6-20 Noise Amplifier Avago's AMMP-6220 high gain, low-noise ampli
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AMMP-6220
6-20 Noise Amplifier
Avago's AMMP-6220 high gain, low-noise amplifier that operates from GHz. designed easy-to-use component surface mount application. broad unconditionally stable performance makes this ideal primary, sub-sequential driver noise gain stages. Intended applications include microwave radios, 802.16, automotive radar, VSAT, satellite receivers. Since part cover several bands, AMMP-6220 reduce part inventory increase volume purchase options. integrated match, blocking, self-bias choke eliminate complex tuning assembly processes typically required hybrid (discreteFET) amplifiers. package full compatible with backside grounding simplify assembly.
Features
surface mount package Broad Band performance 6-20 typical noise figure High typical gain input output match Single supply bias
Applications
Microwave radio systems Satellite VSAT, up/down link LMDS Pt-Pt Long Haul Broadband Wireless Access (including 802.16 802.20 WiMax)
Functional Diagram
FUNCTION RFout
MMDS loops Commercial grade military
RFin
PACKAGE BASE
Attention: Observe precautions handling electrostatic sensitive devices. Machine Model (Class Human Body Model (Class Refer Avago Application Note A004R: Electrostatic Discharge Damage Control.
AMMP-6220 Absolute Maximum Ratings Symbol Parameters/Conditions Positive Drain Voltage Drain Current Input Power Operating Channel Temp. Tstg Storage Case Temp. Tmax Maximum Assembly Temp. max.)
Units
Min.
Max. +150 +150 +300
Note: Operation excess these conditions result permanent damage this device.
AMMP-6220 Specifications/Physical Properties Symbol Parameters Test Conditions Units Drain Supply Current (under power drive temperature) qch-b Thermal Resistance[2] (Backside temperature, 25°C) °C/W
Min.
Typ.
Max.
Notes: Ambient operational temperature 25°C unless otherwise noted. Channel-to-backside Thermal Resistance (Tchannel (Tc) 34°C) measured using infrared microscopy. Thermal Resistance backside temperature (Tb) 25°C calculated from measured data.
AMMP-6220 Specifications 25°C, Id(Q) Symbol Parameters Test Conditions Gain Small-signal Gain[5] Noise Figure into W[5] P-1dB Output Power Gain Compression OIP3 Third Order Intercept Point; MHz; RLin Input Return Loss RLout Output Return Loss Isol Reverse Isolation
Units
Typical
Sigma
Notes: Small/Large -signal data measured fully de-embedded test fixture form 25°C. Pre-assembly into package performance verified 100% on-wafer AMMC-6220 published specifications. This final package part performance verified functional test correlated actual performance more frequencies. Specifications derived from measurements test environment. Aspects amplifier performance improved over more narrow bandwidth application additional conjugate, linearity, noise (Gopt) matching.
AMMP-6220 Typical Performances 25°C, Zout unless otherwise stated)
Note: These measurements test environment. Aspects amplifier performance improved over narrower bandwidth application additional conjugate, linearity noise (Gopt) matching.
(dB) (dB)
(dB)
FREQUENCY (GHz)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Gain.
Figure Isolation.
Figure Input return loss.
(dB)
OP-1dB OIP3 (dBm)
(dB)
P-1dB OIP3
FREQUENCY (GHz)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Output return loss.
Figure Noise figure.
Figure Typical power, OP-1dB OIP3.
+25°C -40°C +85°C
+25°C -40°C +85°C
(dB)
(dB)
+25°C -40°C +85°C
(dB)
FREQUENCY (GHz)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Gain over temperature.
Figure Isolation over temperature.
Figure Input return loss over temperature.
AMMP-6220 Typical Performances 25°C, Zout unless otherwise stated)
Note: These measurements test environment. Aspects amplifier performance improved over narrower bandwidth application additional conjugate, linearity noise (Gopt) matching.
+25°C -40°C +85°C
+25°C -40°C +85°C
+25°C
(mA)
-40°C +85°C
(dB)
(dB)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Output return loss over temperature.
Figure over temperature.
Figure Bias current over temperature.
(dB)
(dB)
(dB)
FREQUENCY (GHz)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Gain over Vdd.
Figure Isolation over Vdd.
Figure Input over Vdd.
(dB)
OIP3 (dBm)
(dB)
FREQUENCY (GHz)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Output return loss over temperature.
Figure Noise figure over Vdd.
Figure OIP3 over Vdd.
