste
Package, Tape Reel, Ordering Information AMMP-6222 Part Number Ordering Information
Part Number AMMP-6222-BLKG AMMP-6222-TRG AMMP-6222-TR2G Devices Container Container Antistatic Reel Reel
Package, Tape Reel, Ordering Information
.011
View
Side View Back View
NOTES: DIMENSIONS INCHES [MILIMETERS] GROUNDS MUST SOLDERED Material Rogers RO4350, 0.010" thick
Carrier Tape Pocket Dimensions
product information complete list distributors, please site:
www.avagotech.com
Avago, Avago Technologies, logo trademarks Avago Technologies, Limited United States other countries. Data subject change. Copyright 2006 Avago Technologies Limited. rights reserved. Obsoletes AV0-044EN AV02-0493EN June 2007

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