TD-SCDMA Power Amplifier General Description ACPM-7886 amplifier
|
|
|
Top Searches for this datasheet
ACPM-7886
TD-SCDMA Power Amplifier
General Description ACPM-7886 amplifier module designed TD-SCDMA applications 2010-2025MHz band. Designed around Avago Technologies' GaAs Enhancement Mode pHEMT process, ACPM-7886 offers premium performance very small form factor. matched Ohms input output. amplifier excellent ACLR efficiency performance Pout quiescent current (50mA) with single bias control voltage, Vctrl 2.0V. Designed surface mount package, ACPM7886 very cost size competitive. Functional Block Diagram
Vdd1 Vdd3 (10)
Features Operating frequency: 2010 2025 Linear Output Power 3.5V High Efficiency Single bias, quiescent current (50mA) Internal matching networks both input output linear operation 4.0mm Package package profile, 1.1mm Applications TD-SCDMA Handsets TD-SCDMA Data Cards TD-SCDMA PDAs
Output Match Bias Control MMIC Module Vctrl Vdd2 (3,6,7,9)
Package Diagram
Vdd3 (Pin Vdd1 (Pin RFin (GND) Vctrl Vdd2 (Pin
AVAGO ACPM-7886 MLYWWDD XXXX
1.175mm
RFout (Pin
Bottom View
Description Table
Number Label Vdd1 RFin Vctrl Vdd2 Description Supply bias input internal connection Control voltage Supply bias Function stages drain bias, nominally 3.5V Signal input, internally grounded through inductor. External block needed voltage present input trace. Recommend ground connection Output level control, nominally Bias circuit supply, 2.5V; nominally 2.85V. Does require regulated input connected directly battery, desired.
RFout Vdd3
Ground Ground output Ground Supply bias stage drain bias, nominally 3.5V Signal output, requires external block
Package Dimensions
4.00 0.075mm 0.10mm 2.00mm
Marking Notes Manufacturing Location Year Work Week Date Code
0.60mm 0.40mm 3.80mm 4.00 0.075mm
0.10mm
0.45mm 0.60mm 0.50mm 0.40mm 0.50mm Viewed down through package
XXXX Trace Code (Avago Technologies internal reference)
Maximum Ratings Table
Parameter Supply voltage, Vdd1 Vdd3 Supply voltage, Vdd2 Analog control voltage input power Operating case temperature Load VSWR Storage temperature (case temperature)
Min.
Max. 12:1
+100
Notes: Operation this device excess these limits cause permanent damage. Avoid electrostatic discharge pins
Recommended Operating Conditions
Parameter Supply voltage, Vdd1 Vdd3 Supply voltage, Vdd2 Control voltage Case temperature Min. Typ. 2.85 Max.
Electrical Characteristics TD-SCDMA Unless Otherwise Specified: f=2010-2025MHz, Vdd1=Vdd3=3.5V, Vdd2=2.85V, Vctrl=2.0V, Pout=28.0dBm, Ta=25°C, Zin/Zout
Parameter Leakage Current, Idd1,2,3; Vctrl=0 Control Current, Ictrl; Vctrl=2.0 Bias Current, Idd2; Vctrl=2 Vdd2=2.85 Quiescent Current, Idd1,3; Pout=28.0dBm Supply current Idd1+Idd3 including Vdd1,2,3 Gain Input VSWR ACLR 1.6MHz offset 3.2MHz offset Harmonic Harmonic Noise Figure Stability, spurious under conditions: VSWR=4:1, phases 3<Vdd<4.5, 28.0 Pout=16dBm Supply current Idd1+Idd3 including Vdd1,2,3 Gain Input VSWR ACLR 1.6MHz offset 3.2MHz offset Vctrl=2.0
Units
25.5 28.5
2.0:1
dBc/1.28MHz dBc/1.28MHz dBc/1MHz dBc/1MHz
dBc/1.28MHz dBc/1.28MHz
Operation/Shutdown Logic: signals
Vctrl Operational Mode Shutdown 2.0V 0.2V
Vdd2 3.5V 2.85V typ)
Transmitter Power Dynamic Range: 107dB Transmitt Power: -83dBm
Figure Transmit power.
