Chip Size: 1900 (74.8 31.5 mils) Chip Size Tolerance: mils) Chip Thick

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Chip Size: 1900 (74.8 31.5 mils) Chip Size Tolerance: mils) Chip Thick

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AMMC-6233 GaAs Noise Amplifier
Chip Size: 1900 (74.8 31.5 mils) Chip Size Tolerance: mils) Chip Thickness: mils) Dimensions: (4.33 3.54 mils) Dimensions: (3.94 3.94 mils)
Avago Technologies' AMMC-6233 high gain, lownoise amplifier that operates from GHz. This provides wide-band solution system design since covers several bands, thus, reduces part inventory. device input output match Ohm, unconditionally stable used either primary sub-sequential noise gain stage. eliminating complex tuning assembly processes typically required hybrid (discrete- FET) amplifiers, AMMC-6233 cost-effective alternative communications receivers. backside chip both ground. This helps simplify assembly process reduces assembly related performance variations costs. fabricated PHEMT process provide exceptional noise gain performance. improved reliability moisture protection, passivated active areas.
Features
Integrated block choke input output match Single positive supply negative gate bias
Specifications
frequencies: Small-signal gain: gain flatness: Typical noise figure: Typical output IP3:
Applications
Microwave radio systems Satellite VSAT, up/down link LMDS Pt-Pt long haul Broadband wireless access (including 802.16 802.20 WiMax) MMDS loops Commercial grade military
Attention: Observe precautions handling electrostatic sensitive devices. Machine Model (Class Human Body Model (Class Refer Avago Technologies Application Note A004R: Electrostatic Discharge, Damage Control. Note: This MMIC uses depletion mode pHEMT devices.
Absolute Maximum Ratings[1]
Symbol Tstg Tmax Parameters/Condition Drain Ground Voltage Drain Current Input Power Channel Temperature Storage Temperature Maximum Assembly Temperature Unit +150 +150
Note: Operation excess these conditions result permanent damage this device. absolute maximum ratings were determined ambient temperature 25°C unless noted otherwise.
Specifications/ Physical Properties[2]
Symbol Parameter Test Condition Drain Current Under Power Drive Temp.] (Vdd Drain Supply Voltage Thermal Resistance[3] Unit Min. Typ. Max.
Notes: Ambient operational temperature 25°C unless noted Channel-to-backside Thermal Resistance (Tchannel 34°C) measured using infrared microscopy. Thermal Resistance backside temp. (Tb) 25°C calculated from measured data.
AMMC-6233 Specifications[4]
Symbol Gain RLin RLout P-1dB OIP3
25°C, Parameters Test Conditions Small Signal Gain Noise Figure into 50W(5) Input Return Loss Output Return Loss Isolation Output Power 1dB(7) Gain Compression Output Third Order Intercept Point Frequencies (GHz) Units Minimum Typical Maximum
Notes: tested parameters guaranteed with measurement accuracy +/-0.5 range, ±0.75 range ±1.0 range. measured on-wafer. Additional bond wires (~0.2 input could improve some frequencies.
AMMC-6233 Typical Performances 25°C, Itotal Zout unless otherwise stated)
(dB)
(dB)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Typical gain
Figure Typical noise figure
(dB)
OIP3, OP1dB (dBm)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Typical input return loss
Figure Typical output P-1dB
AMMC-6233 Typical Performances (Cont'd.) 25°C, Itotal Zout unless otherwise stated)
TOTAL (mA) (dB)
-40°C 25°C +85°C
FREQUENCY (GHz)
Figure Typical output return loss
Figure Total over temp
OIP3 (dBm)
(dB)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Typical isolation
Figure Typical output over
AMMC-6233 Typical Performances (Cont'd.) 25°C, Itotal Zout unless otherwise stated)
(dB) (dB)
-40°C 25°C +85°C
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Typical gain over
Figure Typical gain over temp
(dB) (dB) -40°C 25°C +85°C FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Typical input return loss over
Figure Typical input return loss over temp
AMMC-6233 Typical Performances (Cont'd.) 25°C, Itotal Zout unless otherwise stated)
(dB) (dB) -40°C 25°C +85°C
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Typical output return loss over Vdd.