AMMP-6220 Typical Scattering Parameters[1] 25°C,
Freq
10.0 10.5 11.0 11.5 12.0 12.5 13.0 13.5 14.0 14.5 15.0 15.5 16.0 16.5 17.0 17.5 18.0 18.5 19.0 19.5 20.0 20.5 21.0 21.5 22.0 22.5 23.0 23.5 24.0 24.5 25.0
-1.46 -1.03 -0.40 -4.65 -1.67 -1.39 -2.80 -1.59 -4.66 -8.62 -11.96 -14.57 -15.90 -16.48 -16.49 -16.53 -16.56 -16.19 -15.63 -14.36 -13.22 -12.30 -11.45 -10.83 -10.47 -10.32 -10.53 -10.62 -10.79 -10.97 -11.25 -11.47 -12.36 -13.30 -13.86 -13.77 -12.94 -11.42 -9.73 -8.00 -6.54 -5.44 -5.12 -4.72 -4.17 -3.40 -2.65
0.845 0.888 0.955 0.585 0.825 0.851 0.724 0.832 0.585 0.370 0.252 0.187 0.160 0.150 0.150 0.149 0.149 0.155 0.165 0.191 0.218 0.242 0.268 0.287 0.299 0.305 0.297 0.294 0.289 0.283 0.274 0.267 0.241 0.217 0.203 0.205 0.225 0.268 0.326 0.398 0.471 0.534 0.554 0.581 0.618 0.675 0.737
Phase
65.6 -4.4 -83.9 -150.2 153.6 72.8 18.7 -65.0 -144.6 148.4 93.4 48.4 12.5 -21.7 -58.8 -100.8 -147.1 161.1 108.2 54.8 -50.7 -102.0 -154.6 153.2 101.7 52.2 -33.2 -67.4 -109.8 -152.2 168.0 132.5 99.5 67.3 32.0 -6.3 -49.1 -94.4 -140.6 173.4 128.5 86.1 44.3 -44.6
-28.9 -10.6 10.6 16.6 19.6 22.8 23.5 23.6 23.6 23.3 23.2 23.1 23.1 23.2 23.2 23.3 23.4 23.6 23.8 23.7 23.7 23.6 23.2 22.7 22.3 22.1 21.9 21.5 21.4 21.0 20.9 20.6 20.4 20.1 19.8 19.4 18.5 18.2 17.7 16.9 16.3 15.3 13.7 12.6 11.6
0.036 0.292 2.027 3.420 2.051 6.764 9.563 13.836 15.077 15.218 15.198 14.717 14.575 14.429 14.408 14.455 14.462 14.624 14.926 15.226 15.497 15.483 15.450 15.143 14.518 13.724 13.168 12.858 12.536 11.970 11.796 11.331 11.208 10.720 10.474 10.158 9.847 9.413 8.500 8.140 7.703 7.055 6.535 5.881 4.894 4.288 3.822
Phase
-62.0 -147.1 96.8 -71.3 -104.2 -178.3 93.3 -72.4 -145.1 150.4 90.5 33.6 -20.9 -74.7 -126.9 -178.2 131.2 80.4 29.4 -20.8 -72.0 -122.8 -173.1 135.7 87.2 38.7 -8.5 -56.2 -102.6 -151.3 162.1 115.8 69.0 21.3 -25.9 -74.5 -121.1 -169.0 142.8 93.3 45.0 -3.1 -54.0 -102.8 -147.1 168.3
0.001 0.003 0.005 0.001 0.001 0.003 0.005 0.006 0.003 0.002 0.001 0.002 0.002 0.003 0.004 0.004 0.005 0.006 0.007 0.006 0.008 0.008 0.008 0.010 0.009 0.010 0.009 0.009 0.008 0.009 0.011 0.012 0.012 0.012 0.012 0.011 0.012 0.011 0.011 0.010 0.010 0.009 0.007 0.005 0.004 0.003 0.003
INPUT REFERENCE PLANE S-PARAMETERS
Phase
70.9 12.1 -72. 136.7 143.5 -86.3 140.2 26.4 -66.8 -116.2 153.4 89.9 33.2 -16.5 -46.2 -85.8 -121.8 -155.9 159.4 130.7 88.0 49.2 14.5 -26.9 -66.8 -104.7 -146.3 174.6 138.1 116.4 77.9 38.0 -5.3 -40.0 -82.3 -118.5 -161.5 162.1 124.7 79.8 35.1 -41.2 -84.6 -136.3 -162.8 134.1
-4.8 -9.6 -8.8 -6.3 -6.1 -9.3 -10.8 -15.5 -16.9 -16.7 -17.5 -19.5 -22.7 -24.6 -23.7 -21.9 -21.0 -21.3 -22.6 -23.8 -23.4 -21.3 -19.7 -17.8 -16.0 -14.4 -13.5 -13.2 -13.6 -12.7 -12.1 -12.1 -13.1 -14.2 -15.4 -16.5 -16.8 -16.8 -16.5 -16.1 -16.5 -17.3 -21.9 -18.0 -11.5 -9.0 -7.7
0.570 0.330 0.361 0.483 0.491 0.342 0.286 0.166 0.141 0.146 0.132 0.106 0.073 0.059 0.065 0.080 0.089 0.086 0.074 0.064 0.067 0.086 0.102 0.127 0.157 0.189 0.211 0.218 0.208 0.231 0.247 0.246 0.220 0.194 0.170 0.148 0.144 0.143 0.148 0.156 0.149 0.136 0.080 0.126 0.265 0.355 0.409
Phase
85.5 38.7 18.1 -46.1 -118.9 174.4 125.8 79.4 64.2 31.4 -8.7 -51.8 -103.7 -172.2 119.7 70.3 31.0 -3.6 -29.9 -46.2 -59.0 -90.7 -130.4 179.7 128.3 79.9 34.8 -4.6 -38.0 -65.0 -101.8 -140.0 179.3 139.1 94.9 44.7 -5.1 -51.5 -92.9 -132.8 -167.4 159.4 138.2 178.1 141.6 100.9 61.8
Note: Data obtained from fixture measurements fully de-embedded package edge.
