18-28 Power Amplifier Package AMMP-6425 MMIC broadband power ampl
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AMMP-6425
18-28 Power Amplifier Package
AMMP-6425 MMIC broadband power amplifier surface mount package designed transmitters that operate various frequency bands between 18GHz 28GHz. 25GHz, provides 31dBm output power (P-1dB) 25dB small-signal gain from small easy-to-use device. device input output matching circuitry environments. AMMP-6425 also integrates temperature compensated power detection circuit that enables power detection 0.25V/W. bias simple device operates widely available current supply (negative voltage only needed Vg). fabricated PHEMT process exceptional power gain performance.
Features
Surface Mount Package Wide Frequency Range 18-28GHz watt output power match input output protection (60V 200V HBM)
Specifications (Vdd=5V, Idsq=650mA)
Frequency range Small signal Gain 22dB Output power @P-1 28dBm (Typ.) Input/Output return-loss -12dB
Connections (Top View)
Applications
Microwave Radio systems Satellite VSAT, Up/Down Link
Function DET_O RF_out DET_R RF_in
LMDS Pt-Pt Long Haul Broadband Wireless Access (including 802.16 802.20 WiMax) MMDS loops Commercial grade military
Note: This MMIC uses depletion mode pHEMT devices. Negative supply used gate biasing.
PACKAGE BASE
RoHS-Exemption
Attention: Observe Precautions handling electrostatic sensitive devices. Machine Model (Class Human Body Model (Class 200V Refer Avago Application Note A004R: Electrostatic Discharge Damage Control.
Please refer Hazardous substances table page
Absolute Maximum Ratings
Symbol Tch, Tstg Tmax Parameters Positive Supply Voltage Gate Supply Voltage Drain Current Power Dissipation Input Power Maximum Operating Channel Temp. Storage Case Temp. Maximum Assembly Temp max) Units Value +155 +155 +260 Notes
Notes: Operation excess these conditions result permanent damage this device. Combinations supply voltage, drain current, input power, output power shall exceed When operate this condition with base plate temperature 85°C, median time failure (MTTF) significantly reduced. These ratings apply each individual Junction operating temperature will directly affect device MTTF. maximum life, recommended that junction temperatures maintained lowest possible levels.
Specifications/ Physical Properties
Symbol Parameters Test Conditions Drain Supply Current (Vdd=5 Typical) Gate Supply Operating Voltage (Id(Q) (mA)) Thermal Resistance[6] (Channel-to-Base Plate) Channel Temperature Units °C/W Value -1.1 17.8 142.8
Notes: Assume SnPb soldering evaluation board 85°C base plate temperatures. Worst case saturated output power when power consumption rises 5.5W with 1.58W power delivered load. Power dissipation 3.92W temperature rise channel 69.8 this condition, channel temperature reached maximum operational channel temperature 155°C. maintain maximum operational temperature below 155°C, base plate temperature must maintained below 85°C
AMMP-6425 Specifications
(Data obtained from 2.4-mm connector based test fixture, this data including connecter loss, board loss.) 25°C, =650 -1.1V, Zo=50 Symbol Freq Gain P-1dB OIP3 RLin RLout Isolation Parameters Test Conditions Operational Frequency Small-signal Gain[3, Freq (GHz) Freq (GHz) Freq (GHz) Freq (GHz) Units Minimum Typical Maximum
Output Power 1dB[3] Gain Compression Output Third Order Intercept Point Input Return Loss Output Return Loss Reverse Isolation
Notes: Small/Large -signal data measured packaged form 2.4mm connecter based evaluation board 25°C. This final package part performance verified functional test correlated actual performance more frequencies Specifications derived from measurements test environment. Aspects amplifier performance improved over narrower bandwidth application additional conjugate, linearity, power matching. Pre-assembly into package performance verified 100% on-wafer published specifications Frequencies=18, 28GHz. Gain P1dB tested guaranteed with measurement accuracy ±1.5dB Gain P1dB, except Gain with measurement accuracy ±1.8dB.