Signal Studio Configuration
Figure TD-SCDMA signal configuration.
Sensitivity Level Human Body Model (EIA/JESD22-A114B): Class (250Vmin, less than 500V) Machine Model (EIA/JESD22-A115A): Class (50Vmin, less than 200V)
Notes: Sensitivity level Human Body Model Machine Model necessitate following handling precautions: Ensure Faraday cage conductive shield used during transportation processes. static charge assemble station above device sensitivity level, place ionizer near device charge neutralization purposes. Personal grounding must worn times when handling devices.
Avago Technologies recommends utilizing standard precautions listed below. Calculated Shelf Life Sealed Bag: months 40°C Relative Humidity (RH) Peak Package Body Temperature: 250°C After opened, devices that will subjected reflow solder other high temperature process must Mounted within hours factory condition 30°C Stored <10% used Devices require baking, before mounting Humidity indicator card when read immediately after moisture barrier opened. Items baking required, please refer J-STD-033 standard temperature (40°C) baking requirement Tape/Reel form.
Moisture Sensitivity Classification: Class Preconditioning JESD22-A113-D Class performed devices prior reliability testing. ACPM-7886 moisture sensitive component. It's important that parts handled under precaution proper manner. handling, baking outof-pack storage conditions moisture sensitive components described IPC/JEDC S-STD-033A.
Tape Dimensions Orientation
0.30 0.05 2.00 0.05[1] 1.55 0.05 4.00 0.10[2] 1.75 0.10
5.50 0.05[3] 4.38 0.10 12.00 0.30 4.38 0.10
1.80 0.10 8.00 0.10 4.38 0.10
1.50 (MIN)
Notes: Measured from centerline sprocket hole centerline pocket Cumulative tolerance sprocket holes dimensions millimeters unless otherwise stated.
Agilent ACPM-7886 MLYWWDD XXXX
Reel Dimensions Orientation
BACK VIEW Shading indicates thru slots 18.4 max.
+0.4 -0.2 wide (ref) Slot carrier tape insertion attachment reel places 180° apart)
min.
12.4 +2.0 -0.0
REEL FRONT VIEW
CARRIER TAPE USER FEED DIRECTION COVER TAPE
min. 13.0±0.2 21.0±0.8
Notes: Reel shall labeled with following information minimum). manufacturers name symbol Avago Technologies part number purchase order number date code quantity units certificate compliance shall issued accompany each shipment product. Reel must made with contain ozone depleting materials. dimensions millimeters (mm).
Order Information
Part Number ACPM-7886-BLK ACPM-7886-TR1
Devices 1000
Container Bulk Tape Reel
Suggested Board Implementation
(10,000pF) (4700pF) (33pF)
(33pF)
(4700pF)
Notes: decoupling capacitors should placed close power module possible. RFin (Pin grounded inductor inside package matching element. external series capacitor needed voltage present. additional battery bypass capacitor should placed bias line before battery terminal, does need immediately adjacent module. bypass capacitor should large value, nominally between 2.2uF 4.7uF. Trace impedance lines should
Solder Reflow Profile most commonly used solder reflow method accomplished belt furnace using convection heat transfer. This profile designed ensure reliable finished joints. However, profile indicated will vary among different solder pastes from different manufacturers shown here reference only. Other factors that affect profile include density types components board, type solder used type board substrate material being used. profile shows actual temperature that should occur surface test board near central solder joint. this type reflow soldering, circuit board solder joints first heated components
Suggested Lead Free Reflow Profile SnAgCu Solder Paste Peak Melting point 218°C
board then heated conduction. circuit board, because large surface area, absorbs thermal energy efficiently distributes this heat components. Reflow temperature profiles designed tin/lead alloys will need revised accordingly cater melting point lead free solder being 34°C (54°F) higher than that tin/lead eutectic near-eutectic alloys. addition, surface tension molten lead free solder alloys significantly higher than surface tension tin/lead alloys this reduce spread lead free solder during reflow. Lead Free Reflow Profile General Guidelines Ramp Ramp 100°C. Maximum slope this zone limited 2°C/sec. Faster heating with ramp higher than result excessive solder balling slump. Preheat Preheat setting should range from 150°C over period seconds depending characteristics components thermal characteristics oven. possible, prolong preheat will cause excessive oxidation occur solder powder surface.