OUTPUT REFERENCE PLANE S-PARAMETERS (VIEW FROM PACKAGE BOTTOM)
Biasing Operation
AMMC-6220 normally biased with single positive drain supply connected both through bypass capacitors shown Figure recommended supply voltage important have bypass capacitor, capacitor should placed close component possible. AMMC-6220 does require negative gate voltage bias three stages. ground wires needed because ground connections made with plated through-holes backside package. Refer Absolute Maximum Ratings table allowed thermal conditions.
(TYP.
RFout
RFin RFout
RFin
PACKAGE BASE
Figure Typical application.
Figure Simplified MMIC schematic.
Figure Demonstration board (available upon request).
Outline Drawing
AMMP XXXX YWWDNN
FRONT VIEW
SIDE VIEW MAX. 0.213 (5.4) 0.088 (2.25)
SYMBOL
MIN. 0.198 (5.03) 0.0685 (1.74)
DIMENSIONS INCHES (MM)
0.114 (2.90) 0.011 (0.28) 0.018 (0.46) 0.014 (0.365)
0.126 (3.2) 0.059 (1.5)
0.016 (0.40)
0.100 (2.54) 0.029 (0.75) 0.016 (0.40)
0.012 (0.30)
0.028 (0.70) 0.100 (2.54) 0.93 (2.36) BACK VIEW
DIMENSIONAL TOLERANCE BACK VIEW: 0.002" (0.05
NOTES: INDICATES DIMENSIONS INCHES (MILLIMETERS) GROUNDS MUST SOLDERED GROUND
Figure Outline Drawing.
Recommended Attachment
AMMP Packaged Devices compatible with high volume surface mount assembly processes. material mounting pattern, defined data sheet, optimizes performance strongly recommended. electronic drawing land pattern available upon request from Avago Sales Application Engineering.
Stencil Design Guidelines
properly designed solder screen stencil required ensure optimum amount solder paste deposited
onto pads. recommended stencil layout shown Figure stencil solder paste deposition opening approximately pad. Reducing stencil opening potentially generate more voids underneath. other hand, stencil openings larger than 100% will lead excessive solder paste smear bridging across pads. Considering fact that solder paste thickness will directly affect quality solder joint, good choice laser stencil composed 0.127 mils) thick stainless steel which capable producing required fine stencil outline. combined stencil layout shown Figure
Figure Suggested Land Pattern Stencil Layout
Figure Stencil Outline Drawing (mm)
Figure Combined Stencil Layouts
Manual Assembly Follow precautions while handling packages. Handling should along edges with tweezers. Recommended attachment conductive solder paste. Please recommended solder reflow profile. Conductive epoxy recommended. Hand soldering recommended. Apply solder paste using stencil printer placement. volume solder paste will dependent component layout should controlled ensure consistent mechanical electrical performance. Follow solder paste vendor's recommendations when developing solder reflow profile. standard profile will have steady ramp from room temperature pre-heat temperature avoid damage thermal shock. Packages have been qualified withstand peak temperature 260°C seconds. Verify that profile will expose device beyond these limits.
Solder Reflow Profile most commonly used solder reflow method accomplished belt furnace using convection heat transfer. suggested reflow profile automated reflow processes shown Figure This profile designed ensure reliable finished joints. However, profile indicated Figure will vary among different solder pastes from different manufacturers shown here reference only.
TEMPERATURE RAMP PREHEAT RAMP TIME (SECONDS) REFLOW COOLING PEAK MELTING POINT
Figure Suggested lead-free reflow profile SnAgCu solder paste.
AMMP-6220 Part Number Ordering Information Part Number AMMP-6220-BLK AMMP-6220-TR1 AMMP-6220-TR2 Devices Container Container Antistatic Reel Reel
Device Orientation (Top View)
AMMP XXXX AMMP XXXX AMMP XXXX
Carrier Tape Pocket Dimensions
4.00 0.10 NOTE 2.00 0.05 1.55 0.05 0.50 TYP. 1.75 0.10 5.50 0.05 SECTION PITCH: WIDTH: 5.30 5.30 2.20 8.00 12.00 MIN. 5.20 NOM. 5.30 MAX. 5.40 5.20 5.30 5.40 2.10 2.20 2.30 12.00 0.10
8.00 0.10
1.50 (MIN.)
0.30 0.05 SECTION NOTES: MEASURED ABOVE BASE POCKET. PITCHES CUMULATIVE TOLERANCE DIMENSIONS MILLIMETERS (mm).
product information complete list distributors, please website:
www.avagotech.com
Avago, Avago Technologies, logo trademarks Avago Technologies Limited United States other countries. Data subject change. Copyright 2007 Avago Technologies Limited. rights reserved. Obsoletes 5989-4517EN AV02-0515EN June 2007
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