AMMP-6425 Typical Performance
(Data obtained from 2.4-mm connector based test fixture, this data including connecter loss, board loss.) 25°C, Vdd=5V, Idq=650mA, Vg=-1.1 Zout
Frequency [GHz] S21[dB] S12[dB]
S11[dB] S22[dB]
Return Loss [dB]
S21[dB]
S12[dB]
Frequency [GHz]
Figure Typical Gain Reverse Isolation
Figure Typical Input Output Return Loss
P-1, [dBm], PAE[%] Po[dBm], and, PAE[%]
Frequency[GHz] Pout [dBm]
1200 1000 -200
[mA]
PAE, @P-1 PAE, @P-3
Figure Typical
Figure Typical Pout, Ids, Freq=25GHz
Noise Figure [dB] IP3[dBm]
Frequency [GHz]
Frequency [GHz]
Figure Typical (Third Order Intercept) @Pin=-20dBm
Figure Typical Noise Figure
S22_20
Det_R Det_O Det_R Det_O
S22_-40 S22_85
S22[dB]
0.01
0.001 Pout[dBm]
Frequency[GHz]
Figure Typical Detector voltage Output Power
S11_20 S11_-40 S11_85
Figure Typical over temperature
[dBm]
S11[dB]
Frequency[GHz]
P-1_85deg P-1_20deg P-1_-40deg Frequency [GHz]
Figure Typical over temperature
Figure Typical over temperature
S21[dB]
S21_20 S21_-40 S21_85
Frequency[GHz]
Figure Typical Gain over temperature
Typical Scattering Parameters
25°C, Zout Freq [GHz] -0.178 -0.523 -0.978 -1.451 -2.031 -2.704 -3.392 -4.109 -4.791 -5.516 -6.364 -7.445 -8.819 -10.363 -11.090 -12.282 -12.416 -18.133 -11.405 -12.614 -15.765 -18.729 -19.222 -16.511 -18.712 -17.947 -11.711 -10.060 -13.299 -17.064 -13.487 -11.785 -11.532 -10.906 -10.536 -10.699 -12.367 -17.928 -23.162 -11.353 -7.080 -5.965 -6.061 -6.152 -5.936 0.980 0.942 0.893 0.846 0.792 0.732 0.677 0.623 0.576 0.530 0.481 0.424 0.362 0.303 0.279 0.243 0.239 0.124 0.269 0.234 0.163 0.116 0.109 0.149 0.116 0.127 0.260 0.314 0.216 0.140 0.212 0.257 0.265 0.285 0.297 0.292 0.241 0.127 0.069 0.271 0.443 0.503 0.498 0.492 0.505 Phase -37.820 -74.503 -110.430 -145.650 178.840 143.950 109.310 75.156 41.436 8.579 -23.142 -52.655 -78.361 -98.427 -112.740 -131.170 -151.110 -159.160 -143.530 172.380 172.820 169.430 155.900 168.470 146.270 175.590 168.100 125.410 95.693 102.470 101.410 84.008 62.490 45.088 23.915 -1.693 -29.330 -55.180 34.718 26.590 -9.207 -39.140 -62.125 -76.987 -89.697 -47.292 -44.008 -46.417 -46.503 -45.038 -47.901 -49.517 -50.018 -53.613 -56.475 -46.029 -29.971 -16.053 -3.496 8.685 18.694 22.143 25.421 24.729 25.037 25.244 25.205 24.889 23.841 23.888 24.682 24.823 22.405 19.705 16.154 12.154 8.383 4.076 0.130 -4.190 -8.418 -12.489 -16.801 -21.962 -27.653 -40.696 -36.215 -33.829 -32.808 -36.302 0.004 0.006 0.005 0.005 0.006 0.004 0.003 0.003 0.002 0.002 0.005 0.032 0.158 0.669 2.718 8.604 12.798 18.666 17.236 17.859 18.289 18.208 17.557 15.562 15.647 17.143 17.423 13.191 9.666 6.422 4.052 2.625 1.599 1.015 0.617 0.379 0.237 0.145 0.080 0.041 0.009 0.015 0.020 0.023 0.015 Phase -74.488 149.890 67.301 13.513 -58.861 -154.120 169.350 105.240 44.075 -12.575 -103.650 -152.130 149.700 81.099 -4.135 -119.950 128.380 25.746 -77.696 -153.820 120.010 41.393 -34.617 -111.460 -179.450 103.360 13.068 -74.382 -157.160 122.330 48.186 -23.332 -91.933 -158.780 136.430 74.411 15.586 -41.207 -95.210 -155.570 131.530 -26.815 -89.274 -126.740 -161.820 -80.369 -70.925 -65.116 -62.769 -58.964 -54.809 -53.665 -51.070 -51.693 -51.331 -51.167 -51.615 -50.249 -50.263 -46.066 -46.237 -60.278 -58.209 -47.566 -45.013 -46.939 -46.250 -49.429 -47.594 -46.045 -45.724 -42.460 -41.090 -42.711 -38.921 -44.057 -46.564 -53.813 -55.014 -48.002 -40.193 -38.833 -37.437 -34.527 -36.493 -36.464 -36.100 -34.607 -33.593 -37.542 9.58E-05 2.84E-04 5.55E-04 7.27E-04 1.13E-03 1.82E-03 2.07E-03 2.80E-03 2.60E-03 2.71E-03 2.76E-03 2.63E-03 3.07E-03 3.07E-03 4.97E-03 4.88E-03 9.68E-04 1.23E-03 4.18E-03 5.61E-03 4.50E-03 4.87E-03 3.38E-03 4.17E-03 4.99E-03 5.17E-03 7.53E-03 8.82E-03 7.32E-03 1.13E-02 6.27E-03 4.70E-03 2.04E-03 1.78E-03 3.98E-03 9.78E-03 1.14E-02 1.34E-02 1.88E-02 1.50E-02 