Power Amplifier Package AMMP-6408 MMIC broadband power from small

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Power Amplifier Package AMMP-6408 MMIC broadband power from small

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AMMP-6408
Power Amplifier Package
AMMP-6408 MMIC broadband power from small easy-to-use device. This MMIC optimized point(OIP3)of38dBm.
Features
5x5mmSurfaceMountPackage Widefrequencyrange6-8GHz Highlylinear:OIP3=38dBm IntegratedRFpowerdetector ESDprotection(50VMM,and250VHBM) Inputportpartiallymatched optimum matching gain with additional matchingcircuit.)
Connections (Top View)
Specifications Idsq
Frequencyrange6to8GHz Smallsignalgainof8dB HighPower:@8GHz,P-dB=29dBm
Application
Microwaveradiosystems SatelliteVSAT,DBSUp/DownLink LMDS&Pt-PtmmWLongHaul Broadband wireless access (including 802.6 802.20WiMax) WLLandMMDSloops Commercialgrademilitary
FUNCTION DET_O RF_out DER_R RF_in
PACKAGE BASE
electrostaticsensitivedevices. ESDMachineModel(ClassA) ESDHumanBodyModel(ClassA) A004R: Electrostatic Discharge, Damage Control. devices. Negative supply used gatebiasing.
Absolute Maximum Ratings[1]
Symbol Tch,max Tstg Tmax Parameters[1] PositiveSupplyVoltage GateSupplyVoltage DrainCurrent PowerDissipation CWInputPower StorageCaseTemperature MaximumAssemblyTemp(20sec.max.) Units Value -3to0.5 -65to+55 +260 Notes note2
note2,3 note2 note4,5
Notes: Junction operating temperature will directly affect device MTTF. maximum life, recommended that junction temperatures
Specifications/Physical Properties
Symbol Rqjc Parameters Test Conditions ChannelTemperature Units °C/W Value 50.6
Note:
Specifications[1,2,3,4]
Symbol Freq. Gain P-dB P-3dB OIP3 RLin RLout Isolation
TA=25°C,Vd=5V,Id(Q)=650mA,Zo=50 Parameters Test Conditions OperationalFrequency Small-SignalGainS2[3,4] OutputPoweratdB[3] GainCompression[2] ThirdOrderInterceptPoint; f=00MHz;Pin=-20dBm InputReturnLoss[2] OutputReturnLoss[2] ReverseIsolation Units Minimum 7.5(@Freq=8GHz) 5.5(@Freq=7GHz) 28(@Freq=8GHz) 27(@Freq=7GHz) Typical 28.5 29.5 Maximum
Notes:
Typical Performances (Data Obtained from 3.5-mm Connector Based Test Fixture, This Data Including Connecter Loss, Board Loss.)
(dB) (dB) (dB)
RETURN LOSS (dB) (dB)
(dB) (dB)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Typical gain reverse isolation
Figure Typical return loss (input output)
(dBm), (dBm), NOISE FIGURE (dB) (dBm) (dBm)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Typical output power (@P-1, P-3) frequency
Figure Typical noise figure
(dBm) (dBm) Pout (dBm) (TOTAL)
1000
LEVEL (dBc) (mA)
FREQUENCY (GHz)
Figure Typical output power, PAE, total drain current versus input power
Figure Typical level frequency output single carrier level (SCL)
(dBc) (dBc) (mA)
(dBc) (mA)
(dBc) (mA)
(mA) (mA) (mA)
(dBm)
(dBm)
Figure Typical level single carrier output level
Figure Typical level single carrier output level
(dBc) (dBc) (mA)
(dBc) (mA)
(dBc) (mA)
(dBm)
(dBm)
Figure Typical level single carrier output level
