27-32 0.5W Power Amplifier Package AMMP-6430 MMIC broadband power
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AMMP-6430
27-32 0.5W Power Amplifier Package
AMMP-6430 MMIC broadband power amplifier surface mount package designed transmitters that operate various frequency bands between 27GHz 32GHz. 30GHz, provides 29dBm output power (P-1dB) 19dB small-signal gain from small easy-to-use device. device input output matching circuitry environments. AMMP-6430 also integrates temperature compensated power detection circuit that enables power detection 0.3V/W. bias simple device operates widely available current supply (negative voltage only needed Vg). fabricated PHEMT process exceptional power gain performance.
Features
Wide Frequency Range 27-32GHz Half watt output power match input output protection (50V 150V HBM) Specifications (Vd=5V, Idsq=650mA) Frequency range Small signal Gain 20dB Output power @P-1 27dBm (Typ.) Input/Output return-loss -10dB
Applications
Microwave Radio systems Satellite VSAT, Up/Down Link LMDS Pt-Pt Long Haul
Connections (Top View)
Function DET_O RF_out DET_R RF_in
Broadband Wireless Access (including 802.16 802.20 WiMax) MMDS loops Commercial grade military
Note: This MMIC uses depletion mode pHEMT devices. Negative supply used gate biasing.
PACKAGE BASE
Attention: Observe Precautions handling electrostatic sensitive devices. Machine Model (Class Human Body Model (Class 150V Refer Avago Application Note A004R: Electrostatic Discharge Damage Control.
RoHS-Exemption
Please refer Hazardous substances table page
Absolute Maximum Ratings
Symbol Tch, Tstg Tmax Parameters Positive Supply Voltage Gate Supply Voltage Drain Current Power Dissipation Input Power Maximum Operating Channel Temp. Storage Case Temp. Maximum Assembly Temp max) Units Value +155 +155 +260 Notes
Notes: Operation excess these conditions result permanent damage this device. Combinations supply voltage, drain current, input power, output power shall exceed When operate this condition with base plate temperature median time failure (MTTF) significantly reduced. These ratings apply each individual Junction operating temperature will directly affect device MTTF. maximum life, recommended that junction temperatures maintained lowest possible levels.
Specifications/ Physical Properties
Symbol Parameters Test Conditions Drain Supply Current (Vd=5 Typical) Gate Supply Operating Voltage (Id(Q) (mA)) Thermal Resistance[6] (Channel-to-Base Plate) Channel Temperature Units °C/W Value -1.1 16.8 139.6
Notes: Assume SnPb soldering evaluation board base plate temperatures. Worst case saturated output power when power consumption rises 5.24W with 0.9W power delivered load. Power dissipation 4.34W temperature rise channel 72.9 this condition, base plate temperature must remained below 82.1 maintain maximum operating channel temperature below
AMMP-6430 Specifications
25°C, =650 -1.1V, Zo=50 Symbol Freq Gain P-1dB OIP3 RLin RLout Isolation Parameters Test Conditions Operational Frequency Small-signal Gain[3, Freq Output Power 1dB[3] Gain Compression Output Third Order Intercept Point Input Return Loss Output Return Loss Reverse Isolation Units Minimum Typical Maximum
Notes: Small/Large -signal data measured packaged form 2.4-mm connecter based evaluation board 25°C. This final package part performance verified functional test correlated actual performance more frequencies Specifications derived from measurements test environment. Aspects amplifier performance improved over narrower bandwidth application additional conjugate, linearity, power matching. Pre-assembly into package performance verified 100% on-wafer published specifications Frequencies=27, 32GHz Gain P1dB tested 27GHz guaranteed with measurement accuracy gain ±1.6dB P1dB.