Figure Typical output return loss over temp
-40°C 25°C +85°C
(dB)
(dB)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Typical noise figure over temp
Figure Typical noise figure over
AMMC-6233 Typical Scattering Parameters[1] =25°C, Itotal Zout
Freq 11.0 12.0 13.0 14.0 15.0 16.0 16.5 17.0 17.5 18.0 18.5 19.0 19.5 20.0 20.5 21.0 21.5 22.0 22.5 23.0 23.5 24.0 24.5 25.0 25.5 26.0 26.5 27.0 27.5 28.0 28.5 29.0 29.5 30.0 30.5 31.0 32.0 33.0 34.0 35.0 36.0 37.0 38.0 39.0 40.0 41.0 42.0 43.0 44.0 45.0 -2.349 -2.831 -3.639 -5.257 -6.821 -7.539 -7.710 -7.877 -8.056 -8.257 -8.550 -8.930 -9.468 -10.225 -11.199 -12.517 -13.985 -15.874 -18.042 -20.351 -22.137 -23.285 -22.352 -21.654 -20.587 -19.773 -19.259 -18.703 -18.131 -17.558 -17.404 -16.833 -16.271 -15.911 -14.929 -13.954 -11.832 -9.663 -7.410 -5.356 -3.519 -2.278 -1.616 -1.284 -1.152 -1.103 -1.070 -1.005 -0.993 -0.979 0.763049 0.721884 0.657746 0.545917 0.456007 0.419825 0.411613 0.403773 0.395568 0.38648 0.373666 0.357671 0.336199 0.308143 0.275453 0.236673 0.199868 0.160798 0.125292 0.096035 0.078186 0.068506 0.076278 0.082658 0.09346 0.102644 0.108911 0.11611 0.124012 0.132469 0.134829 0.143999 0.153616 0.160113 0.179283 0.200581 0.2561 0.328738 0.426065 0.539757 0.666862 0.769282 0.830255 0.862564 0.875805 0.880774 0.88412 0.890776 0.891989 0.893391 Phase 94.09268 60.39973 22.62143 -15.0803 -45.926 -73.1573 -86.6582 -100.097 -113.442 -126.65 -139.685 -152.21 -164.843 -177.034 171.1243 160.4605 151.4995 144.5777 141.0916 144.2364 152.7016 167.6592 179.2708 -175.165 -171.845 -173.525 -173.001 -173.338 -173.508 -174.581 -175.139 -173.619 -174.645 -173.134 -172.407 -173.323 -174.736 179.3253 170.2477 157.4976 142.1866 125.7972 108.3899 92.95263 79.81563 67.52757 56.2657 46.2681 36.48963 27.17473 -1.489 6.597 12.838 16.445 17.826 18.620 19.031 19.461 19.904 20.378 20.826 21.278 21.692 22.032 22.316 22.520 22.655 22.746 22.780 22.812 22.818 22.786 22.841 22.830 22.842 22.820 22.782 22.734 22.719 22.708 22.630 22.560 22.463 22.300 22.113 21.922 21.483 20.986 20.404 19.675 18.300 15.919 12.714 8.852 4.733 0.380 -4.296 -9.511 -15.870 -23.877 0.842446 2.137292 4.384324 6.641446 7.785794 8.531229 8.944062 9.397838 9.890278 10.44466 10.99711 11.58536 12.15078 12.63514 13.05575 13.36524 13.57596 13.71832 13.77231 13.8222 13.83284 13.78216 13.86875 13.85124 13.87022 13.83515 13.77483 13.69857 13.6757 13.65816 13.5361 13.42741 13.27896 13.03121 12.75443 12.47648 11.86206 11.2019 10.47666 9.632708 8.222064 6.250824 4.322148 2.770862 1.724376 1.044766 0.609794 0.334545 0.160872 0.063995 Phase -21.3333 -102.78 178.5468 99.76884 31.45928 -25.575 -51.443 -76.2203 -100.232 -123.672 -146.836 -169.714 167.3367 144.6769 122.1392 100.0025 78.2942 56.85629 36.2191 15.9253 -3.81822 -23.2519 -42.6854 -61.923 -80.8688 -99.8029 -118.619 -137.271 -155.791 -174.496 166.5557 147.7949 128.8982 109.84 91.30458 72.76954 35.36896 -2.39273 -41.0669 -82.6699 -126.39 -170.91 147.8419 111.5034 79.74362 51.4617 26.8078 6.071765 -7.61507 3.187742 -70.874 -78.885 -67.000 -73.434 -66.470 -58.581 -65.814 -64.611 -66.021 -62.064 -64.114 -58.746 -57.575 -54.947 -55.050 -54.209 -56.478 -52.655 -53.353 -52.574 -53.815 -52.498 -53.705 -52.363 -51.790 -51.138 -50.854 -51.453 -53.056 -52.152 -51.597 -51.989 -52.041 -49.936 -50.458 -51.970 -51.657 -51.701 -51.720 -54.688 -54.425 -62.812 -52.522 -59.931 -55.859 -55.953 -58.313 -54.001 -55.336 -55.849 0.000286 0.000114 0.000447 0.000213 0.000475 0.001178 0.000512 0.000588 0.0005 0.000788 0.000623 0.001155 0.001322 0.001789 0.001768 0.001948 0.0015 0.002329 0.002149 0.002351 0.002038 0.002372 0.002064 0.002409 0.002573 0.002774 0.002866 0.002675 0.002224 0.002468 0.002631 0.002515 0.0025 0.003186 0.003 0.002521 0.002613 0.0026 0.002594 0.001843 0.0019 0.000723 0.002365 0.001008 0.001611 0.001594 0.001214 0.001995 0.001711 0.001613 Phase 69.51336 106.1791 96.14425 -168.964 -166.65 164.3204 144.8339 139.3233 142.2024 140.5163 90.2394 135.5786 131.7732 117.8577 112.1715 97.05257 97.55393 86.87749 76.84304 73.4899 67.95007 58.91645 55.72765 50.50487 46.10271 32.01681 31.28349 23.96313 23.95399 21.81781 9.25092 6.732967 11.57442 -1.98556 -6.96747 -26.8448 -26.1216 -37.1835 -44.8451 -51.2692 -68.6103 -113.482 -54.8753 -44.7734 -52.8287 -35.8358 -48.97 -88.8673 -39.9805 -93.3539 -6.574 -8.193 -9.985 -12.057 -13.990 -15.729 -16.451 -17.081 -17.788 -18.374 -19.008 -19.563 -19.836 -19.982 -20.024 -20.198 -20.360 -20.315 -20.662 -20.825 -20.829 -21.054 -21.106 -20.546 -20.410 -19.834 -19.341 -18.686 -18.194 -17.410 -16.296 -15.680 -14.995 -14.282 -13.978 -13.704 -13.293 -13.456 -13.941 -14.304 -13.970 -12.407 -11.194 -10.503 -10.042 -9.805 -9.700 -9.677 -9.675 -9.797 0.469123 0.389361 0.31676 0.249533 0.199762 0.163519 0.150471 0.139942 0.129002 0.120584 0.1121 0.105157 0.10191 0.100211 0.099719 0.097742 0.095938 0.09644 0.092666 0.090936 0.0909 0.088575 0.088044 0.093904 0.095388 0.101933 0.107879 0.116327 0.123119 0.134748 0.153171 0.164446 0.177937 0.193145 0.200034 0.206449 0.216445 0.21241 0.200884 0.192657 0.200223 0.239678 0.275602 0.298449 0.314688 0.323403 0.327323 0.32822 0.328278 0.323704 Phase 165.652 147.3224 128.8437 112.3379 98.40607 86.00244 80.85362 75.62067 70.78852 66.50803 63.06891 59.89891 57.89853 55.31375 52.913 48.15782 46.77354 43.96343 41.56831 39.68448 39.65156 37.36209 40.20195 40.9853 41.72367 43.50478 43.1206 42.91914 41.6739 41.67056 38.78395 35.35194 32.53478 27.05136 21.91237 17.35203 7.16786 -0.91524 -5.84805 -4.96141 -1.63464 -2.09342 -7.29699 -15.7192 -23.2788 -29.8824 -36.1307 -42.4137 -47.7329 -52.5319
Note: Data obtained from on-wafer measurements.
Biasing Operation
AMMC-6233 normally biased with positive supply connected both bond pads through 100pF bypass capacitor shown Figure recommended supply voltage important place bypass capacitor close possible. negative gate bias voltage needed AMMC6233. Input output 50-ohm match achieved on-chip; therefore other external component required input output. addition, input output DC-blocked with internal coupling capacitors. ground wires needed because ground connections made with plated through-holes backside device. Refer Absolute Maximum Ratings table allowed thermal conditions.
location bond pads shown Figure Note that input output ports Ground-Signal-Ground configuration. connections should kept short reasonable minimize performance degradation undesirable series inductance. single bond wire normally sufficient signal connections, however double bonding with gold wire gold mesh[2] recommended best performance, especially near high frequency band. Thermosonic wedge bonding preferred method wire attachment bond pads. Gold mesh attached using round tracking tool tool force approximately grams ultrasonic power roughly duration guided wedge untrasonic power level used wire. recommended wire bond stage temperature Caution should taken exceed Absolute Maximum Rating assembly temperature time. chip 100um thick should handled with care. This MMIC exposed bridges surface should handled edges with custom collet pick with vacuum center). This MMIC also static sensitive precautions should taken. Notes: Ablebond 84-1 silver epoxy recommended. Buckbee-Mears Corporation, Paul, 800-2623824.
Assembly Techniques
backside MMIC chip ground. microstrip applications chip should attached directly ground plane (e.g. circuit carrier heatsink) using electrically conductive epoxy.[1] best performance, topside MMIC should brought same height circuit surrounding This accomplished mounting gold plate metal shim (same length width MMIC) under chip which correct thickness make chip adjacent circuit same height. amount epoxy used chip and/or shim attachment should just enough provide thin fillet around bottom perimeter chip shim. ground plan should free residue that jeopardize electrical mechanical attachment.
Figure AMMC-6233 simplified schematic
1070
1410
RFIN
RFOUT
1810 1900
Figure AMMC-6233 bonding locations
CAPACITOR
SUPPLY
INPUT
AMMC-6233
OUTPUT
GOLD-PLATED SHIM (OPTIONAL)
Figure AMMC-6233 assembly diagram
product information complete list distributors, please website:
www.avagotech.com
Avago, Avago Technologies, logo trademarks Avago Technologies Limited United States other countries. Data subject change. Copyright 2007 Avago Technologies Limited. rights reserved. AV02-0312EN April 2007

Chip Size: 1900 (74.8 31.5 mils) Chip Size Tolerance: mils) Chip Thick

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