Figure Typical level single carrier output level
(dBc) (dBc) (mA)
(dBc) (mA)
(dBc) (mA)
(dBm)
(dBm)
Figure Typical level single carrier output level
Figure Typical level single carrier output level
S11_20 S11_-40 S11_85
(dB)
(dB)
S21_20 S21_-40 S21_85
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Typical over temperature
Figure Typical gain over temperature
S22_20 S22_-40 S22_85
(dBm)
(dB)
P-1_85 P-1_20 P-1_-40
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Typical over temperature
Figure Typical over temperature
Typical Scattering Parameters [1],
Freq [GHz] -3.83 -4.33 -4.35 -2.87 -2.18 -1.88 -2.85 -5.02 -6.38 -6.79 -8.64 -14.40 -4.82 -3.86 -19.84 -4.51 -1.76 -1.30 -1.04 -0.57 -0.12 0.64 0.61 0.61 0.72 0.78 0.81 0.72 0.56 0.48 0.46 0.37 0.19 0.57 0.64 0.10 0.60 0.82 0.86 0.89 0.94 0.99 Phase -7.36 -37.59 -57.25 -67.80 -81.97 -99.66 -125.26 -151.04 -177.19 167.29 129.42 34.52 -87.84 -142.34 171.38 -70.79 -104.56 -129.94 -159.31 176.91 158.94 18.46 22.06 21.82 20.57 19.45 19.28 20.24 20.41 19.28 18.74 19.07 19.99 18.06 9.17 -6.42 -16.88 -24.20 -33.63 -42.07 -50.13 -44.39 8.37 12.67 12.33 10.67 9.38 9.21 10.27 10.49 9.20 8.65 8.98 9.99 7.99 2.88 0.48 0.14 0.06 0.02 0.01 0.00 0.01 Phase -45.38 -160.68 105.82 30.27 -34.10 -91.39 -154.70 130.30 56.72 -8.92 -83.27 -174.68 61.47 -58.13 -160.84 -164.95 137.84 69.70 -90.70 109.52 -58.10 -49.36 -47.90 -55.02 -58.31 -56.32 -50.78 -48.77 -45.72 -45.56 -46.62 -47.25 -45.92 -42.49 -50.94 -39.18 -42.22 -64.23 -46.41 -41.89 -50.58 -41.20 3.41E-03 4.03E-03 1.78E-03 1.21E-03 1.53E-03 2.89E-03 3.64E-03 5.17E-03 5.27E-03 4.67E-03 4.34E-03 5.06E-03 7.50E-03 2.84E-03 1.10E-02 7.74E-03 6.15E-04 4.78E-03 8.05E-03 2.96E-03 8.71E-03 Phase 59.85 -10.90 -87.02 155.08 87.15 36.92 5.73 -42.89 -90.74 -134.99 -179.47 31.89 -86.04 -115.71 -92.64 -168.17 172.50 -96.28 -130.89 122.04 -50.18 -9.89 -24.54 -12.59 -11.66 -9.47 -8.10 -8.11 -5.74 -5.64 -6.02 -8.44 -12.65 -12.88 -5.42 -6.15 -2.48 -1.13 -1.28 -1.01 -0.82 -0.33 0.32 0.06 0.23 0.26 0.34 0.39 0.39 0.52 0.52 0.50 0.38 0.23 0.23 0.54 0.49 0.75 0.88 0.86 0.89 0.91 0.96 Phase -112.35 -97.72 -116.00 -123.36 -111.81 -107.66 -96.60 -95.19 -116.87 -158.25 163.63 142.26 -156.34 127.81 -6.31 -89.99 -122.31 -144.94 -164.03 173.03 155.22
Note:
Biasing Operation
recommended quiescent bias condition optimum efficiency, performance, reliability Vdd=5 volts with Idd=650mA. Minor stages. Muting accomplished settingVgg thepinch-offvoltageVp. simplified schematic AMMP6408 MMIC diagram recommended assembly shown diode current versus diode voltage -connected quiescent biasing condition Vds=5V, Ids=650mA,Vgg=-V, typical gate terminal current approximately 0.3mA. active biasing technique selected AMMP6408 MMIC biasing, active biasing circuit must have more than 0-times V=(Vref Vdet)-Vofs whereVref isthevoltageattheDET _Rport,VdetisavoltageattheDET andmeasuringVref Vdet).Thismethodgivesanerror themethod#. stage output final stage. ground wired needed since ground connections made with plated through-holes backside device.