AMMP-6430 Typical Performance
(Data obtained from 2.4-mm connector based test fixture, this data including connecter loss, board loss.) 25°C, Vdd=5V, Idq=650mA, Vg=-1.1 Zout
S21[dB] S12[dB]
S11[dB] S22[dB]
Return Loss [dB]
S21[dB]
S12[dB]
Frequency [GHz]
Frequency [GHz]
Figure Typical Gain Reverse Isolation
Figure Typical Input Output Return Loss
P-1, [dBm], PAE[%] Po[dBm], and, PAE[%]
[dBm] Pout(dBm) PAE[%] Id(total)
1300 1200 1100 1000
[mA]
PAE, @P-1 PAE, @P-3
Frequency[GHz]
Figure Typical
Figure Typical Pout, Ids, Freq=30GHz
IP3[dBm] Noise Figure [dB]
Frequency [GHz] Frequency [GHz]
Figure Typical (Third Order Intercept) @Pin=-20dBm
Figure Typical Noise Figure
0.35
S22_20 S22_-40 S22_85 Det_R Det_O S22[dB]
0.25 Det_R Det_O 0.15 0.05 Pout[dBm]
0.01
0.001
Frequency[GHz]
Figure Typical Detector voltage Output Power @30GHz
S11_20 S11_-40 S11_85
Figure Typical over temperature
S11[dB]
[dBm] Frequency [GHz] P-1_85de P-1_20de P-1_-40deg
Frequency[GHz]
Figure Typical over temperature
Figure Typical over temperature
S21_20 S21_-40 S21[dB] S21_85
Frequency[GHz]
Figure Typical Gain over temperature
Typical Scattering Parameters
25°C, Zout Freq [GHz] -0.077 -0.244 -0.507 -0.857 -1.286 -1.834 -2.497 -3.218 -3.952 -4.734 -5.372 -5.892 -6.334 -6.785 -7.246 -7.822 -8.056 -8.011 -8.003 -8.086 -10.147 -10.495 -12.051 -15.378 -16.652 -17.111 -23.026 -20.256 -14.571 -13.363 -11.814 -10.715 -10.889 -11.417 -12.098 -11.897 -11.125 -10.020 -9.222 -8.609 -8.175 -7.588 -7.587 -7.506 -7.332 0.991 0.972 0.943 0.906 0.862 0.810 0.750 0.690 0.634 0.580 0.539 0.507 0.482 0.458 0.434 0.406 0.396 0.398 0.398 0.394 0.311 0.299 0.250 0.170 0.147 0.139 0.071 0.097 0.187 0.215 0.257 0.291 0.285 0.269 0.248 0.254 0.278 0.316 0.346 0.371 0.390 0.417 0.417 0.421 0.430 Phase -30.672 -61.135 -91.481 -121.770 -152.370 176.860 146.160 115.480 84.820 54.869 26.213 -1.577 -28.136 -52.977 -75.942 -95.873 -113.940 -130.700 -150.530 -172.380 160.910 156.560 132.580 122.010 127.100 113.670 100.620 166.160 152.630 128.640 107.980 83.770 65.105 41.069 36.792 24.365 13.967 -0.758 -16.019 -32.089 -47.230 -62.593 -78.246 -89.361 -101.290 -60.460 -52.134 -55.059 -62.791 -43.769 -43.125 -47.710 -50.926 -48.273 -47.156 -46.361 -49.213 -43.321 -49.276 -48.968 -50.759 -31.831 -19.650 -8.565 2.944 16.205 19.584 19.712 20.404 20.339 19.880 20.040 20.218 20.087 19.761 19.830 19.352 18.619 18.093 15.162 7.101 -0.825 -7.753 -13.812 -19.209 -24.340 -29.416 -34.254 -38.657 -43.475 0.001 0.002 0.002 0.001 0.006 0.007 0.004 0.003 0.004 0.004 0.005 0.003 0.007 0.003 0.004 0.003 0.026 0.104 0.373 1.404 6.460 9.533 9.674 10.476 10.398 9.862 10.046 10.255 10.100 9.729 9.807 9.282 8.531 8.028 5.730 2.265 0.909 0.410 0.204 0.110 0.061 0.034 0.019 0.012 0.007 Phase 156.200 7.598 -178.810 135.030 72.309 -55.096 -138.310 167.090 127.030 82.462 37.278 16.009 -18.990 -50.499 -66.480 79.915 37.293 -11.371 -65.975 -130.730 130.360 -6.027 -99.417 174.220 91.597 16.978 -54.022 -128.560 157.600 85.669 10.808 -68.718 -150.100 124.500 14.850 -75.509 -142.060 161.700 110.760 62.155 13.948 -31.372 -72.562 -112.560 -145.910 -81.678 -79.982 -78.816 -73.965 -66.459 -61.854 -59.371 -58.859 -51.689 -49.760 -47.391 -48.433 -47.536 -50.113 -47.510 -49.051 -53.232 -54.404 -52.389 -45.317 -44.518 -44.477 -44.466 -44.254 -44.452 -44.351 -45.333 -52.770 -49.161 -57.520 -86.823 -58.807 -62.898 -51.835 -52.719 -58.568 -57.430 -52.497 -56.625 -55.294 -56.805 -57.472 -64.193 -69.135 -60.759 8.24E-05 1.00E-04 1.15E-04 2.00E-04 4.75E-04 8.08E-04 1.08E-03 1.14E-03 2.60E-03 3.25E-03 4.27E-03 3.79E-03 4.20E-03 3.12E-03 4.21E-03 3.53E-03 2.18E-03 1.90E-03 2.40E-03 5.42E-03 5.94E-03 5.97E-03 5.98E-03 6.13E-03 5.99E-03 6.06E-03 5.41E-03 2.30E-03 3.48E-03 1.33E-03 4.56E-05 1.15E-03 7.16E-04 2.56E-03 2.31E-03 1.18E-03 1.34E-03 2.37E-03 1.47E-03 1.72E-03 1.44E-03 1.34E-03 6.17E-04 3.49E-04 9.16E-04 Phase 13.553 -1.433 -26.240 -79.414 -89.529 -141.380 -174.860 