1.50E-02 1.57E-02 1.86E-02 2.09E-02 1.33E-02 Phase 103.780 15.146 -50.709 -62.503 -135.670 178.760 141.890 104.940 53.998 32.567 11.953 3.625 -15.675 -28.191 -65.232 -110.450 -136.210 -69.871 -85.440 -114.600 -153.480 -155.050 165.260 177.280 168.010 158.550 135.940 113.320 83.227 55.944 18.061 2.928 17.837 112.070 132.840 80.387 35.254 6.758 -16.672 -57.641 -63.002 -66.924 -102.970 -126.260 -154.850 -0.085 -0.279 -0.630 -1.318 -1.389 -1.958 -2.558 -3.104 -3.633 -4.100 -4.608 -5.224 -6.438 -9.045 -14.588 -24.953 -14.586 -17.548 -9.908 -12.434 -19.545 -19.073 -19.220 -17.045 -18.114 -16.455 -11.479 -11.025 -15.117 -13.896 -11.050 -10.645 -10.575 -10.010 -9.589 -9.107 -8.758 -8.550 -8.096 -7.734 -7.456 -6.986 -6.790 -6.710 -6.733 0.990 0.968 0.930 0.859 0.852 0.798 0.745 0.700 0.658 0.624 0.588 0.548 0.477 0.353 0.186 0.057 0.187 0.133 0.320 0.239 0.105 0.111 0.109 0.141 0.124 0.150 0.267 0.281 0.175 0.202 0.280 0.294 0.296 0.316 0.332 0.350 0.365 0.374 0.394 0.410 0.424 0.447 0.458 0.462 0.461 Phase -34.276 -68.410 -102.400 -134.930 -167.440 158.670 125.480 92.207 58.406 24.394 -10.323 -45.888 -82.797 -120.890 -150.360 -82.936 -124.060 -113.800 -139.560 164.360 177.540 -162.420 176.780 -178.550 171.490 -178.830 172.720 129.980 123.360 133.650 111.830 91.607 76.604 61.871 45.962 29.444 12.764 -1.575 -17.493 -32.201 -46.161 -60.000 -74.546 -87.216 -98.984
Note: Data obtained from 2.4-mm connecter based module, this data including connecter loss, board loss.
AMMP-6425 Application Usage
Recommended quiescent bias condition optimum power linearity performances Vdd=5 volts with (-1.1V) Idq=650 Minor improvements performance possible depending application. drain bias voltage range single gate supply connected will bias gain stages. Muting accomplished setting pinch-off voltage simplified schematic AMMP6425 MMIC shown Figure MMIC contains over voltage protection diodes terminals. package diagram recommended assembly shown Figure finalized package form, diodes protect possible over voltage damages between ground, Vdd, ground. Typical diode current versus diode voltage 11connected diodes series shown Figure Under recommended quiescent biasing condition Vds=5V, Ids=650mA, Vgg=-1V, typical gate terminal current approximately 0.3mA. active biasing technique selected AMMP6425 MMIC biasing, active biasing circuit must have more than 10-times higher internal current that gate terminal current. optional output power detector network also provided. differential voltage between Det-Ref Det-Out pads correlated with power emerging from output port. detected voltage given
where Vref voltage DET_R port, Vdet voltage DET_0 port, Vofs zero-inputpower offset voltage. There three methods calculate Vofs Vofs measured before each detector measurement removing switching power source measuring Vref Vdet). This method gives error temperature drift less than 0.01dB/50°C. Vofs measured single reference temperature. drift error will less than 0.25dB. Vofs either characterized over temperature stored lookup table, measured temperatures linear used calculate Vofs temperature. This method gives error close method ports coupled input first stage output final stage. ground wired needed since ground connections made with plated through-holes backside device.
DET_R
DET_O
RFout
Three stage 0.5W power amplifier
Figure Simplified schematic MMIC
DET_O
Input
Output
DET_R
Function DET_O RF_out DET_R RF_in
Figure Typical connection
Diode Current [mA] Voltage
|Icomp(I_METER.AMP1,0)| (mA) Diode_current
Figure Typical diode current versus diode voltage 11-connected diodes series
Note: performance degradation seen 200V characteristics general show increased leakage lower discharge voltages. user reminded that this device sensitive needs handled with necessary protocols.