DET_O
RFIN RFOUT
DET_R
Figure Simplified schematic MMIC
DET_O
INPUT
OUTPUT
DET_R FUNCTION DET_O RF_out DER_R RF_in
-0.8
Figure Schematic recommended assemble example
DIODE CURRENT (mA) VOLTAGE |Icomp (I_METER.AMP1.0)| (mA) Diode_current DET_R DET_O
0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 Pout (dBm)
0.01
Figure Typical diode current versus diode voltage 11connected diodes series
Figure Typical detector voltage output power, freq.
DET_R DET_O
Recommended Attachment Package
material mounting pattern, defined recommended. electronic drawing land pattern available upon request from Avago Sales ApplicationEngineering.
Figure Suggested Land Pattern Stencil Layout
Figure Stencil Outline Drawing (mm)
Figure Combined Stencil Layouts
Manual Assembly Recommended attachment conductive solder Apply solder paste using stencil printer component layout should Follow solder paste vendor's recommendations when developing solder reflow profile. standard profile will have steady ramp from room temperature pre-heat temp. avoid damage duetothermalshock. Packages have been qualified withstand peak temperature 260°C seconds.Verify that
TEMPERATURE (°C) RAMP PREHEAT RAMP TIME (SECONDS) REFLOW COOLING PEAK MELTING POINT 218°C
onto pads. recommended stencil layout shown Figure stencil solder paste deposition opening approximately pad. Reducing stencil opening potentially generate more voids underneath. other hand, stencil openings larger than will lead pads. Considering fact that solder paste thickness will directly affect quality solder joint, good choice laser stencil composed most commonly used solder reflow method accomplished belt furnace using convection heat transfer. suggested reflow profile automated reflow processes shown Figure This profile profile indicated Figure will vary among different hereforreferenceonly.
Ordering Information AMMP-6408 Part Number Ordering Information
Part Number AMMP-6408-BLKG AMMP-6408-TRG AMMP-6408-TR2G Devices Container Container Antistaticbag 7"Reel 7"Reel
Figure Suggested lead-free reflow profile SnAgCu solder paste
Package Dimensions
0.011 (0.28)
0.114 (2.90) 0.018 (0.46)
0.014 (0.365)
AMMP XXXX YWWDNN
0.016 (0.40)
0.126 (3.2)
0.059 (1.5)
0.100 (2.54) 0.029 (0.75) 0.016 (0.40)
0.012 (0.30)
0.028 (0.70) 0.100 (2.54) 0.93 (2.36)
FRONT VIEW
SYMBOL MIN. 0.198 (5.03) 0.0685 (1.74)
SIDE VIEW
MAX. 0.213 (5.4) 0.088 (2.25)
DIMENSIONAL TOLERANCE: 0.002" (0.05
DIMENSIONS INCHES (MM)
BACK VIEW
Carrier Tape Pocket Dimensions
AMMP XXXX AMMP XXXX AMMP XXXX
4.00 0.10 NOTE 2.00 0.05 1.55 0.05 0.50 TYP. 1.75 0.10 5.50 0.05 SECTION PITCH: WIDTH: 5.30 5.30 2.20 8.00 12.00 MIN. 5.20 NOM. 5.30 MAX. 5.40 5.20 5.30 5.40 2.10 2.20 2.30 12.00 0.10
8.00 0.10
1.50 (MIN.)
0.30 0.05 SECTION NOTES: MEASURED ABOVE BASE POCKET. PITCHES CUMULATIVE TOLERANCE DIMENSIONS MILLIMETERS (mm).
Note: performance degradation seen MM.The characteristics general show increased protocols.
product information complete list distributors, please website:
www.avagotech.com
Avago, Avago Technologies, logo trademarks Avago Technologies Limited United States other countries. Data subject change. Copyright 2007 Avago Technologies Limited. rights reserved. AV02-0243EN June 2007

Power Amplifier Package AMMP-6408 MMIC broadband power from small

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