151.750 128.260 76.311 33.764 -0.070 -31.732 -62.027 -80.734 -117.620 -135.710 -136.240 -100.790 -135.360 179.470 146.120 129.370 102.170 63.925 36.998 1.733 -49.664 -75.571 15.834 -92.886 -82.154 92.036 -4.332 -115.640 -48.164 -124.980 -154.340 116.090 91.256 1.705 -87.233 -136.190 -109.180 -29.843 -0.075 -0.218 -0.450 -0.847 -1.465 -1.593 -2.056 -2.614 -3.234 -3.919 -4.545 -5.413 -4.738 -4.740 -5.196 -5.850 -6.891 -8.605 -11.491 -15.971 -32.906 -18.247 -18.242 -17.689 -18.009 -19.138 -23.261 -18.834 -15.869 -15.535 -14.211 -13.484 -14.452 -15.301 -12.933 -12.205 -12.066 -11.605 -11.065 -10.402 -9.889 -9.293 -8.532 -7.654 -7.062 0.991 0.975 0.949 0.907 0.845 0.832 0.789 0.740 0.689 0.637 0.593 0.536 0.580 0.579 0.550 0.510 0.452 0.371 0.266 0.159 0.023 0.122 0.122 0.130 0.126 0.110 0.069 0.114 0.161 0.167 0.195 0.212 0.189 0.172 0.226 0.245 0.249 0.263 0.280 0.302 0.320 0.343 0.374 0.414 0.444 Phase -31.001 -61.826 -92.759 -123.780 -152.600 177.570 145.900 114.510 82.673 51.597 21.330 -7.654 -29.552 -63.489 -93.519 -122.580 -151.530 179.660 151.610 128.630 80.680 -170.070 169.400 159.240 147.290 134.330 137.140 161.640 147.670 128.380 109.870 82.184 72.563 53.869 56.976 32.346 15.583 0.967 -12.574 -26.857 -40.144 -52.531 -64.211 -77.188 -90.938
Note: Data obtained from 2.4-mm connecter based module, this data including connecter loss, board loss.
AMMP-6430 Application Usage
Recommended quiescent bias condition optimum power linearity performances Vd=5 volts with (-1.1V) Id=650 Minor improvements performance possible depending application. drain bias voltage range single gate supply connected will bias gain stages. Muting accomplished setting pinch-off voltage simplified schematic AMMP6430 MMIC shown Figure MMIC contains over voltage protection diodes terminals. package diagram recommended assembly shown Figure finalized package form, diodes protect possible over voltage damages between ground, Vdd, ground. Typical diode current versus diode voltage 11connected diodes series shown Figure Under recommended quiescent biasing condition Vds=5V, Ids=650mA, Vgg=-1V, typical gate terminal current approximately 0.3mA. active biasing technique selected AMMP6430 MMIC biasing, active biasing circuit must have more than 10-times higher internal current that gate terminal current. optional output power detector network also provided. differential voltage between Det-Ref Det-Out pads correlated with power emerging from output port. detected voltage given
where Vref voltage DET_R port, Vdet voltage DET_0 port, Vofs zero-inputpower offset voltage. There three methods calculate Vofs Vofs measured before each detector measurement removing switching power source measuring Vref Vdet). This method gives error temperature drift less than 0.01dB/50°C. Vofs measured single reference temperature. drift error will less than 0.25dB. Vofs either characterized over temperature stored lookup table, measured temperatures linear used calculate Vofs temperature. This method gives error close method ports coupled input first stage output final stage. ground wired needed since ground connections made with plated through-holes backside device.
DET_R
DET_O
RFout
Three stage 0.5W power amplifier
Figure Simplified schematic MMIC
DET_O
Input
Output
DET_R
Function DET_O RF_out DET_R RF_in
Figure Typical connection
Diode Current [mA] Voltage
|Icomp(I_METER.AMP1,0)| (mA) Diode_current
Figure Typical diode current versus diode voltage 11-connected diodes series
Figure 15a. Suggested Land Pattern Stencil Layout
Ground vias should solder filled
Figure 15b. Land Pattern Stencil Layouts
Figure 15c. Stencil Outline Drawing(mm)
AMMP Packaged Devices compatible with high volume surface mount assembly processes. material mounting pattern, defined data sheet, optimizes performance strongly recommended. electronic drawing land pattern available upon request from Avago Sales Application Engineering.