Recommended Attachment Package
Figure 15a. Suggested Land Pattern Stencil Layout
Ground vias should solder filled
Figure 15b. Land Pattern Stencil Layouts
Figure 15c. Stencil Outline Drawing(mm)
AMMP Packaged Devices compatible with high volume surface mount assembly processes. material mounting pattern, defined data sheet, optimizes performance strongly recommended. electronic drawing land pattern available upon request from Avago Sales Application Engineering.
Manual Assembly
Follow precautions while handling packages. Handling should along edges with tweezers. Recommended attachment conductive solder paste. Please recommended solder reflow profile. Neither Conductive epoxy hand soldering recommended. Apply solder paste using stencil printer placement. volume solder paste will dependent component layout should controlled ensure consistent mechanical electrical performance. Follow solder paste vendor's recommendations when developing solder reflow profile. standard profile will have steady ramp from room temperature pre-heat temp. avoid damage thermal shock. Packages have been qualified withstand peak temperature 260°C seconds. Verify that profile will expose device beyond these limits.
Peak Melting point 218°C
properly designed solder screen stencil required ensure optimum amount solder paste deposited onto pads. recommended stencil layout shown Figure 15b. stencil solder paste deposition opening approximately pad. Reducing stencil opening potentially generate more voids underneath. other hand, stencil openings larger than 100% will lead excessive solder paste smear bridging across pads. Considering fact that solder paste thickness will directly affect quality solder joint, good choice laser stencil composed 0.127mm mils) thick stainless steel which capable producing required fine stencil outline. most commonly used solder reflow method accomplished belt furnace using convection heat transfer. suggested reflow profile automated reflow processes shown Figure This profile designed ensure reliable finished joints. However, profile indicated Figure will vary among different solder pastes from different manufacturers shown here reference only.
AMMP-6425 Part Number Ordering Information
Part Number AMMP-6425-BLKG AMMP-6425-TR1G Devices Container Container Antistatic Reel Reel
Temp (°C)
Ramp Preheat Ramp Seconds
Cooling
AMMP-6425-TR2G
Figure Suggested Lead-Free Reflow Profile SnAgCu Solder Paste
Peak Melting point 218°C Temp (°C) Ramp Preheat Ramp Seconds Reflow Cooling
Package, Tape Reel, Ordering Information
0.114 (2.90) 0.011 (0.28) 0.018 (0.46) 0.014 (0.365)
.200 [5.08]
AMMP XXXX YWWDNN
.200 [5.08]
0.016 (0.40)
0.126 (3.2)
0.059 (1.5) 0.100 (2.54)
0.012 (0.30)
0.029 (0.75) .075 [1.91] 0.016 (0.40) 0.028 (0.70) 0.100 (2.54) 0.93 (2.36)
FRONT VIEW Notes: Dimensions inches [milimeters] grounds must soldered Material rogers RO4350, 0.010" Thick
SIDE VIEW
BACK VIEW
DIMENSIONAL TOLERANCE BACK VIEW: 0.002" (0.05
4.00 0.10 NOTE 2.00 0.05
.011
1.55 0.05
0.50 TYP. 1.75 0.10 5.50 0.05
SECTION PITCH: WIDTH:
12.00 0.10
View
Side View
Dimensional Tolerances: 0.002" [0.05mm]
8.00 0.10
1.50 (MIN.)
Back View
0.30 0.05 SECTION
5.30 5.30 2.20 8.00 12.00
MIN. NOM. MAX. 5.20 5.30 5.40
5.20 5.30 5.40
2.10 2.20 2.30
Notes: measured above base pocket. Pitches cumulative tolerance Dimensions millimeters (mm).
AMMP XXXX
AMMP XXXX
XXXX
Names Contents Toxic Hazardous Substances Elements Products
Part Name Lead (Pb) (Pb) 100pF capacitor Mercury (Hg)
Toxic Hazardous Substances Elements Cadmium (Cd) Hexavalent (Cr(VI)) Cr(VI) Polybrominated biphenyl (PBB) Polybrominated diphenylether (PBDE) PBDE
indicates that content toxic hazardous substance homogeneous materials part below concentration limit requirement described SJ/T 11363-2006. indicates that content toxic hazardous substance least homogeneous material part exceeds concentration limit requirement described SJ/T 11363-2006. (The enterprise further explain technical reasons indicated portion table accordance with actual situations.) SJ/T 11363-2006 SJ/T 11363-2006
Note: RoHS compliant under exemption clause "lead electronic ceramic parts (e.g. piezoelectronic devices)"
product information complete list distributors, please site:
www.avagotech.com
Avago, Avago Technologies, logo trademarks Avago Technologies, Limited United States other countries. Data subject change. Copyright 2007 Avago Technologies Limited. rights reserved. AV02-0034EN August 2007
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