Ramp Preheat Seconds Ramp Reflow Cooling
iii. Ramp time this zone should kept below seconds reduce risk flux exhaustion. ramp rate should 2°C/sec from 150°C re-flow 217°C. important that flux medium retains activity during this phase ensure complete coalescence solder particles during re-flow. Reflow peak reflow temperature calculated adding ~32°C melting point alloy. Lead free solder paste melts 218°C peak reflow temperature 218°C 32°C 250°C (±5°C). Note that total time over 218°C critical should typically seconds. This period determines appearance solder joints. Excessive time above reflow cause dull finish charred flux residues. Insufficient time above reflow lead poor wetting improperly fused (cloudy) flux residues. Cooling Maximum slope cooling limited 3°C/sec. More rapid cooling cause solder joints crack while cooling slower rate will increase likelihood crystalline appearance solder joints (dull finish). Design Guidelines recommended ACPM-7886 land pattern shown Figure substrate coated with solder mask between conductive paddle protect gold pads from short circuit that caused solder bleeding bridging. Stencil Design Guidelines properly designed solder screen stencil required ensure optimum amount solder paste deposited onto pads. recommended stencil layout shown Figure stencil solder paste deposition opening that approximately pad. Reducing stencil opening potentially generate more voids. other hand, stencil openings larger than 100% will lead excessive solder paste smear bridging across pads conductive paddle adjacent pads. Considering fact that solder paste thickness will directly affect quality solder joint, good choice laser stencil composed 0.100mm mils) 0.127mm mils) thick stainless steel which capable producing required fine stencil outline. combined stencil layout shown Figure
0.44 0.64
0.375
0.85 (PITCH)
0.55
0.55
Figure land pattern (dimensions
1.68 0.64
0.85
0.375
Figure Stencil outline drawing (dimensions 1.68 0.55
0.44
3.12
0.41
3.12 0.44
Stencil Opening 0.44 Figure Combined stencil layouts (dimensions
0.55
Solder Paste Recommendation ACPM-7886 package lead free package that proven pass MSL3 when reflowed under lead free solder reflow profile. recommended lead free solder reflow Sn-Ag-Cu (95.5% Tin, 3.8% Silver, 0.7% Copper) other similar Sn-Ag-Cu solders. This lead free solder paste melting point 218°C (423°F), ternary eutectic Sn-Ag-Cu system, giving advantage being lowest melting lead free alternative. This temperature still enough protect from damaging internal circuitry during solder reflow operations provided exposure time peak reflow temperatures excessive. certain situations, designer leaded solder paste reflow. recommended solder mounting ACPM-7886 package Sn63 (63% Pb). eutectic compound with typical melting point 183°C.
Background 1999 China Academy Telecommunications Technology (CATT) Siemens proposed standard that would rival WCDMA CDMA2000 data rates. Time Domain Synchronous Code Domain Access (TD-SCDMA) combines both CDMA TDMA technologies. benefits from CDMA capacity well being compatible with current networks. unlike existing WCDMA, CDMA2000 networks, this standard transmits receives same frequency thus greatly increasing spectrum efficiency. Figure simplifies this explanation showing TD-SCDMA frame with slots channelization codes each slot. ACPM-7886 Test Setup test setup measuring TD-SCDMA power module resembles test. Specifically, very important properly configure timing test instruments device under test. GSM, order turn each time slot, controlled triggered with pulse period 4.615ms duty cycle (577uS). This usually labeled Vapc most PAs.
Application Information
Introduction ACPM-7886 amplifier module designed TDSCDMA applications 2010-2025MHz band. This power amplifier able produce excellent results emerging Chinese standard, TD-SCDMA. Typical ACLR performance 41dBc with Pout 28dBm efficiency.