Manual Assembly
Follow precautions while handling packages. Handling should along edges with tweezers. Recommended attachment conductive solder paste. Please recommended solder reflow profile. Neither Conductive epoxy hand soldering recommended. Apply solder paste using stencil printer placement. volume solder paste will dependent component layout should controlled ensure consistent mechanical electrical performance. Follow solder paste vendor's recommendations when developing solder reflow profile. standard profile will have steady ramp from room temperature pre-heat temp. avoid damage thermal shock. Packages have been qualified withstand peak temperature 260°C seconds. Verify that profile will expose device beyond these limits.
Peak Melting point 218°C
properly designed solder screen stencil required ensure optimum amount solder paste deposited onto pads. recommended stencil layout shown Figure 15b. stencil solder paste deposition opening approximately pad. Reducing stencil opening potentially generate more voids underneath. other hand, stencil openings larger than 100% will lead excessive solder paste smear bridging across pads. Considering fact that solder paste thickness will directly affect quality solder joint, good choice laser stencil composed 0.127mm mils) thick stainless steel which capable producing required fine stencil outline. most commonly used solder reflow method accomplished belt furnace using convection heat transfer. suggested reflow profile automated reflow processes shown Figure This profile designed ensure reliable finished joints. However, profile indicated Figure will vary among different solder pastes from different manufacturers shown here reference only.
AMMP-6430 Part Number Ordering Information
Part Number AMMP-6430-BLKG AMMP-6430-TR1G Devices Container Container Antistatic Reel Reel
Temp (°C)
Ramp Preheat Ramp Seconds
Cooling
AMMP-6430-TR2G
Figure Suggested Lead-Free Reflow Profile SnAgCu Solder Paste
Peak Melting point 218°C Temp (°C) Ramp Preheat Ramp Seconds Reflow Cooling
Package, Tape Reel, Ordering Information
0.114 (2.90) 0.011 (0.28) 0.018 (0.46) 0.014 (0.365)
.200 [5.08]
AMMP XXXX YWWDNN
.200 [5.08]
0.016 (0.40)
0.126 (3.2)
0.059 (1.5) 0.100 (2.54)
0.012 (0.30)
0.029 (0.75) .075 [1.91] 0.016 (0.40) 0.028 (0.70) 0.100 (2.54) 0.93 (2.36)
FRONT VIEW Notes: Dimensions inches [milimeters] grounds must soldered Material rogers RO4350, 0.010" Thick
SIDE VIEW
BACK VIEW
DIMENSIONAL TOLERANCE BACK VIEW: 0.002" (0.05
4.00 0.10 NOTE 2.00 0.05
.011
1.55 0.05
0.50 TYP. 1.75 0.10 5.50 0.05
SECTION PITCH: WIDTH:
12.00 0.10
View
Side View
Dimensional Tolerances: 0.002" [0.05mm]
8.00 0.10
1.50 (MIN.)
Back View
0.30 0.05 SECTION
5.30 5.30 2.20 8.00 12.00
MIN. NOM. MAX. 5.20 5.30 5.40
5.20 5.30 5.40
2.10 2.20 2.30
Notes: measured above base pocket. Pitches cumulative tolerance Dimensions millimeters (mm).
AMMP XXXX
AMMP XXXX
XXXX
Names Contents Toxic Hazardous Substances Elements Products
Part Name Lead (Pb) (Pb) 100pF capacitor Mercury (Hg)
Toxic Hazardous Substances Elements Cadmium (Cd) Hexavalent (Cr(VI)) Cr(VI) Polybrominated biphenyl (PBB) Polybrominated diphenylether (PBDE) PBDE
indicates that content toxic hazardous substance homogeneous materials part below concentration limit requirement described SJ/T 11363-2006. indicates that content toxic hazardous substance least homogeneous material part exceeds concentration limit requirement described SJ/T 11363-2006. (The enterprise further explain technical reasons indicated portion table accordance with actual situations.) SJ/T 11363-2006 SJ/T 11363-2006
Note: RoHS compliant under exemption clause "lead electronic ceramic parts (e.g. piezoelectronic devices)"
product information complete list distributors, please site:
www.avagotech.com
Avago, Avago Technologies, logo trademarks Avago Technologies, Limited United States other countries. Data subject change. Copyright 2007 Avago Technologies Limited. rights reserved. AV02-0623EN August 2007
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