Figure TD-SCDMA frame.[1]
TD-SCDMA uses same control technique except that each frame with only timeslots additional 75us downlink pilot 125us uplink pilot. Each slots 675uS. ACPM-7886, Vctrl used instead Vapc. GSM, there time mask specification that must met, conformance this spec dictated Vapc ramp. addition time domain specs, TD-SCDMA must meet linearity requirement. GSM/GMSK referred constant amplitude constant envelope modulation, thus allowed operate saturation. shown Figure each time slot supports different CDMA codes with QPSK modulation; result this must meet similar ACLR specifications CDMA WCDMA. Signaling Setup properly test TD-SCDMA module specified TS25.102 standard, must generate signal shown Figure along with timing described previous section. While time publication this Application note, Agilent Technologies have TD-SCDMA transceiver baseband reference module capable this signal generation, does have E4438C capable generating TD-SCDMA waveform. used conjunction with Agilent Technologies E4440A
spectrum analyzer Signal Studio, performance tests become much simpler although, ACLR, Gain, PAE, Spurious emission, etc. measured with spectrum analyzer. Figure shows basic setup used test ACPM7886 TD-SCDMA. This includes power supply, timing signaling. brief, signal generator triggers pulse generator which turn triggers spectrum analyzer ACPM-7886 other multimeters used. signal created using Signal Studio downloaded signal generator GPIB. Signal Studio facilitates construction complex waveform shown Figure Using this software, generate uplink downlink Dedicated Physical Channel (DPCH) signals along with uplink downlink pilot signals. traffic timeslots supported, with individually configurable code channels timeslot, total resource units(RU). Signal Studio other standards found Figure displays main configuration window with only downlink timeslot turned
10MHz
10MHz
Trig
GPIB
Event1
Vdd3
Vdd2
Vdd1
RFin
RFout
ISOLATOR Trig
20dB ATTENUATOR
Vctrl
Figure TD-SCDMA test setup.
Figure Signal Studio configuration.
Technically mobile will transmit uplink, main point display configurability each slot. fact, test ACPM-7886 does require full code channels. Signal Studio most beneficial base station uplink downlink test where multiple users will transmitting same time slot. this test only time slot used with single code.
Results ACPM-7886 delivers good performance TD-SCDMA 2010 2025MHz frequency band figures 3.5V, Vdd2 2.85 Vcntl Pout 28dBm this device produces efficiency ACLR1/ACLR2 41dBc respectively. normal CDMA WCDMA systems, receiver sensitivity greatly affected power leakage, thus transmit power great importance. Figure shows transmit power -83dBm which results 107dBc dynamic range.
ACLR (dB)
2015 ACLR1 2015 ACLR2
Pout (dBm)
Figure ACLR Pout 2015 MHz.
2015
Pout (dBm)
Figure Pout 2015 MHz. Figure Transmit Power.
Gain (dB)
2015 Pout (dBm)
Figure Gain Pout 2015 MHz.
Summary Avago Technologies ACPM-7886 demonstrated excellent performance emerging Chinese TDSCDMA standard. addition, ACPM-7886 proven track record great results UMTS2100 under WCDMA modulation with without HSDPA. This makes ACPM-7886 ideal dual mode/dual band system Chinese market. References TD-SCDMA: Solution Band, DiGiuseppe, Principato, Fodor, Siemens White Paper 2002 Oct.-Nov. 2005 http://www.agilent.com/find/ signalstudio.
product information complete list distributors, please site: www.avagotech.com Avago, Avago Technologies, logo trademarks Avago Technologies, Pte. United States other countries. Data subject change. Copyright 2006 Avago Technologies Pte. rights reserved. Obsoletes AV01-0100EN AV01-0319EN September 2006
Other recent searches
WFA26B0456CE - WFA26B0456CE WFA26B0456CE Datasheet
VTA-6193A4 - VTA-6193A4 VTA-6193A4 Datasheet
VTA-6193A4X - VTA-6193A4X VTA-6193A4X Datasheet
M30624MGN - M30624MGN M30624MGN Datasheet
PREVENTION - PREVENTION PREVENTION Datasheet
CLOCK-DISTRIBUTION - CLOCK-DISTRIBUTION CLOCK-DISTRIBUTION Datasheet
CIRCUITS - CIRCUITS CIRCUITS Datasheet
ADS1672 - ADS1672 ADS1672 Datasheet
Privacy Policy | Disclaimer
© 2012 Datasheet Archive
